News tagged testing at DIGITIMES

NEWS TAGGED TESTING

Saturday 27 June 2026

JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026

ShunSin sees CPO potential, adds TSMC veterans as independents

ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...

Friday 26 June 2026

Teradyne expands India focus with new country manager

US-based automated test equipment supplier Teradyne plans to expand its presence in India and has appointed Alpa Sood as India Manager, as the company seeks to deepen engagement in...

Friday 26 June 2026

Academia Sinica targets quantum chip manufacturing scale with Taiwan's semiconductor tool base

Academia Sinica's Center for Quantum Computer is focusing only on hardware, not algorithms or applications, and executive director Chii-Dong Chen said that approach is similar to the...

Thursday 25 June 2026

Taiwan electronics production jumps 93% in first five months of 2026 on AI boom

Taiwan's Ministry of Economic Affairs (MOEA) released industrial production statistics for May 2026 on June 24, reporting that Taiwan's computer, electronic products, and optical products...

Thursday 25 June 2026

EU clears EUR76M in German aid for Munich quantum chip-testing plant

The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing...

Thursday 25 June 2026

Sigurd expands AI testing capacity as demand keeps facilities full

Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains...

Thursday 25 June 2026

ASE sees AI demand stretching packaging capacity into 2030

ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...

Thursday 25 June 2026

TSMC-Amkor alliance jolts packaging map as ASE races to expand

The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...

Thursday 25 June 2026

IC design firms race to secure packaging capacity

IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...

Wednesday 24 June 2026

Column: Physical AI commercialization's safety gap

The race to commercialize physical AI and autonomous robots is running into a fundamental challenge: existing robot safety frameworks...

Tuesday 23 June 2026

Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Tuesday 23 June 2026

Mildex Optical eyes new revenue from pet biosensor chip with mass production slated in 2H26

Mildex Optical has begun clinical testing of a pet degenerative arthritis biosensor in Taiwan, a development that could eventually broaden point-of-care diagnostics for animal care...

Monday 22 June 2026

Panjit upgrades hot swap tech to drive 2H26 growth

AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...

Monday 22 June 2026

MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook