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Thursday 30 July 2026
ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...
Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
India launches homegrown silicon photonics tools to widen access for researchers and industry

India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...

Thursday 30 July 2026
Greatek sees sustained AI demand, plans Philippines packaging plant acquisition
Greatek's latest investment and capacity plans signal how AI-driven semiconductor demand is rippling beyond Taiwan, with implications for global device makers, automakers, and industrial...
Wednesday 29 July 2026
Coretronic Intelligent Logistics plans AI logistics demo at AI Wave Show 2026
Coretronic Intelligent Logistics said generative AI and agentic AI technology are pushing smart logistics beyond process automation and toward autonomous decision-making. The company...
Wednesday 29 July 2026
Shield AI and GE Aerospace complete X-BAT engine tests for late-2026 flight

Shield AI and GE Aerospace said on July 20 that they had completed integration, actuation and engine ignition testing for the Axisymmetric...

Wednesday 29 July 2026
OpenAI plans to test first hardware device in South Korea
OpenAI's CEO Sam Altman has said that the company may use South Korea as a testbed for its first hardware device, widely believed to be a screenless speaker. However, it remains to...
Wednesday 29 July 2026
Powertech posts record second-quarter revenue and targets a 2026 sales high
Powertech Technology reported second-quarter 2026 revenue of NT$23.116 billion, up 8.5% from the previous quarter and 28% from a year earlier. The Taiwan-based memory and testing provider...
Tuesday 28 July 2026
China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment
China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor...
Monday 27 July 2026
India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million)...
Wednesday 22 July 2026
CPO commercialization opens new SiPh packaging race for Taiwan OSATs

Exploding demand for AI server computing power is pushing data-center architectures to upgrade at a faster pace, and the traditional...

Wednesday 22 July 2026
HKC invests US$590M in advanced chip packaging to escape the LCD cycle

HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Friday 17 July 2026
TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...