On December 10, 2025, Qualcomm Inc. disclosed its acquisition of Ventana Micro Systems in the US without revealing the deal's financial terms or completion date. The company highlighted...
Qualcomm is in talks with Samsung Electronics over contract manufacturing of 2nm chips, a move that could reportedly support Samsung's loss-making foundry business as customers reassess...
At its earnings call on January 15, 2026, TSMC signaled that its capital expenditures for 2026 will increase to US$52-56 billion, far exceeding market expectations. On top of demand...
The 2026 Consumer Electronics Show (CES 2026) has concluded, with global IC design leaders including Nvidia, Qualcomm, and Advanced Micro Devices focusing on automotive and robotics...
DIGITIMES has recently published three latest research reports regarding Qualcomm's cloud AI ASIC business strategy for 2026, the status of the worldwide top-3 memory makers, plus...
Market sources say Xiaomi is expanding its in-house XRing chip lineup. Beyond developing the next-generation XRing O2 on TSMC's N3P process, the company also plans to extend these...
At CES 2026, chipmakers remained at the center of attention. Nvidia CEO Jensen Huang and AMD CEO Lisa Su both delivered keynote speeches, while Lenovo hosted a major event at the Sphere,...
At CES 2026, Qualcomm Technologies highlighted new collaborations and growing adoption of its Snapdragon Digital Chassis solutions, aiming to advance software-defined vehicles (SDVs)...
Volkswagen Group and Qualcomm Technologies have announced a Letter of Intent (LOI) for a long-term supply agreement to provide advanced infotainment and connectivity solutions for...
Qualcomm is reportedly in talks with Samsung Electronics about contract manufacturing of next-generation 2nm chips, discussions that could support Samsung's efforts to revive its loss-making...
Qualcomm Inc. introduced its Snapdragon X2 Plus platform at CES 2026, the newest addition to the Snapdragon X series aimed at professionals, emerging creators, and regular users. The...
At CES 2026, MediaTek unveiled its next-generation Wi-Fi 8 chipset platform, the Filogic 8000 series, moving ahead of rivals by declaring its position early in the next wireless standards...
Innodisk is targeting the growing edge AI market through a joint development with Qualcomm, introducing an 'AI on Dragonwing' computing solution. Its first product, the EXMP-Q911 COM-HPC...
Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series processor for advanced industrial autonomous mobile...
