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Friday 26 June 2026
Samsung's reported US$648 billion plan shifts focus to South Korea's chip belt

Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29, when South Korean President Lee Jae-myung chairs a public briefing at the presidential office in Seoul on what his administration is calling the country's "three mega-projects for a great leap forward," Maeil Business Newspaper reported.

Friday 26 June 2026
Exclusive: SK Hynix races to build Yongin memory megasite as supply crunch deepens

The global memory market is facing a structural supply-demand imbalance that shows little sign of easing. Micron's stronger-than-expected quarterly results have drawn fresh attention from investors and the technology industry, while the broader supply picture remains tight.

Friday 26 June 2026
Analysis: Why Apple can't wait out this memory shortage
Apple raised prices across its Mac and iPad lineup on June 25, and the timing wasn't a choice so much as a deadline.
Friday 26 June 2026
SK Hynix races to open Yongin triple-deck fab in 2027

SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.

Friday 26 June 2026
Apple's rare price hikes signal AI memory boom is reshaping consumer electronics

Before the price hikes became official, Apple had already warned investors that soaring memory costs would increasingly pressure margins. The company has now followed through on one of the rarest moves in its history: raising prices across much of its Mac, iPad, home device, and Vision Pro lineup to offset an AI-driven surge in memory and storage costs.

Friday 26 June 2026
SK Hynix's US$29 billion Nasdaq plan puts capacity expansion in focus

SK Hynix is pairing a potentially record-scale Nasdaq ADR offering with an aggressive push to expand chip production for artificial intelligence, as the South Korean memory maker prepares to nearly double DRAM wafer input capacity by 2030–2031, The Elec reported.

Friday 26 June 2026
Qualcomm's Dragonfly push highlights shift from mobile chips toward cloud AI
Qualcomm used its Investor Day to formally launch Dragonfly, a new data center product line aimed at cloud AI, and set out an ambitious revenue path that would shrink its dependence on handset sales. The company said the plan could reshape its business mix by 2029, but it still faces questions over timing, product performance, and execution.
Friday 26 June 2026
CXMT listing signals acceleration of China's memory self-sufficiency strategy amid global tech decoupling

CXMT's IPO highlights the growing geopolitical fragmentation of the global semiconductor industry, strengthening China's ability to finance domestic DRAM expansion and reduce reliance on foreign capital and technology. As supply chains increasingly split along regional lines, the listing reinforces Beijing's push for memory self-sufficiency and reshapes competitive dynamics in global markets.

Friday 26 June 2026
Apple and Google consider adopting Chinese memory chips: three obstacles remain
As AI demand prolongs shortages in memory chip supply, global technology companies are increasingly turning to Chinese-made semiconductors. However, industry analysts believe that even if major tech firms are interested in adopting Chinese chips, translating that interest into actual supply agreements remains difficult due to several significant obstacles.
Thursday 25 June 2026
Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.

Thursday 25 June 2026
Kioxia sees Apple fuel NAND memory supercycle, sets sights on US market
Kioxia is preparing to enter the US capital market through American depositary shares (ADS) in the first quarter of fiscal 2027, just as its latest annual report points to accelerating demand for NAND flash memory, SSDs and next-generation storage used in AI and consumer electronics.
Thursday 25 June 2026
ADATA explores Thailand role in AI computing expansion
ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit from expanding AI infrastructure, supporting industrial policy, and strengthening regional cooperation. The company sees Thailand as a possible hub for future growth and technology investment.
Thursday 25 June 2026
Commentary: Micron turns AI memory crunch into a buyback story
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.
Thursday 25 June 2026
Micron says AI memory shortage will outlast 2027, locks in US$100 billion customer deals
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing capacity, while unveiling a new long-term supply model backed by strategic customer agreements.
Thursday 25 June 2026
SK Hynix eyes record Nasdaq ADR to fund AI memory expansion

SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select Market, targeting up to KRW45.45 trillion (approx. US$29.43 billion) in proceeds for semiconductor facility investment.

Thursday 25 June 2026
Micron forecasts stronger AI-driven growth as strategic agreements reshape memory market
On June 24, Micron Technology reported record fiscal third-quarter results and issued a fourth-quarter forecast that significantly exceeded market expectations, reinforcing investor confidence in the AI infrastructure boom. Analysts said the company's expanding portfolio of multi-year customer agreements could help reduce the memory industry's traditional volatility, while persistent supply constraints are expected to support pricing and profitability through at least 2027.
Thursday 25 June 2026
Phison says NAND shortage has no end in sight as orders are booked into 2Q27

Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to crowd out memory capacity and push storage demand higher.

Thursday 25 June 2026
SK Group to meet Tesla and SpaceX leadership to pursue AI-infrastructure and memory partnerships
SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory supply, and data-center projects, South Korean outlet Ddaily reported, citing industry sources. The meeting is expected to cover specific business collaboration plans with Tesla, SpaceX, and xAI, though the exact date was kept confidential.
Wednesday 24 June 2026
SK Hynix to issue US$29 billion in new shares for Nasdaq ADR listing on July 10
SK Hynix disclosed in regulatory filings to South Korea's Financial Supervisory Service and the Korea Exchange on June 24 that its board has approved the issuance of new shares worth KRW45,453,450,000,000 (approx. USUS$29.4 billion) to support a listing of American Depositary Receipts on the Nasdaq Global Select Market. The filings represent the company's formal confirmation of a listing plan that market rumors had pointed to since at least December 2025, when SK Hynix first received and responded to regulatory inquiries about the speculation.
Wednesday 24 June 2026
AI supply chain boom fuels Taiwan's investment, exports as GDP growth tops 10% outlook
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across the semiconductor, memory, and server supply chains. Industry analysts and government officials increasingly believe growth could surpass earlier expectations as AI infrastructure spending continues to expand worldwide.
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.

Wednesday 24 June 2026
AI server demand drives Taiwan PCB output toward NT$256.1B in 2Q26
Strong demand for AI servers is driving higher shipments of advanced printed circuit board (PCB) products in Taiwan, but it is also tightening supply of key materials and resources, adding fresh uncertainty to the industry. The Taiwan Printed Circuit Association (TPCA) and the Industry, Science and Technology International Strategy Center (ISTI) said Taiwan's PCB manufacturing output reached NT$245.6 billion (US$7.8 billion) in the first quarter of 2026, up 19.6% from a year earlier and the highest level for the same period on record.
Wednesday 24 June 2026
SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a sharp profitability reversal makes the broader memory market too profitable to ignore.

Wednesday 24 June 2026
Samsung pushes memory supply deals as demand spreads beyond HBM

Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
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