CONNECT WITH US
Thursday 5 June 2025
Samsung loses key US memory architect to SanDisk as chip race escalates
Jim Elliott, a veteran executive who spent over 20 years leading Samsung Electronics' memory operations in the US, has reportedly exited the company to join rival NAND flash provider SanDisk as Chief Revenue Officer (CRO), according to sources cited by South Korea's Financial News (Fnnews) and Asian Economic News Agency.
Thursday 5 June 2025
Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just three months. Industry analysts point to robust demand from key clients such as Micron Technology for maintenance services and component sales as the main driver behind the surge.
Thursday 5 June 2025
CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK Hynix. The company plans to deliver HBM3 samples by late 2025 and begin mass production in 2026, with HBM3E (fifth-generation) development set for 2027. As reported by The Financial News (Fnnews), CXMT has advanced its HBM2 production timeline from 2026 to mid-2025, signaling a faster-than-expected ramp-up.
Thursday 5 June 2025
Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for AI smartphones. The chip achieves 10.7 Gbps speeds and is Micron's first mobile product built with EUV lithography.
Wednesday 4 June 2025
Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is fueling optimism about a potential rebound in the HBM market. Spearheading this turnaround is Jun Young-hyun, CEO and head of the Device Solutions (DS) division, who returned in May 2024 and initiated a high-stakes redesign of Samsung's DRAM architecture to reverse recent setbacks.
Wednesday 4 June 2025
Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster their competitive edge in next-gen chip production. The companies have started implementing AI-based design solutions across advanced process nodes and memory products, reporting notable progress in efficiency and innovation.
Wednesday 4 June 2025
DDR4 Memory prices surge as chipmakers announce phase-out
Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory chipmakers are moving to phase out DDR4 DRAM, triggering a rapid spike in prices as supply constraints ripple through the market.
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics and SK Hynix—are leading this charge, combining deep R&D with strategic alliances to extend their technological edge. In contrast, China's DRAM challengers continue to be hampered by sanctions and capacity constraints. This article breaks down the market forces, innovation race, and geopolitical headwinds shaping the HBM landscape.
Wednesday 4 June 2025
Samsung executives visit Nvidia headquarters to secure HBM supply deal
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to South Korean media reports.
Tuesday 3 June 2025
Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs
In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics DRAM as a lower-bandwidth alternative to high-bandwidth memory (HBM), which falls under stricter US trade restrictions.
Tuesday 3 June 2025
SoftBank and Intel forge AI memory venture to challenge HBM dominance
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The new chip initiative could receive backing from the Japanese government and is part of a broader national effort to revitalize Japan's semiconductor ecosystem.
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly growing AI and high-performance computing markets. Equipment transfers are expected to begin as early as the second half of 2025.
Tuesday 3 June 2025
South Korean exports to the US and China fall sharply, but semiconductor sales hit record high

South Korea's exports to the US and China tumbled by more than 8% in May, reflecting growing pressures from global trade tensions and supply chain realignments. Despite the broader slump, the country posted record-breaking semiconductor exports for the month, offering a rare bright spot amid mounting economic uncertainties.

Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With SK Hynix and Samsung holding a combined 70% of DRAM and more than half the NAND market, the country anchors a supply chain vital for AI training and HPC workloads. A single disruption could trigger global price shocks and shortages, particularly in AI computing and mobile devices.

Monday 2 June 2025
Nanya targets 4Q25 profitability as DDR4 rivals exit
Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements in its 1B process technology, the company expects operational growth in volume and pricing in the second half of the year, aiming to return to profitability in the fourth quarter.
Monday 2 June 2025
Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold
These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's looming bankruptcy threatening Renesas' US$2 billion SiC deal, China's EUV-free 5nm efforts, mounting export control risks, Samsung Electronics' delayed entry into Nvidia's HBM3E supply chain, and Malaysia's US$270 billion pivot to IC design and advanced packaging.
Monday 2 June 2025
US plans wider China tech sanctions with subsidiary crackdown
The Trump administration plans to broaden restrictions on China's tech sector with new regulations to capture subsidiaries of companies under US curbs.
Friday 30 May 2025
Winbond ramps up in the DRAM shake-up, but trade fears loom
Amid growing uncertainty over global tariffs, Taiwanese memory chipmaker Winbond Electronics has seen a sudden surge in urgent orders during the second quarter of 2025, so much so that it's now facing supply shortages.
Thursday 29 May 2025
Memory price surge supports IC distribution in 2Q25; supply and inventory require cautious management
Despite the global semiconductor market currently being affected by exchange rates, inflation, and US tariff policies, there are no clear signs of recovery in the end-user market. However, in the memory sector, IC distributors have experienced a price increase in the second quarter of 2025. Coupled with short-term restocking momentum driven by impending tariff benefits expiration, this has triggered a wave of inventory buildup across the supply chain. Nevertheless, outlooks for the second half of the year remain conservative.
Thursday 29 May 2025
Winbond braces for persistent NTD appreciation with AI and security focus
Winbond Electronics chairman Arthur Yu-Cheng Chiao predicted a long-term, possibly lifelong, appreciation of the New Taiwan dollar (NTD), citing changes in global interest rate dynamics and Taiwan's growing economic strength. Speaking at the company's annual shareholders' meeting, Chiao warned that every NT$1 appreciation against the US dollar could reduce Winbond's profits by about NT$0.05, prompting a renewed strategic focus on secure memory, artificial intelligence, and environmental sustainability.
Wednesday 28 May 2025
Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to Nvidia by the end of 2025. But as its self-imposed deadline approaches, uncertainty lingers over whether Samsung can meet the rigorous performance standards set by its most critical customer.
Wednesday 28 May 2025
Hanmi engineers return to SK Hynix after US$30.7 million TCB order resolves dispute
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor confirming the return of its engineering personnel to SK Hynix's facilities. This marks a significant thaw in the strained relationship between the two industry giants, following a month-long absence of Hanmi's engineers from SK Hynix's production lines.
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing shortage is expected to trigger mid- to long-term disruptions in the substrate supply chain. Rising gold prices and extended lead times are already inflating costs across the NAND flash controller segment, potentially benefiting suppliers like Phison Electronics and Silicon Motion Technology through higher pricing leverage.
Tuesday 27 May 2025
CXMT to scrap DDR4 in policy-fueled pivot—DDR5 deluge may follow
ChangXin Memory Technologies (CXMT), China's top DRAM supplier, is reportedly preparing to phase out DDR4 products for server and PC use by mid-2026. As the company pivots to DDR5 and high-bandwidth memory (HBM), analysts warn the move could flood the market with next-gen DRAM, intensifying oversupply risks.
Monday 26 May 2025
Memory chip prices surge as supply constraints offset weak demand
Memory prices have climbed steadily despite sluggish end-user demand, with manufacturers expecting improved operations in the first half of 2025 and price stability through year-end as tariff exemptions drive urgent ordering.