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Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco, highlighting the deepening ties among the companies driving the global AI supply chain.
Friday 31 July 2026
Memory shortages deepen as prices climb into the second half of 2026

Memory shortages are tightening across the supply chain, and higher contract prices are set to ripple through global electronics markets. With DRAM lead times stretching and suppliers holding firm, buyers of servers, PCs, and mobile devices may face more cost pressure, even as end-market demand remains uneven worldwide.

Friday 31 July 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices

Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: memory.

Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage options for AI-enabled PCs and smartphones, while also underscoring broader supply-chain developments that may shape device performance for users worldwide.
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single number. It was the shape of the customer list: cloud service providers, AI/HPC designers, an LPU maker ramping at 4nm, and talks with Broadcom. This is not the mobile-centric foundry business Samsung has run for a decade. It is the profile of a fab catching overflow from a leading-edge market that has run out of capacity.

Friday 31 July 2026
Qualcomm, MediaTek set Sept flagship SoC showdown
Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and upgraded chips at the same time to meet different customer needs. Supply chain sources say the two chipmakers will no longer rely on a single product for flagship phones in 2026, but instead offer two separate specifications.
Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site. By the end of 2026, general-purpose DRAM capacity is expected to rise about 15%.
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing share of its DRAM and NAND output to commitments that run years into the future.
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth memory (HBM) moves into advanced packaging processes led by TSMC.

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172 million) in 2026, expanding domestic vendors' role in a memory-testing segment where Japan's Advantest has long been an established supplier.
Thursday 30 July 2026
High memory prices could slow China's AI push, analyst says

Memory prices are expected to remain elevated through 2026 as AI and data-center demand strains supply, with meaningful supply relief unlikely until well into 2027. A South Korean securities analyst argues that the squeeze could also make it harder for China to expand AI use, although Washington has not identified high memory prices as a policy tool.

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic and packaging.
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said on its earnings call. It projected that HBM4 will account for well over 60% of its total HBM revenue in the second half — a ramp that would lift its HBM market share broadly in line with its overall DRAM share and close the gap that has defined the HBM race since the AI boom began.

Thursday 30 July 2026
Samsung: memory shortage to worsen in 2027, persist through 2028; locks top customers into multi-year deals

Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory business EVP Jaejune Kim said on the company's second quarter of 2026 earnings call — and the company is using the crunch to fundamentally restructure how it sells memory, shifting 60-70% of its capacity into binding multi-year supply agreements.

Thursday 30 July 2026
Intel's reported DDR4 CPU revival expected to boost PC demand in second half
With AI server demand continuing to absorb DRAM production capacity, DDR5 memory prices remain elevated and are expected to rise further.
Thursday 30 July 2026
Samsung says rising memory costs will lift Taiwan smartphone market value more than 8% in 2026
Rising prices for memory and other key components are weighing on smartphone demand in Taiwan, but the overall market value is still expected to grow in 2026, according to Samsung Electronics Taiwan.
Wednesday 29 July 2026
Analysis: What Seagate's blowout quarter signals about the next two years of AI infrastructure demand

Seagate's fiscal fourth quarter was by almost every measure its strongest in over a decade — US$3.6 billion in revenue, US$1.1 billion in free cash flow, and gross margins pushing toward 53%. But for supply chain watchers, the more important story is what the results reveal about where demand is heading, who is driving it, and how the hardware ecosystem needs to prepare.

Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the US or Japan. The company said future overseas expansion decisions will depend on business feasibility, infrastructure availability, semiconductor ecosystems, and customer needs as it builds a flexible global manufacturing footprint.
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget handset market, according to Asia Time.
Wednesday 29 July 2026
Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion (approx. US$490 million) in capex to expand 12-inch wafer capacity.
Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints and shifting customer buying patterns. The South Korean chipmaker said it is expanding long-term agreements with major customers to lock in demand and support investment planning. The company also expects HBM and DRAM to remain key growth drivers into the second half of 2026.

Wednesday 29 July 2026
Seagate forecasts strong 1Q growth on sustained AI-driven cloud demand

On July 28, Seagate Technology reported sharply higher revenue and profit for its fiscal fourth quarter, driven by continued demand from cloud data center customers and higher-capacity storage products tied to artificial intelligence infrastructure. The company also issued first-quarter fiscal 2027 guidance above its prior quarter's revenue level, reflecting expectations that demand momentum will continue.

Wednesday 29 July 2026
SK Hynix sees record-breaking 2Q on surging AI demand

SK Hynix has announced its financial results for the second quarter of fiscal year 2026, reporting unprecedented growth in revenue and profitability. Driven by rapid expansion in the artificial intelligence (AI) market, the company achieved record-high margins and a significant surge in net profit, supported by both operational excellence and substantial investment gains.

Wednesday 29 July 2026
Adata profit surges tenfold on memory shortages and AI demand

Adata Technology posted record second-quarter results in 2026, as rising memory prices, aggressive procurement and tighter inventory management lifted revenue and profit to historic highs.