DIGITIMES Semiconductors: Memory chips news

Home Tech Semiconductors Memory chips

Friday 10 April 2026

SK Hynix M15X reportedly ramps early production

SK Hynix's M15X is widely viewed as the company's next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output and advanced 1b DRAM production, the facility is built for AI-era workloads. Its exact status remains partially unconfirmed, but recent media reports point to early production activity and faster-than-expected equipment installation.

Friday 10 April 2026

Ampak cites DDR price swings disrupting orders, sees industrial control demand support

Ampak Technology's focus on Wi-Fi 7, 5G RedCap, SoM modules, AIoT, and Edge AI signals strategic shifts with global implications: customers worldwide may see delayed consumer shipments amid DDR memory price volatility, while industrial control demand offers clearer near-term opportunities, affecting supply chains and product rollouts through 2026 and beyond.

Friday 10 April 2026

Demand for AI infrastructure spreads shortages beyond memory chips to MLCCs

As global corporations accelerate spending on artificial intelligence (AI) infrastructure, supply constraints are no longer limited to memory chips. Signs of tightening availability are now emerging in multi-layer ceramic capacitors (MLCCs), small but essential components used across a vast range of electronic systems. Lead times for these parts are lengthening across the industry, according to market data.

Friday 10 April 2026

CXMT targets 12-layer HBM production by 2027, closing gap with Korea

China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated by South Korean suppliers — all within three years of entering the segment.

Thursday 9 April 2026

Memory shortage persists, ASPs surge up to fivefold, says module maker chief

Memory prices are rising sharply, with Transcend Information chairman Peter Shu warning that supply-demand pressure will intensify through 2026 despite weakening consumer demand.

Thursday 9 April 2026

Samsung, SK Hynix pivot to long-term memory deals; Kioxia signals dividend confidence

Samsung Electronics and SK Hynix are reportedly shifting to multi-year memory supply agreements, marking a structural change in how the global memory industry prices, allocates, and plans capacity in the AI era.

Thursday 9 April 2026

Samsung P4 fab nears completion, expanding 1c DRAM capacity

Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According to ZDNet Korea, Samsung placed the orders in March 2026 for the two remaining phases of the four-phase P4 project.

Thursday 9 April 2026

Samsung profit jumps on memory rally, chips drive over 90% of earnings

Samsung Electronics posted record first-quarter 2026 results, with more than 90% of earnings tied to its memory business, underscoring the scale of the AI-driven memory upcycle.

Thursday 9 April 2026

CXMT IPO delay eases DRAM supply risks, supports pricing cycle

China's DRAM maker ChangXin Memory Technologies (CXMT) may be delaying its IPO, easing near-term supply concerns, and reinforcing the current memory upcycle. Sources cited by iNews24 said CXMT had targeted a first-half 2026 IPO to fund capacity expansion of 60,000–70,000 wafers annually. With the listing paused, both capital deployment and expansion timelines are likely to be delayed.

Thursday 9 April 2026

Phison Electronics sees AI-driven demand surge, downplays retail memory price swings

Phison Electronics reported consolidated revenue of NT$18.32 billion (approx. US$577.81 million) for March 2026, up 50% sequentially and 221% year over year, setting a new record high for a single month. Consolidated revenue for the first quarter of 2026 reached NT$40.97 billion, a 196% year-over-year increase, also marking a record high.

Thursday 9 April 2026

China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle

Global memory markets are entering a new restructuring cycle driven by AI demand, with China's YMTC and CXMT scaling capacity and state-backed investment to gain share in a sector long led by US, South Korean, and Japanese suppliers.

Thursday 9 April 2026

Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing

The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.

Thursday 9 April 2026

Transcend posts record March sales, 1Q26 revenue hits nearly 80% of 2025

Memory module maker Transcend reported a new monthly revenue high in March 2026 of NT$5.7 billion (approx. US$178.8 million), up 78.6% month-over-month and 3.8 times year-over-year. The company's consolidated revenue for the first quarter of 2026 reached NT$13.6 billion, marking the highest quarterly revenue in its history.

Thursday 9 April 2026

Apple hit by Mac shipping delays as DRAM shortage intensifies

Apple's US online store is currently showing extreme shipping delays of 4-5 months for several upgraded RAM configurations of the Mac mini and Mac Studio, highlighting a severe supply bottleneck in its high-end desktop lineup.

Thursday 9 April 2026

French President's visit reportedly links Mistral AI with Samsung for AI memory supply talks

French AI startup Mistral AI recently visited Samsung Electronics' campus to discuss collaboration on AI memory solutions. Industry analysts see this move as part of Mistral AI's push to build Europe's largest AI infrastructure, signaling Samsung as a key partner for memory chips.

Thursday 9 April 2026

Shanghai GTA Semiconductor teams up with Infineon on SONOS memory for automotive chips

Shanghai state-backed foundry GTA Semiconductor has partnered with Infineon Technologies to introduce SONOS-based embedded non-volatile memory (eNVM) into production, positioning itself more firmly in automotive and industrial chip supply chains.

Thursday 9 April 2026

Silicon Motion warns AI-driven NAND shortages will deepen in 2027, reshaping memory market

Silicon Motion said AI-driven NAND supply constraints are causing structural shifts in the memory industry and warned the imbalance will worsen in 2027 as cloud service provider demand outpaces capacity. The company expects growth across product lines in 2026 despite weakening mobile and consumer shipments.

Wednesday 8 April 2026

Adata, Team Group post record March sales, expect 40% contract price hike in 2Q26

Memory module giants Adata Technology and Team Group both reported record-high revenue for March 2026. Adata's monthly revenue surpassed NT$10.54 billion (approx. US$330.19 million), a rise of 47.09% from February and 181.48% year over year. Meanwhile, Team Group reported NT$4.92 billion in March revenue, surging 326.68% sequentially and 120.49% from a year earlier, setting new records for both monthly and first-quarter sales.

Wednesday 8 April 2026

China intervenes in memory supply; Apple outpaces local smartphone vendors

Memory shortages are pushing prices sharply higher, forcing a reshuffle across the consumer electronics market. Chinese authorities have intervened for a second time, convening domestic memory leaders CXMT and YMTC to provide "strategic support" aimed at stabilizing prices and containing supply chain costs for local brands. Yet with a wide supply-demand gap in DRAM and NAND flash, near-term price stabilization remains unlikely.

Wednesday 8 April 2026

Memory rally lifts Adata to record quarter, AI demand fuels outlook

Adata reported record monthly revenue in March, surpassing NT$10 billion (US$315 million) for the first time and lifting first-quarter revenue to NT$26.11 billion, up 1.6 times year-over-year and marking a new quarterly high.

Wednesday 8 April 2026

SK Hynix reportedly in talks with Microsoft and Google on long-term AI memory deals

After Samsung Electronics moved to secure long-term memory supply agreements with major technology companies, rival SK Hynix is now pursuing similar deals with leading artificial intelligence firms, including Microsoft and Google.

Wednesday 8 April 2026

Chinese SSD maker DapuStor sees rising QLC demand as AI drives storage growth

Chinese enterprise SSD (eSSD) maker DapuStor entered its IPO subscription phase in early April 2026, driven by rapid expansion in AI infrastructure. The company recently observed multiple downstream customers significantly revising their order forecasts upwards after the Lunar New Year holidays. DapuStor highlighted that QLC SSDs are becoming a key trend for North American and Chinese cloud service providers (CSPs) to ease cost and capacity pressures. Its 245TB product has officially reached customer sampling stages.

Wednesday 8 April 2026

Kioxia considers first dividend as long-term contracts shape global memory strategy

Kioxia Holdings, Japan's NAND flash memory producer, is exploring the possibility of paying its first dividend since listing in December 2024, reflecting confidence in its growing earnings amid rising memory prices, Nikkei reported. VP Yoshihiko Kawamura told Nikkei that the company is leaning toward a stable dividend rather than share buybacks, though the timing remains undecided. Kioxia plans to present its medium- to long-term capital allocation strategy — including growth investments and shareholder returns — at an investor briefing scheduled for June.

Wednesday 8 April 2026

SK Hynix begins supply of 321-layer QLC cSSD for the AI PC era

SK Hynix has started global shipments of a next-generation compact SSD designed for AI-driven personal computers, a move that could reshape storage choices for device makers and end users worldwide. The cSSD promises higher capacity and improved efficiency to meet growing demand for AI PC storage.

Wednesday 8 April 2026

Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround

Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.

More Memory chips coverage