As demand for computing power from AI large language models (LLMs) continues to surge, power density in data centers is rising in tandem, bringing the conversion losses of traditional...
Ablecom announced its ABLERACK AI server rack solution, positioning it in the L11 domain and offering an integrated design for manufacturing services that combine energy efficiency,...
Despite persistent noise in the memory market, leading memory chipmaker Macronix reported a sharp surge in profitability in January 2026. The company posted preliminary pre-tax net...
Blowout earnings from TSMC in 2025 — and an even more bullish outlook for 2026 — have reignited investor enthusiasm across the global semiconductor sector. Attention is...
Taiwan's IC packaging and testing supply chain is accelerating expansion as Sigurd announced it will invest NT$1.54 billion (approx. US$49M) to purchase a factory in the Hukou Industrial...
ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...
The rapid development of AI and high-performance computing (HPC) chips is providing long-term demand support for the semiconductor advanced testing interface supply chain, driving...
Semiconductor test interface component manufacturer Certain Micro Application Technology (CMAT) announced during a media gathering that it will officially begin trading on the Taipei...
Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider...
Taiwan's AI server supply chain started 2026 on firmer footing, according to January revenue data from 14 PCB, CCL, ASIC design, and IC testing firms. Year-over-year growth confirms...
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
Taiwan's Ministry of Transportation and Communications (MOTC) said it will remove longstanding import quantity limits on US-spec vehicles, a move officials frame as aligning trade...
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
