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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    3h 35min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    3h 35min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    3h 35min ago
    AI buildout lifts demand for China high-speed optical module makers
    3h 36min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    3h 36min ago
    NEWS TAGGED TESTING
    Wednesday 2 September 2026
    Certain Micro targets AI test-interface demand with three Semicon products
    As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...
    Wednesday 2 September 2026
    Innolux targets advanced packaging with debut of Chip Last tech
    Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains

    As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

    Tuesday 1 September 2026
    China's Xenomi LLM brings quantum computing into AI agent decision-making
    China is testing a new route for combining quantum computing with generative AI, moving beyond model training toward the decision layer used by AI agents. Beijing Guoguang Liangchao...
    Monday 31 August 2026
    India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
    India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
    Friday 28 August 2026
    Winstar's AI push gains momentum with some orders extending into 2027
    Winstar Display is accelerating its expansion into AI applications, with its products already integrated into data centers, power management systems, controllers, testing equipment,...
    Friday 28 August 2026
    AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

    The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

    Friday 28 August 2026
    Insight: China's next AI frontier is silicon, not smarter models
    For the past two years, China's AI companies have competed on a single axis: whose model performs best. That contest is starting to give way to a harder one — whether those models...
    Thursday 27 August 2026
    HTSI targets AI chip demand with SiPh, CPO, packaging push
    Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
    Thursday 27 August 2026
    5G-A low-latency breakthrough paves way for Physical AI, XR
    Advances in low-latency and zero-latency wireless communications are seen as a critical foundation for physical AI, remote control, virtual reality (VR), augmented reality (AR), and...
    Thursday 27 August 2026
    Samsung Galaxy A1 DDI packaging shifts to Chipbond
    Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
    Thursday 27 August 2026
    Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
    Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
    Wednesday 26 August 2026
    India chip manufacturing push exposes production-test skills gap, NI says
    India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...
    Wednesday 26 August 2026
    India mmWave opportunity emerges; Gemtek moves early
    India has continued to push next-generation communications infrastructure, and the Telecommunication Engineering Centre (TEC) under the Department of Telecommunications (DoT) has officially...
    Tuesday 25 August 2026
    OpenAI narrows gap as Anthropic's Fable 5 loses enterprise momentum
    OpenAI has been gaining ground on Anthropic in enterprise AI spending, while Anthropic's flagship Claude Fable 5 has delivered less market traction than expected. The shift comes as...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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