Japanese measurement leader Horiba Ltd., active in Taiwan for nearly 30 years, has opened a new Application and Solutions Platform (ASP) instrumentation lab at its Hsinchu headquarters...

Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...

Samsung Electronics has continued to demonstrate its resilience in its Taiwan operations in 2025, even in the face of tariffs, inflation, and geopolitical risks. The company saw sustained...

TSMC posted strong revenue growth in August 2025, recording approximately NT$335.77 billion (approx. US$11.03 billion). The result marks a 3.9% increase from July and a 33.8% rise...

The semiconductor landscape has fundamentally shifted. As we move from 2025 to 2026, three forces dominate global technology discourse: semiconductors, artificial intelligence, and...

Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...

Taiwan's traditional industries are facing operational pressures from US reciprocal tariffs. However, to encourage companies to invest in the next phase of growth, the Legislative...

Apple unveiled the iPhone 17, 17 Pro, 17 Pro Max, and the slimmer iPhone Air on September 9, 2025. The company kept prices steady in US dollars compared to 2024, reflecting a cautious...

At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...

The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...

SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the...

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...

Taiwan's Compal Electronics has announced a strategic collaboration with US-based ZutaCore, a leader in waterless direct chip liquid cooling, to bring transformative cooling technology...

At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...

Switzerland has unveiled Apertus, an open-source large language model created through collaboration between the Swiss Federal Institute of Technology in Lausanne (EPFL), the Swiss...