Samsung Electronics plans to produce high-bandwidth memory (HBM) base dies for AMD at its second foundry plant in Taylor, Texas, with the US chipmaker accounting for most of the facility's planned output, South Korea's Maeil Business Newspaper reported on November 3, citing industry sources. The report said the plant would also supply Nvidia, although Samsung has not confirmed either customer's orders.

High Bandwidth Flash (HBF) could give AI accelerators more memory at roughly one-tenth the manufacturing cost per gigabyte of HBM4. But producing it could consume far more wafer capacity than conventional NAND, potentially tightening supply for SSD makers.

SK Hynix's decision to halt evaluation of a Solidigm pre-IPO and IPO has renewed questions over how it will finance a planned NAND flash plant in the US. Selling remaining assets linked to its investment in Kioxia has emerged as a potential funding option, but Kioxia's share-price decline and the investment's strategic and shareholder value have complicated the timing and necessity of any sale.

AI demand continues to heat up while major global memory makers shift capacity toward higher-value products, keeping niche memory supplies tight in the near term. China-based IC design firm GigaDevice Semiconductor Inc. said niche DRAM prices have risen sharply, curbing some consumer-electronics demand and easing supply pressures slightly, but that limited supply will keep prices elevated for some time.

A loophole in US export controls reportedly lets high-bandwidth memory (HBM) made by Samsung Electronics and SK Hynix reach China's AI chip industry. The loophole shows how much Huawei's next-generation processors still depend on foreign memory, while China's domestic suppliers struggle to close the gap.

Apple's Greater China revenue rose 21% year-over-year to a record US$17.5 billion in the fourth quarter of fiscal 2026, ended September, while full-year revenue increased 28%, driven by the launch of the iPhone 18 Pro series. The results underscore the flagship iPhone's continued competitiveness in China, while rising memory prices threaten to pressure profit margins and growth.

DRAM manufacturer Nanya Technology reported consolidated revenue of NT$46.476 billion (US$1.42 billion) in October 2026, up 3.07% from September and 487.73% year-over-year. Driven by continued increases in DRAM prices, monthly revenue reached a record high for the 12th consecutive month. Consolidated revenue for the first 10 months totaled NT$311.761 billion, up 602.15% year-over-year.

SK Hynix's plans for a US$45 billion NAND investment in New York face a regulatory hurdle as Washington holds back approval for American chipmaking equipment needed at the company's Dalian plant in China, putting the proposed US expansion under pressure ahead of a year-end tax incentive deadline.

Winbond Electronics reported strong results for the third quarter of 2026, with revenue, including subsidiary Nuvoton Technology, reaching NT$82.33 billion (approx. US$2.51 billion), up 37.6% from the previous quarter and 278.2% from a year earlier. Gross margin climbed to 70.6%, while operating margin reached 53.2%. Net income attributable to the parent company rose 45.7% from the second quarter to NT$35.42 billion, more than 12-fold compared with the same period in 2025. Earnings per share (EPS) came in at NT$7.58.

Macronix (MXIC) chairman Miin Wu said the memory shortage will continue through 2030, with prices unlikely to weaken from current levels as production capacity becomes a scarce resource. He also disclosed for the first time that Macronix is considering an acquisition or partnership, with a new strategic direction potentially emerging within six months.

Taiwanese memory module maker Team Group is gearing up for a major expansion. Chairman Dann-Ning Hsia stated that 2026 has been a pivotal year of strong financial performance and strategic transformation. To support its growth, the company acquired a new 1,000-ping (approx. 3306 square meters) facility in New Taipei City, which is scheduled to come online in the second quarter of 2027 and boost overall production capacity by roughly 50%. Meanwhile, Team Group projects that the current memory supply crunch will reach its peak between the fourth quarter of 2026 and the end of the second quarter of 2027.

South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded researcher proposed on November 2, a move that could influence chipmakers' sourcing decisions if adopted.

The AI infrastructure boom has driven up memory prices across consumer electronics, dampening sales of smartphones and notebooks while hitting upstream system-on-chip (SoC) developers. With memory prices projected to keep climbing through 2027, industry observers generally expect end-market sales to remain sluggish, testing the resilience and strategy of players across the entire value chain.

A Japanese electronics distributor has stopped accepting new customers because it cannot fully supply its existing ones, Nikkei reported, as demand from AI data centers tightens supply of the conventional DRAM used in PCs.

Memory IC designer Elite Semiconductor Microelectronics Technology (ESMT) expects shipments and gross margin to remain stable in the fourth quarter of 2026 despite higher memory wafer procurement costs, while its average selling price (ASP) will rise from the third quarter of 2026. The company also expects tight DDR2 and DDR3 supply-demand conditions to keep prices stable in 2027 as it continues securing foundry and OSAT capacity to meet customer demand.

Apple is committing more money to research and securing supplies while reducing cash spending on fixed assets, a combination that shows how its AI ambitions and component shortages are reshaping investment. Its November 2 results reveal both a deliberate push into new capabilities and the growing financial burden of keeping devices and services available.

China's memory chip industry heads into the final quarter of 2026 riding a global supply shortage: its leading DRAM maker booked more than CNY54 billion (US$8.11 billion) in third-quarter profit, and its chip designers are still lifting sales on tight supply. The same third-quarter results also show where risks are accumulating — rapid capacity expansion, swelling inventories, and a US policy debate that could reach the equipment domestic fabs depend on.

Micron Technology and China's CXMT have taken sharply different approaches to next-generation DRAM scaling, exposing a divide over the commercial viability of 4F-squared memory-cell architecture. While CXMT is advancing 4F-squared towards commercial production to improve bit density, Micron argues that capacitor-scaling constraints undermine its cost advantages and is prioritising 6F-squared technology and a longer-term transition to 3D DRAM. Samsung Electronics and SK Hynix, meanwhile, are pursuing alternative development paths, highlighting the industry's competing approaches to extending DRAM density and manufacturing efficiency.

Competition in the AI application-specific integrated circuit (ASIC) market will extend beyond 2028, industry sources said, with MediaTek, Broadcom, and Marvell competing not only for design wins, but also for secure access to wafers, advanced packaging, substrates, and high-bandwidth memory (HBM). The effectiveness of their supply-chain partnerships will determine how much revenue each company can ultimately generate.

Despite record profits driven by surging demand for artificial intelligence (AI) and a booming semiconductor industry, Samsung Electronics vice chairman and head of its Device Solutions (DS) division Young Hyun Jun said the company's technological competitiveness has yet to fully recover. He urged employees to strengthen next-generation technologies, quality, and yields, and maintain customer trust during the industry boom while building long-term competitiveness capable of adapting to market changes.

SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform, while shortages of copper-clad laminate (CCL) and other materials are pushing up substrate prices, South Korea's Dealsite reported on October 30.

Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to strengthen its advanced packaging capabilities for AI processors.

Artificial intelligence (AI) is rapidly expanding global semiconductor demand, prompting Taiwan and South Korea to shift from straightforward competition toward cooperation as the AI chip supply chain grows more complex. Colley Hwang, chairman and CEO of DIGITIMES, said Taiwan's semiconductor success stems not only from TSMC, but also from an ecosystem built on specialization, industrial clusters, talent, and capital markets.

OpenAI CEO Sam Altman met with executives from Samsung Group and SK Group during a brief visit to South Korea on October 31, as tightening memory supplies and growing commitments to major AI customers raise the stakes for the company's semiconductor and data center partnerships.