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Wednesday 12 November 2025
Samsung Pyeongtaek P4 shifts to 1c DRAM production
Samsung will continue investment in the Phase 4 production line at its Pyeongtaek campus, converting the facility from foundry to 1c DRAM production. The latest monthly capacity is estimated at 80,000 wafers. Additionally, the previously postponed Phase 2 (Ph2) line is expected to resume investment in 2026 as a foundry production line.
Wednesday 12 November 2025
SK Hynix targets 70% DRAM profit margin amid supply crunch
The AI boom has caused memory giants to concentrate production on HBM, resulting in a shortage of general-purpose DRAM and high prices. According to Chosun Biz, DRAM prices are expected to continue rising as a product of the supply shortage. Analyses indicate that SK Hynix's general-purpose DRAM operating profit margin could reach 70%, drawing attention to its future developments.
Wednesday 12 November 2025
ChipMOS returns to profit as memory demand rebounds; chairman sees strong 2026 ahead
Taiwan-based semiconductor tester and packager ChipMOS Technologies swung back to profit in the third quarter of 2025, buoyed by a sharp rebound in memory demand. Chairman Shih-Jye Cheng said the company expects the momentum to strengthen further, predicting that 2026 will be "a good year across the board" for the memory industry.
Wednesday 12 November 2025
CXMT and Tesla's chip plans challenge South Korea's semiconductor lead
South Korea's semiconductor industry, boosted by AI-driven HBM memory demand, faces challenges as China's CXMT speeds up HBM3 production and Tesla plans to create its own wafer fab for chip self-sufficiency.
Wednesday 12 November 2025
Micron reallocates CHIPS Act funds to Idaho, delaying New York fabs
US memory giant Micron will postpone the commissioning of its first two fabs in Clay, New York, by 2–3 years and will reallocate part of the funding from the CHIPS and Science Act to accelerate construction of a new fab in Boise, Idaho.
Wednesday 12 November 2025
SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance
SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets, according to Korean industry media, including ET News and G-ENews.
Tuesday 11 November 2025
YMTC expands Wuhan production with third fab, targets global top-four memory ranking by 2027

YMTC has begun constructing its third semiconductor plant in Wuhan, with mass production slated for 2027, while ramping up output at its second facility. Despite its strong domestic focus, industry insiders expect the company to rank among the world's top five memory makers within two years.

Tuesday 11 November 2025
China's IC exports surged 24.7% in first ten months of 2025, driven by AI demand and memory price hikes
China's total goods trade value reached CNY37.31 trillion (approx. US$5.23 trillion) in the first ten months of 2025, marking a 3.6% increase from the same period last year, according to the General Administration of Customs. Exports rose 6.2% to CNY22.12 trillion, while imports remained steady at CNY15.19 trillion.
Monday 10 November 2025
AI drives shift to memory-centric computing, redefining semiconductor supply chains
The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models grow to handle longer contexts, multi-turn dialogues, multimodal inputs, and advanced tool integration, the primary bottlenecks are no longer processing speed but memory bandwidth and latency, according to industry experts.
Monday 10 November 2025
China's memory squeeze deepens: NOR flash prices jump, Puya expands into 2D NAND

Following back-to-back price increases for DRAM and NAND, NOR flash has become the next segment to spike. Prices are up by at least 10% this quarter, with certain models surging over 30% in under a month, signaling a new round of broad-based memory price escalation.

Monday 10 November 2025
Macronix sees rising NOR, NAND, and eMMC demand amid memory market recovery
Macronix International is witnessing a strong rebound in demand for its NOR, NAND, and eMMC memory products, with chairman Minin Wu highlighting growing market opportunities as the overall memory sector recovers.
Monday 10 November 2025
NAND prices double in six months; Phison CEO predicts years-long shortages
The global boom in artificial intelligence has triggered a severe shortage of essential storage chips, doubling prices in just six months, according to Khein-Seng Pua, CEO of Phison Electronics.
Monday 10 November 2025
Memory module makers expect supply shortage and price surge to extend into 2026
Rising memory prices and volumes are driving a strong finish for memory module manufacturers in 2025, with Taiwanese module leaders optimistic that the boom will continue through 2026. Transcend chairman Peter Shu highlighted that while DDR4 DRAM has seen the largest price increase since the start of 2025, DDR5 and NAND Flash shortages have only just begun.
Monday 10 November 2025
Weekly news roundup: LGES probes tech Theft; ASML pivots in China; Samsung sparks market chaos; Nexperia feud explodes
Below are the top DIGITIMES Asia stories from November 3 to November 10, 2025.
Monday 10 November 2025
Etron chairman outlines vision for Taiwan's next competitive edge
Etron Technology chairman Dr. Nicky Lu predicts AI-driven memory demand to enter a peak spring period between 2026 and 2027, but supply and demand will not be balanced for at least another six months to a year. Contrary to popular belief, AI will not become a bubble, and it will continue to grow. According to Dr. Lu, Taiwan should use an AI + NI (Natural Intelligence) strategy to build new advantages and should establish a sovereign R&D research center.
Sunday 9 November 2025
SK Hynix pushes 1C DRAM for HBM4E as AI memory demand surges
South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4), according to ETNews and The Seoul Economic Daily.
Friday 7 November 2025
SanDisk reportedly hikes NAND prices 50% as memory module makers post strong results
Memory prices have sharply rebounded in the third quarter of 2025, supported by increases in both volume and unit prices, boosting financial results for leading memory module manufacturers. Companies including Transcend, Innodisk, and Apacer Technology reported substantial year-on-year and sequential growth in revenue and net profit.
Friday 7 November 2025
Memory price surge amid supply tightness pressures Chinese smartphone makers
The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure on Chinese smartphone brands and retailers.
Friday 7 November 2025
HDD delivery delays extend to 2 years as QLC NAND capacity sells out early
The surge in storage demand driven by AI servers has caused a severe shortage of traditional hard disk drives (HDDs), with delivery times reportedly extending beyond two years. Major cloud service providers (CSPs) in North America and China are urgently increasing orders for high-capacity enterprise solid-state drives (SSDs). Some manufacturers' 2026 QLC NAND Flash production capacity has already been fully pre-purchased, prompting industry forecasts that global QLC bit shipments could surpass TLC NAND as early as 2027.
Friday 7 November 2025
CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology employed by South Korea's SK Hynix, now the global HBM leader.
Friday 7 November 2025
AI-driven chip shortages disrupt connector and power supplies
The global semiconductor industry is facing widening supply-demand imbalances amid the AI boom, with memory and processor chips in particularly short supply. Prices have surged while availability remains constrained, creating a shortage that has disrupted order patterns among major brands and fueled uncertainty across downstream sectors, including power supply and connector manufacturers.
Friday 7 November 2025
Samsung Galaxy S26 prices may increase because of memory demand surge
Every year's new flagship phones bring questions regarding pricing. This year, Samsung's Galaxy S26 series is expected to see a price increase from its predecessor. As the memory market heats up and core component prices increase, smartphone makers are facing cost pressures.
Friday 7 November 2025
Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources expect this equipment to be officially adopted starting with the eighth-generation HBM5.
Thursday 6 November 2025
SK Hynix tight-lipped on Nvidia supply terms as HBM4 prices climb
SK Hynix has reportedly increased the price of its sixth-generation high-bandwidth memory (HBM4) supplied to Nvidia by over 50% compared to the previous generation HBM3E. Industry sources say this successful pricing negotiation with Nvidia will further solidify SK Hynix's dominant position in the HBM market and drive revenue growth.
Thursday 6 November 2025
Winbond's DRAM bit supply to double as structural shortage extends through 2027
Continuous upgrades in memory technology have created a structural imbalance in supply and demand. Nevertheless, memory supplier Winbond Electronics delivered strong earnings in the third quarter of 2025. General manager Pei-Ming Chen stated that some customers are even seeking DDR4 long-term contracts of up to six years, and this structural shift is expected to last through 2027.