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Friday 23 January 2026
SEALSQ, Gujarat govt, and Kaynes SemiCon sign MoU to establish India's first secure post-quantum semiconductor center
SEALSQ Corp, a developer of semiconductors and post-quantum technology solutions, announced on January 21, 2026, that it has signed a non-binding Memorandum of Understanding (MoU) with the Government of Gujarat and Kaynes SemiCon Private Limited, a subsidiary of Kaynes Technology India Limited. The agreement outlines plans to develop India's first Secure Semiconductor Design, Test, and Personalization Center focused on post-quantum cryptography technologies.
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific integrated circuits (ASICs), its subsidiary Universal Scientific Industrial (USI) is also expanding in optical communications. USI recently announced that it has completed the acquisition of a controlling stake in Chengdu-based EugenLight Technologies.
Friday 23 January 2026
India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
At the recent World Economic Forum in Davos, India's IT Minister outlined the country's efforts to boost its semiconductor industry, highlighting the emergence of 24 Indian IC design startups, with 18 benefiting from venture capital investments. This underscores India's drive to reclaim a significant role in integrated circuit design amid concerns over ongoing talent migration to foreign firms.
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile profitability, and cautious guidance suggest near-term pressure remains, keeping investor focus squarely on execution and the pace of recovery, which Intel attributed to tight supply across the industry.
Friday 23 January 2026
Lip-Bu Tan faces Intel's first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue to limit near-term revenue and profitability, keeping the company's turnaround highly dependent on execution through 2026.
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments on hold until customer demand is secured.
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking most-favored-nation (MFN) rates. This makes Taiwan the first country to secure tariff relief under Section 232. Both sides also plan to expand supply chain investment cooperation. Hsu called this a very positive outcome for Taiwan's overall industry and said it has eased market concerns.
Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.
Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

Thursday 22 January 2026
Why Intel poached a Qualcomm GPU chief to bet on AI graphics

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.

Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Wednesday 21 January 2026
Siemens acquires ASTER to strengthen PCBA test and DFM capabilities
Siemens has acquired ASTER Technologies, a privately held provider of printed circuit board assembly (PCBA) test verification and engineering software, as it moves to expand its electronic design automation (EDA) portfolio. Financial terms of the deal were not disclosed.
Wednesday 21 January 2026
Jabil invests in semiconductor power systems, expanding chipmaking footprint
Jabil Inc., the global manufacturing and supply-chain services company, said on Tuesday that it had made a strategic minority investment in Eagle Harbor Technologies, a Seattle-based developer of advanced power systems for semiconductor manufacturing, and would partner with the company on production.
Wednesday 21 January 2026
Intel recruits Qualcomm GPU chief to lead future AI PC efforts
Intel has poached Eric Demers, a veteran GPU architect, known for developing Qualcomm's proprietary Adreno GPU architecture. Demers will become Intel's senior vice president of GPU engineering. This suggests that even though Intel has long been unable to compete with Nvidia and AMD in the GPU market, it still hopes to strengthen its own GPU capabilities.
Tuesday 20 January 2026
AI server watch: AI servers lift Taiwan supply chain broadly in 2025, gains center on ODM/EMS, cooling, optical
Taiwan's AI server supply chain delivered broad-based growth in 2025, fueled by surging generative AI and cloud data center spending, but the biggest gains clustered around two areas: system-level integration led by original design manufacturer (ODM)/electronics manufacturing services (EMS) manufacturers, and a set of high-power, AI-specific components—especially thermal solutions, rack hardware, and high-speed optical interconnect.
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical communications have advantages in energy efficiency and high transmission speeds, there remains three major technical challenges that have yet to be standardized before related chip products are formally launched. These issues will need to be addressed as the industry transitions from electrical to optical communications.
Tuesday 20 January 2026
Apple, Qualcomm, MediaTek align on 2nm chips in 2026 as specs lose consumer appeal
Apple Inc., Qualcomm Inc., and MediaTek are all set to advance their smartphone system-on-chip (SoC) offerings to the 2nm process node in 2026. This coordinated move signals the three giants' determination to maintain technological leadership, even as the incremental benefits of process improvements come under scrutiny.
Tuesday 20 January 2026
Taiwan IC designers wager on algorithms for the next boom
Taiwanese integrated circuit design houses used the 2026 Consumer Electronics Show in the US to seek new partnerships, signaling that success in the next phase of edge artificial intelligence will depend as much on software and algorithms as on silicon.
Tuesday 20 January 2026
Taiwanese PMIC makers see stable demand in industrial, automotive sectors as global focus shifts
Demand for power management integrated circuits (PMICs) from Taiwanese manufacturers is showing signs of stabilization, particularly in cloud AI servers, industrial control, and automotive markets, industry sources said. While consumer applications continue to experience seasonal declines, leading global PMIC players are concentrating on higher-end fields, creating opportunities for Taiwanese firms to expand.
Tuesday 20 January 2026
Smartphone chips hit 2nm in 2026. The real shock is the cost
Leading smartphone system-on-chip (SoC) manufacturers will fully adopt the 2nm process node in 2026, a move expected to significantly increase production costs and reshape competitive dynamics beyond flagship devices.
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
OpenAI taps Cerebras for US$10 billion AI chip buildout
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online in phases starting in 2026. Construction is expected to begin this year and continue through 2028.
Monday 19 January 2026
Commentary: US and Taiwan finalize tariff deal, securing favorable terms for semiconductor exports

The US and Taiwan have formally concluded a tariff agreement that sets a 15% rate on covered goods, alongside a sweeping package of Taiwanese commitments aimed at deepening ties with the American semiconductor industry. Under the deal, Taiwan will make US$250 billion in direct investment in US semiconductor manufacturing, while its government will provide an additional US$250 billion in credit guarantees.

Monday 19 January 2026
OpenAI and Cerebras reach US$10 billion agreement to reduce Nvidia dependence
OpenAI has reached a multi-year compute procurement agreement worth more than US$10 billion with AI chip startup Cerebras Systems, with the intention to enhance ChatGPT performance and reduce its reliance on Nvidia. According to The Wall Street Journal and Bloomberg, OpenAI said in a statement that it has committed to purchasing up to 750 MW of computing capacity from Cerebras by 2028. Contract terms were not disclosed, but people familiar with the matter said the deal value exceeds US$10 billion.
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing specification upgrades, and intensifying competition from Chinese rivals have sharply raised pressure on local suppliers.