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Friday 4 September 2026
Acer wowed IFA with AI, gaming hardware
As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future...
Friday 4 September 2026
ENE Technology eyes 4Q26 drone scale-up with satellite link
Microcontroller maker ENE Technology is pushing into the drone market by integrating resources from other group companies and selling complete drone systems. The company expects volume...
Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027. Premier...
Friday 4 September 2026
Young Liu urges "Made with Taiwan" supply chain rethink

Foxconn chairman Young Liu on September 2 called on Taiwan's supply chain to shift from "Made in Taiwan" to "Made with Taiwan," saying...

Thursday 3 September 2026
CHPT spans wafer to system-level testing
Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
Thursday 3 September 2026
Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty
Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense...
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
Thursday 3 September 2026
Semiconductor sustainability shifts to cost control as fab resource demand surges

Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
Thursday 3 September 2026
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

Thursday 3 September 2026
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...
Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
Thursday 3 September 2026
TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning
TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...
Thursday 3 September 2026
SK Hynix weighs Kioxia production tie-up in Japan
SK Group chairman Chey Tae-won has raised the possibility of jointly producing semiconductors with Japan's Kioxia, taking SK Hynix's exploration of a Japanese manufacturing base a...
Thursday 3 September 2026
Taiwan's supply chain is 'one of a kind,' MediaTek CEO says
MediaTek CEO Rick Tsai said Taiwan's supply-chain capabilities are unmatched as the technology industry moves into the AI and robotics era, while joking that the chip designer will...