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Friday 9 January 2026
Nvidia's Vera Rubin production timeline sparks debate as HBM4 readiness and talks with Korean memory makers draw scrutiny
Nvidia's next-generation AI superchip, Vera Rubin, has become the center of industry debate following comments by CEO Jensen Huang at CES 2026, where he said the product had entered the production phase. The statement has drawn scrutiny from the semiconductor supply chain, particularly memory makers, as questions emerge over the readiness of sixth-generation high-bandwidth memory (HBM4) for commercial deployment.
Friday 9 January 2026
Largan faces challenges as memory price impacts spread
Optical lens maker Largan Precision held an earnings briefing on January 8, 2026, during which chairman Adam Lin expressed a wary smartphone industry outlook. Surging memory prices are squeezing smartphone bills of materials (BOM), making customers more hesitant to pursue lens specification upgrades. Visibility for the full year of 2026 remains unclear, with only the first quarter confirmed to be affected by the traditional off-season, during which capacity utilization will be lower than in previous years.
Friday 9 January 2026
Tight memory supply to push smartphone prices higher in early 2026
Smartphone brands face mounting challenges as memory prices are expected to surge over 50% in the first half of 2026, according to channel operators. The rise in memory costs threatens to impact operations and sales, particularly for mid- to low-end smartphones.
Friday 9 January 2026
Exclusive: SanDisk seeks prepaid cash deals for long-term HAND supply
SanDisk is approaching customers with proposals for long-term NAND flash supply contracts that require 100% cash prepayment, according to supply chain sources. Industry participants said the terms are without precedent, particularly as they require buyers to commit cash upfront at a time of rapidly rising prices and severe supply constraints.
Friday 9 January 2026
CSP deals tighten memory supply as 1Q26 prices surge
Memory prices are accelerating again as cloud service providers move to secure supply, pushing costs higher across servers, PCs, and consumer electronics. Tight capacity, fueled by heavy demand from AI servers, has shifted pricing power decisively toward suppliers, with binding long-term contracts now locking up output through 2027 and 2028, industry sources said.
Thursday 8 January 2026
CES 2026: Nvidia and Samsung signal possible talks on next-generation memory

During the CES 2026 technology show, Nvidia executives made an unannounced visit to Samsung Electronics' private semiconductor exhibition space, a move that industry observers interpreted as a possible step toward discussions on the supply of next-generation high-bandwidth memory (HBM4).

Thursday 8 January 2026
AI storage chip crunch in 2026: DRAM, NAND prices surge up to 70%
The global storage chip market has entered an acute shortage phase, with AI demand now decisively outpacing supply and pushing prices toward record territory through 2026 and beyond. According to ICsmart, Reuters, and TrendForce's January 2026 report, conventional DRAM contract prices are set to rise 55–60% quarter over quarter in the first quarter of 2026, while server DRAM prices are expected to jump more than 60% and NAND Flash 33–38%.
Thursday 8 January 2026
CES 2026: Nvidia CEO reveals three key investment directions
Nvidia recently acquired Groq's technology license and integrated its core technical team, sparking curiosity about the chip giant's investment philosophy. At CES 2026, Nvidia CEO Jensen Huang outlined the company's three main investment focuses that guide how it deploys its abundant cash reserves.
Thursday 8 January 2026
Micron to break ground on largest US memory chip facility
On January 7, 2026, Micron Technology announced that it will officially begin construction on its megafab in Onondaga County, New York, on January 16, 2026. The project, which followed environmental reviews and permit approvals, represents the largest private investment in the state's history and is intended to expand the company's memory manufacturing capacity to meet growing demand from artificial intelligence systems.
Thursday 8 January 2026
CES 2026: Taiwan researchers showcase neuromorphic chip breakthroughs
To overcome AI's limits, a bridge must be built between computer science and biology, according to Kea-Tiong Tang, a professor from Taiwan's National Tsing Hua University (NTHU) and a leading scholar in neuromorphic computing. Tang recently led a Taiwan team to the US for CES in 2026, demonstrating efforts to break from the traditional von Neumann architecture.
Thursday 8 January 2026
DRAM prices spike; stockpiling returns under AI-driven supply strain
As 2026 begins, the global DRAM market is experiencing a rare price spike. Tight supply, rapid AI expansion, and expectation-driven buying have pushed memory prices higher since the second half of 2025, with gains outpacing most commodities. Hoarding and speculative behavior have emerged, with industry sources comparing the value of a crate of server DRAM modules to the price of an apartment in Shanghai.
Thursday 8 January 2026
Samsung Electronics posts sharp profit rebound in fourth quarter on AI-driven memory demand
Samsung Electronics reported a strong rebound in profitability in the fourth quarter of 2025, supported by rising memory chip prices and sustained global demand from AI data center operators, according to its preliminary consolidated financial results released under fair disclosure rules.
Wednesday 7 January 2026
Apple reportedly locks in NAND through 2026 ahead of DRAM price spike
Apple has secured enough NAND flash memory to sustain production through the first quarter of 2026. But the iPhone maker is facing steep price increases for DRAM as artificial intelligence demand shifts leverage toward chipmakers, according to Morgan Stanley.
Wednesday 7 January 2026
Nvidia's Vera Rubin enters full production, igniting Micron's HBM4 capacity bet for 2026
When Nvidia CEO Jensen Huang confirmed at CES 2026 that its next-generation AI processor, Vera Rubin, had entered full production, the message to the memory industry was immediate. The move effectively ignited a new competitive cycle in sixth-generation high-bandwidth memory (HBM4), as suppliers race to lock in design wins for Nvidia's post-Blackwell platforms.
Wednesday 7 January 2026
CES 2026: PC brands push new launches amid memory crunch
Facing the memory shortage, PC companies are aggressively promoting new models at the Consumer Electronics Show (CES), hoping to regain momentum. Acer rolled out multiple new series, including Aspire, Predator, and Swift AI. Dell introduced the return of its classic thin-and-light XPS lineup and revealed that its gaming brand Alienware will launch new products.
Wednesday 7 January 2026
Memory price surge drives Nanya, Adata to record December revenue
Soaring memory prices have boosted the performance of related supply chains, with Nanya Technology and Adata Technology posting record single-month revenues for consecutive months, with December 2025 revenue reaching new highs.
Wednesday 7 January 2026
Nvidia CEO downplays memory supply concerns, highlights exclusive use of HBM4
Nvidia CEO Jensen Huang addressed concerns regarding recent memory supply shortages during a press conference at CES 2026, stating that Nvidia will be the exclusive consumer of sixth-generation high-bandwidth memory (HBM4) in the near term. Huang expressed confidence that this exclusivity will provide Nvidia with strategic advantages.
Wednesday 7 January 2026
Samsung speeds Pyeongtaek P5 fab toward 2028 output

Samsung Electronics is accelerating construction of its P5 semiconductor line in Pyeongtaek, South Korea, as it moves toward a 2028 production target. The project is a central component of the company's plan to expand memory production amid rising AI-driven demand. Samsung is currently mobilizing thousands of workers daily and has launched simultaneous bidding for utility infrastructure to compress the traditional build timeline.

Tuesday 6 January 2026
CES 2026: SK Hynix showcases next-gen AI memory solutions
SK Hynix Inc. said it will showcase its next-generation AI memory solutions at CES 2026, where it plans to operate a customer exhibition booth at the Venetian Expo in Las Vegas from January 6 to 9, 2026. Under the theme "Innovative AI, Sustainable Tomorrow," the company aims to highlight products optimized for AI workloads and deepen engagement with key customers as demand for AI infrastructure continues to accelerate.
Tuesday 6 January 2026
Samsung, SK Hynix reportedly reject long-term DRAM contracts and raise prices by up to 70%

Reports in Korean business media say Samsung Electronics and SK Hynix are raising quoted prices for server DRAM by 60% to 70% for the first quarter of 2026 compared with the fourth quarter of 2025, as demand continues to outstrip supply.

Tuesday 6 January 2026
Samsung to restart construction of Pyeongtaek P5 chip plant

Samsung Electronics will resume structural construction at its Pyeongtaek P5 semiconductor plant next month. The company halted the project last year during a downturn in the memory market, but is now expanding capacity as demand for high-bandwidth memory (HBM) used in AI recovers.

Tuesday 6 January 2026
SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the AI-driven memory market through 2026, even as preparations accelerate for a transition to HBM4.

Monday 5 January 2026
Etron Technology to showcase edge AI memory and robotics platforms at CES 2026
Etron Technology is concentrating its edge AI strategy on four pillars: memory, intelligent vision sensing, high-speed transmission, and privacy computing. Under the theme "MemorAiLink show up," the company will present its edge AI portfolio at CES 2026, targeting AI and robotics growth opportunities.
Monday 5 January 2026
China memory makers' IPO line up: CXMT seeks US$4.2 billion, YMTC prepares filing
Strong AI demand has pushed the memory sector into a rare upcycle. China's leading DRAM maker CXMT is advancing an IPO application on the STAR Market, targeting CNY29.5 billion (US$4.21 billion), the second-largest fundraising in STAR Market history. In parallel, supply chain sources say China's NAND flash leader YMTC is likely to file for an IPO in the first half of 2026.
Monday 5 January 2026
Samsung reportedly pitches bundled solutions to Google and AMD
As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung Electronics has not only demonstrated negotiation dominance but is also marketing a turnkey solution that bundles advanced packaging, DRAM, and foundry services to customers such as Google and AMD. This binding strategy aims to strengthen customer loyalty.