News tagged testing at DIGITIMES

NEWS TAGGED TESTING

Saturday 15 November 2025

Taiwan's AutoSys turns self-driving Algorithms into next-gen AI exports

As one of the most demanding testing grounds for AI, autonomous driving technology has become a high-security laboratory where next-generation...

Friday 14 November 2025

AI chip test interface demand surges; Taiwan orders visible through 2026

As AI ASIC makers accelerate the release of next-gen chips to catch up with AI GPU leaders, industry observers expect a major shift in the AI chip landscape by 2026. This transformation...

Friday 14 November 2025

DDR5 becomes 2026 standard, and power-control overhaul lifts passive component market

The memory market's ongoing shortage-and-price surge continues to accelerate, lifting the broader sector and boosting earnings for DRAM manufacturers, module suppliers, memory packaging...

Thursday 13 November 2025

Tanaka develops rhodium probe pin material for semiconductor testing

Tanaka Precious Metal Technologies has developed TK-SR, a rhodium-based material for probe pins used in probe cards during semiconductor front-end testing.

Thursday 13 November 2025

Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

Tuesday 11 November 2025

G-Tech Optoelectronics develops aerospace-grade glass conformal antenna with US defense partner

G-Tech Optoelectronics (GTOC), a glass processing subsidiary of Foxconn, has announced a joint development project with a US-based partner for an aerospace-grade glass conformal antenna...

Wednesday 5 November 2025

KYEC secures triple AI chip testing contracts, expands production in Taiwan and Singapore

The global race to build next-generation AI computing power is accelerating, and Taiwan’s King Yuan Electronics Corp. (KYEC) has emerged as a key winner.

Monday 3 November 2025

Nexperia China accuses Dutch parent of US$140 million debt

The Chinese arm of Dutch semiconductor maker Nexperia has publicly accused its headquarters of owing more than CNY1 billion (approximately US$140 million) in unpaid fees, escalating...

Monday 3 November 2025

Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam

Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.

Monday 3 November 2025

Tong Hsing Electronics eyes growth engines to revive 2026 operations

Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...

Monday 3 November 2025

Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...

Saturday 1 November 2025

Nvidia emerges as TSMC's first A16 customer, while Apple may skip to A14

Taiwan Semiconductor Manufacturing Company (TSMC) plans to launch its latest 1.6nm process, dubbed A16, in 2027. Reports indicate that Nvidia is currently working with TSMC on testing...

Friday 31 October 2025

AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...

Friday 31 October 2025

ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...

Friday 31 October 2025

ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25

ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...

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SK Group partners with OpenAI to advance global AI infrastructure

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