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Friday 22 May 2026
AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
Friday 22 May 2026
Nvidia's rapid AI iteration cycle strains supply chain partners
Nvidia's record revenue, profit, and margins are masking growing strain across its supply chain, as increasingly compressed product cycles and surging AI demand force suppliers to...
Thursday 21 May 2026
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
Wednesday 20 May 2026
Anthropic loosens Mythos secrecy rules for AI threat sharing

Anthropic has revised its confidentiality policy to allow partners testing its Claude Mythos model to share threat intelligence with other...

Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
Foundry, test costs push PMIC price hikes toward 12-inch wafers
Rising manufacturing costs at upstream foundries and back-end packaging and testing are pushing power management IC (PMIC) makers toward price increases, with global implications for...
Tuesday 19 May 2026
XPeng introduces mass-produced Robotaxi built on in-house AI chips
XPeng unveiled its first mass-produced robotaxi on Tuesday, marking a major milestone in China's rapidly accelerating race to commercialize Level 4 autonomous driving.
Monday 18 May 2026
Memory shortage gives Team Group room to favor long-term customers

Team Group Chairman Dann-Ning Hsia said memory prices are likely to remain elevated as AI-related demand continues to strain supply,...

Sunday 17 May 2026
Taiwan chipmakers quietly fill gaps left by Korea's HBM push
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
Friday 15 May 2026
Memory maker Biwin reapplies for listing on Hong Kong Stock Exchange
Biwin Storage Technology recently resubmitted its listing application to the Hong Kong Stock Exchange again, with Huatai Financial Holdings acting as the sole sponsor. The Chinese...
Friday 15 May 2026
Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
Thursday 14 May 2026
AI chip boom drives record growth for Taiwan testing firm MPI
With surging demand for artificial intelligence, high-performance computing, and custom AI chips, MPI Corporation said strong momentum in semiconductor testing equipment and testing...
Thursday 14 May 2026
Khgears deepens robot supply chain role as smart transmission tops 10% of revenue
Khgears International said it has expanded its robot-related supply chain presence, with smart transmission products accounting for more than 10% of revenue in the first quarter of...
Thursday 14 May 2026
AP Memory profit nearly doubles as S-SiCap shipments and IoTRAM ramp drive revenue
AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor...
Wednesday 13 May 2026
ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...