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Monday 24 August 2026
Shanghai accepts YMTC's STAR Market listing application
China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises, US export controls bite, and memory markets remain highly cyclical, raising questions about whether its rapid profit surge can last.
Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its overseas fabs, particularly the Arizona plant, warrant the closest attention. Because TSMC's quarterly and semiannual filings do not explicitly separate individual subsidiary revenue, Lin uses the parent company's procurement volume from these overseas entities as a proxy for equivalent revenue.
Monday 24 August 2026
India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer yields and labor rules to materials, equipment, rare earth magnets and emerging technologies, the country is expanding its ambitions as it seeks a deeper role in the global chip supply chain.
Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.
Saturday 22 August 2026
AI memory windfall: Samsung to hand back up to US$79 billion in 2026
Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest ever by a Korean firm.
Friday 21 August 2026
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won, at a time when semiconductor investment, artificial intelligence and US demands for more local manufacturing are becoming increasingly intertwined.
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES, the three largest upstream memory chip makers are headed for a more than threefold jump in combined DRAM and NAND revenue in 2026, with supply constraints likely to keep pricing firm until new capacity arrives in 2027.
Friday 21 August 2026
SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision has been finalized.
Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent financial analysis, however, suggests that South Korea may face fewer side effects from single-industry reliance than Taiwan.
Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory (HBM) to compete not just on individual chip performance but on how memory, processors, and networking are designed together as AI computing systems scale.
Friday 21 August 2026
Micron launches long-horizon research hub to push memory and AI development
Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort targets breakthroughs in memory, advanced packaging, and new compute architectures that may shape global technology supply chains, energy use, and access to smarter devices.
Friday 21 August 2026
Nitto Denko to expand HDD baseboard capacity for AI data center demand
Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by 40% from fiscal 2025 levels. The move is aimed at meeting demand driven by AI-related data center growth.
Thursday 20 August 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.

Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.
Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review. The move advances a broader capacity buildout to meet growing AI memory demand.
Thursday 20 August 2026
CXMT planned to use Samsung process data to develop DRAM, ex-engineer says
A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account that contrasts with the Chinese memory maker's description of its technology development in the prospectus for its recent Shanghai listing.
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according to SemiAnalysis ChipBook. The shift suggested that some HBM shipments previously sent to Taiwan for TSMC's CoWoS packaging might be redirected to packaging plants in Malaysia.

Thursday 20 August 2026
Gujarat's 12-hour shift approval for Micron shows how India is rewriting labour rules to court chipmakers

The Gujarat government's approval of 12-hour work shifts at Micron Technology's Sanand assembly and test plant is more than just a single-factory ruling. It is the clearest sign yet that Indian states are willing to reshape decades-old labor rules to fit the round-the-clock demands of semiconductor manufacturing, as they compete for a slice of a global chip supply chain shifting away from China.

Thursday 20 August 2026
Samsung repays 20 trillion won SDC loan early as memory demand surges

Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026, according to South Korean publication ZDNet Korea and filings in the Financial Supervisory Service's DART system. The early repayment came as AI-related demand lifted memory prices and strengthened the company's cash position.

Thursday 20 August 2026
YMTC parent advances IPO as NAND share hits 14% and AI storage scales
Yangtze Memory Technologies Holding, the parent of Chinese NAND flash maker YMTC, has completed a key stage of its pre-IPO process just as the memory maker gains global market share, expands enterprise storage products and prepares another round of capacity growth.
Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained by memory availability. At the same time, capacity at the world's leading advanced chipmakers has been fully booked, turning packaging capacity and memory allocation into major challenges for the broader AI market.

Wednesday 19 August 2026
SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle

SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its own shares, the largest share buyback and cancellation ever undertaken by a company listed in South Korea.

Wednesday 19 August 2026
GigaDevice profit surges 1,092% on memory upcycle, niche DRAM and NAND gains
GigaDevice Semiconductor posted record first-half 2026 results, with tight memory supply and rising prices across niche products lifting earnings well beyond its full-year 2025 level.
Wednesday 19 August 2026
Samsung, SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term financial instruments by the end of the second quarter of 2026 as AI-driven memory demand lifted prices, revenue, and profit. The surge has shifted attention from earnings growth to how South Korea's two largest memory chipmakers will deploy their expanding financial firepower.