High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called it "lousy" at a recent AI summit in Paris. SK Hynix, the market leader in this type of memory, also said it is not the final answer to AI memory bottlenecks, underscoring the industry's push to find a next-generation memory architecture beyond HBM.
South Korea's semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over year, while system semiconductor exports slipped 0.7%, as server demand and higher memory prices created a sharp split between the two segments.
SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry the flash-memory maker through the end of the decade. The plans center on new multiyear supply contracts with data center customers and an accelerating NAND product cadence built around artificial intelligence inference workloads.
Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles cost and reliability hurdles that still stand between the technology and mass production.
Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring new memory architectures after hiring former SK Hynix CEO Lee Seok-Hee.
Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin Microelectronics (Guangzhou) Co., Ltd., according to the source material.
