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    Charts: Micron earns its best margins from PCs, phones, not AI
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    Home Tech Semiconductors Memory chips
    Thursday 1 October 2026
    Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts
    Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract prices left HBM largely outside the memory price surge.
    Thursday 1 October 2026
    Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
    Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate on developing advanced memory cells and structures, multi-chip stacking architectures, and new materials engineering technologies to improve the memory density and performance required in the artificial intelligence (AI) era.
    Thursday 1 October 2026
    Micron sees no end to the memory shortage, even after new fabs open in 2028
    Micron told investors on September 30 that it cannot say when memory supply will catch up with demand. It expects the shortage to get worse over the next two years, even though additional cleanroom space is expected from late 2028.
    Thursday 1 October 2026
    Applied Materials and Kioxia team up on AI-era memory tech
    Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration underscores efforts to boost memory density, speed, and energy efficiency, which are increasingly important as global demand for data-intensive computing and advanced chip packaging rises.
    Thursday 1 October 2026
    Memory shortages deepen as AI demand keeps server prices climbing
    The memory market is entering the fourth quarter of 2026 with a widening split between weak consumer demand and intense server buying, underscoring how artificial intelligence workloads are reshaping supply. Spot prices for DDR5 server modules continue to rise, while some lower-grade products are softening in the channel.
    Thursday 1 October 2026
    Micron's record quarter rests on pricing power as customers lock in 2027 supply
    Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure supply. Revenue for the three months ended September 3, 2026, reached US$54.2 billion, up 31% from the previous quarter, and GAAP gross margin widened to 86.8%.
    Thursday 1 October 2026
    Samsung Foundry gets boost from HBM4 as 2nm push continues
    Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
    Thursday 1 October 2026
    DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality
    DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of creating content, and toward a broader shift into the agentic AI era in 2027. Agentic AI is expected to multiply compute demand, while multi-step reasoning introduces new risks to task quality. Efficient control of total token consumption and reliable task-quality management will therefore become critical to commercial deployment.
    Wednesday 30 September 2026
    'I tell myself every day it'll ease': Phison CEO sees years of memory shortage
    Phison Electronics CEO Pua Khein-Seng says he tells himself every day that the memory shortage will ease tomorrow. In reality, he says, AI-driven demand has opened a gap between memory supply and demand that could take many years to close.
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side to potentially improve packaging yield and thermal performance, according to a teardown analysis by TechInsights. The findings come as Qualcomm's Snapdragon 8 Elite Gen 6 and Apple's A20 Pro draw comparisons around 2-nanometer chip manufacturing and memory packaging.
    Wednesday 30 September 2026
    Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use
    Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory (HBM) technology without authorization. The case arrives as AI applications are driving soaring demand for next-generation memory chips, and it is brought forward by a company with a track record of winning patent verdicts against memory makers.
    Wednesday 30 September 2026
    SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
    SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.
    Wednesday 30 September 2026
    Column: Memory and logic collide as AI shifts the balance
    As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge that has shaped nearly half a century of semiconductor development.
    Wednesday 30 September 2026
    Commentary: What risks does China's DRAM capacity face amid tightening market?
    China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment, in-house testing and tighter control of its memory supply chain.
    Wednesday 30 September 2026
    CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
    CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory cooperation with Samsung Electronics. The planned visit is expected to broaden that push, with meetings lined up with South Korean AI chip companies and government officials as AMD deepens its AI semiconductor alliance in the country.
    Wednesday 30 September 2026
    Memory shortage pushes TV semiconductors above panel costs

    A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs now overtaking display panels in some models. The shift, reported by ET News, could squeeze profitability at major TV makers including Samsung Electronics and LG Electronics.

    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the Beijing Superstring Memory Research Institute (SAMT), CXMT, and equipment maker NAURA Technology Group. The coordinated advance highlights both the momentum behind 3D DRAM and the technical hurdles still blocking mass production.
    Tuesday 29 September 2026
    CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
    China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up investment as tight memory supply and stronger pricing give the company more room to expand.
    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration and manufacturing expertise to a next-generation memory project that already includes Intel and Japan's RIKEN.
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific development to the core technology behind D0a, its first sub-10nm DRAM generation. Industry observers believe Samsung's push to commercialize B1b DRAM earlier could also benefit its next-generation high-bandwidth memory (HBM) products, including HBM5.
    Tuesday 29 September 2026
    Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
    Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
    Tuesday 29 September 2026
    Solidigm weighs US IPO as AI storage demand lifts valuation
    SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation of up to US$150 billion and a fundraising target of about US$15 billion. The move comes as AI data centers drive stronger demand for high-capacity enterprise SSDs, putting AI storage businesses in focus for capital markets.
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

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