CONNECT WITH US
Monday 2 November 2026
Samsung chairman Lee Jae-yong turns to Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to strengthen its advanced packaging capabilities for AI processors.
Monday 2 November 2026
DIGITIMES chairman: Taiwan-South Korea cooperation beats competition in AI race
Artificial intelligence (AI) is rapidly expanding global semiconductor demand, prompting Taiwan and South Korea to shift from straightforward competition toward cooperation as the AI chip supply chain grows more complex. Colley Hwang, chairman and CEO of DIGITIMES, said Taiwan's semiconductor success stems not only from TSMC, but also from an ecosystem built on specialization, industrial clusters, talent, and capital markets.
Monday 2 November 2026
Sam Altman meets with Samsung, SK as memory crunch deepens
OpenAI CEO Sam Altman met with executives from Samsung Group and SK Group during a brief visit to South Korea on October 31, as tightening memory supplies and growing commitments to major AI customers raise the stakes for the company's semiconductor and data center partnerships.
Monday 2 November 2026
What CXMT's 3Q26 earnings reveal about DRAM shortages, DDR5 momentum, and 2027 growth strategy
China's leading DRAM manufacturer CXMT expects revenue to continue growing through 2027, supported by tight memory supply, AI server demand and an expanding portfolio of higher-value DDR5 and LPDDR6 products. The company is also negotiating long-term supply agreements with major customers, reflecting efforts to secure demand beyond the current memory market upswing.
Monday 2 November 2026
Kioxia's AI storage boom faces a test as pricing gains moderate, shipments shift
Kioxia's latest results show how AI infrastructure spending is reshaping the NAND flash business, lifting profitability even as consumer demand weakens. Its nearly flat outlook for the next quarter, however, shifts attention from the scale of the price surge to whether enterprise storage shipments can sustain growth as that surge moderates.
Monday 2 November 2026
Weekly news roundup: Taiwan debates talent distribution; SK Hynix looks beyond HBM
This week’s coverage highlights intensifying competition and capacity constraints across the global semiconductor industry. Taiwan faces debate over whether public R&D funding should prioritize universities and talent development. Micron workers receive unusually large bonuses amid unresolved labor negotiations. India is expanding state-level semiconductor incentives, while KLA reportedly considers local manufacturing. Memory shortages may persist through 2030, and SK Hynix is investing beyond memory. Server CPU demand is projected to surge, with AMD potentially surpassing Intel in revenue.
Monday 2 November 2026
Column: Samsung's memory boom reshapes its investment strategy
Samsung Electronics has never had more capital at its disposal. The company reported operating profit of KRW89.5 trillion (approx. US$67 billion) in the second quarter of 2026 and KRW107.4 trillion in the third, when its operating margin reached approximately 55%. Samsung became the first technology company worldwide to post quarterly operating profit exceeding KRW100 trillion. The company is benefiting enormously from the memory boom, but its dependence on the industry has also deepened.
Monday 2 November 2026
GigaDevice's massive financial growth in 2026 capitalizing on its A+H listing, memory surge
GigaDevice's financial performance through the first three quarters of 2026 highlights a transformative period driven by strategic market positioning, capital expansion, and robust product demand.
Monday 2 November 2026
Analysis: Samsung's own memory unit pushes its foundry toward a 2027 capacity crunch
Samsung Electronics' contract chipmaking business spent years struggling to fill its factories. On its third-quarter earnings call, the company said that by 2027, demand will exceed capacity across all its nodes below 8nm, which it expects to run at over 100% utilization.
Saturday 31 October 2026
MediaTek raises ASIC outlook as fourth-quarter revenue could jump 32%
MediaTek reported third-quarter 2026 revenue of NT$168.06 billion (US$5.17 billion), up 10.4% quarter-over-quarter (QoQ) and 18.3% year-over-year, and projected fourth-quarter revenue growth of as much as 32% on accelerating shipments of AI accelerator application-specific integrated circuits (ASICs). The Taiwanese IC design company disclosed the results and outlook at an investor conference on October 30, citing stronger-than-expected customer demand, improved capacity availability, and new smart-device platforms entering mass production.
Friday 30 October 2026
Micron says 700-plus Taiwan fab workers earned five years' salary in a single year
Micron Technology paid its fiscal 2026 bonuses to Taiwan employees on October 30. The company said more than 700 production-line workers earned at least five years' worth of monthly salary in total pay for the year. The payout comes while the union at its Taoyuan fab is still rejecting the company's pay offer.
Friday 30 October 2026
SK Hynix taps HBM veteran to lead new American unit
SK Hynix has appointed its AI memory development chief to lead a newly established Americas unit based in the US, putting a technology veteran closer to major US customers as the industry shifts toward customized high-bandwidth memory (HBM) and deeper collaboration with chip developers.
Friday 30 October 2026
China's memory module bellwethers post record profits as 3Q26 momentum fades
China's listed memory module makers, whose results offer an early read on how the global memory upcycle is reaching the country's storage supply chain, reported net profit gains of more than 300-fold at the top end for the first nine months of 2026. Yet several of the largest players also posted sharp sequential profit declines in the third quarter, suggesting the windfall from low-cost inventory meeting surging contract prices is narrowing.
Friday 30 October 2026
Sandisk sees 60–90GB of NAND per CPU in AI agent workloads
Sandisk sees demand for roughly 60 to 90 gigabytes of NAND flash per CPU in certain AI inference and agent-orchestration applications, as customers rethink how they use different memory and storage technologies across their AI systems.
Friday 30 October 2026
Sandisk says customers are coming back for more NAND
Sandisk says AI infrastructure customers are returning to secure more NAND flash after underestimating their storage requirements, even as its pipeline of prospective long-term supply agreements exceeds planned output through the end of the decade.
Friday 30 October 2026
HBM4 cycle faces squeeze as capacity, specs become critical
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean supply chain. Major AI semiconductor customers are already pushing HBM4E development, potentially shortening HBM4's mass-production cycle, while suppliers' development and manufacturing capabilities, thermal management, and customer validation remain decisive.
Friday 30 October 2026
Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level
Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually dense electronics manufacturing base.
Friday 30 October 2026
Sandisk's data center expansion widens the gap with consumer storage
Sandisk's latest quarter showed enterprise storage as a stronger growth engine while its consumer business contracted. This divergence is central to interpreting the company's expansion: data center demand is supporting a much larger, more profitable business, but the performance should not be read as a uniform recovery across flash storage markets.
Friday 30 October 2026
Alibaba, Tencent, ByteDance reportedly seek 10-year DRAM deals
Alibaba, Tencent, and ByteDance are reportedly seeking long-term server DRAM supply agreements with Samsung Electronics and SK Hynix, with some requests extending through 2035, as Chinese cloud service providers (CSPs) join US technology giants in competing for future memory capacity.
Friday 30 October 2026
Samsung, SK Hynix say memory crunch could drag on for years despite spending surge
Samsung Electronics and SK Hynix expect memory shortages to persist for years despite rising investment in chip factories, as surging AI demand and increasingly complex manufacturing processes limit how quickly new capacity can come online.
Friday 30 October 2026
Memory price surge clouds peak season; Chinese brands' 4Q26 smartphone shipments to drop over 35%
Despite new smartphone launches from Apple, Huawei, Oppo, Vivo, and Xiaomi, rising memory prices are weakening sales momentum and prompting Chinese smartphone brands to adjust their product mix. DIGITIMES Intelligence senior analyst Luke Lin expects smartphone shipments in China to fall more than 13.5% year-over-year in the fourth quarter of 2026, and total shipments by Chinese brands to decline more than 35% year-over-year.
Friday 30 October 2026
Silicon Motion posts fourth straight revenue record, eyes 100% 2026 growth
Silicon Motion Technology reported third-quarter 2026 revenue of about US$560 million, marking a record high for the fourth consecutive quarter. Revenue rose 24% quarter-over-quarter and surged 131% year-over-year, putting the company on track to achieve record full-year revenue in 2026, up more than 100% from 2025.
Thursday 29 October 2026
Analysis: Samsung's record quarter came from higher prices, not more chips; expects buyers to get no relief before 2028
Samsung Electronics' third-quarter profit came almost entirely from charging more for memory chips, not from selling more of them. On its earnings call, the company also told investors the shortage behind those prices will last into 2028, even as chipmakers raise spending.
Thursday 29 October 2026
CXMT to start HBM3E production despite low yields amid tight domestic market
ChangXin Memory Technologies (CXMT), China's leading producer of DRAM memory, is reportedly planning to begin production of HBM3E, despite yields so far only reaching 20% to 30%. This reflects the memory shortage faced by China's market as it seeks to expand its domestic capacity while facing restrictions on critical equipment imports.
Thursday 29 October 2026
Samsung, SK Hynix invest KRW110 trillion as memory supply boost slips to 2028
Samsung Electronics and SK Hynix are undertaking their largest-ever equipment investments in 2026, but the memory supply increase is not expected to materialize until 2028. By then, however, new South Korean plants and expanded capacity at China's ChangXin Memory Technologies (CXMT) are expected to come online simultaneously, potentially triggering price competition in commodity DRAM.