Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei...
Taiwan has launched its first proof-of-concept project for shifting renewable electricity through energy storage, a move that could give companies worldwide a model for managing mismatches...
The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing...
Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman...
Amazon recently demonstrated its low Earth orbit communications satellite network, Amazon Leo, at a test site in Aberdeen, Maryland, testing high-speed connectivity in a tactical environment...
TECO Electric and Machinery chairman Morris Li said the company has entered the final stage of testing its modular data center (MDC) solution. The company is targeting opportunities...
ByteDance's AI research unit Seed has established an Alignment & Preparedness department and is recruiting 10 researchers in Beijing, Shanghai, and San Jose, California, to focus...
Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability,...
Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial...
US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Strong global demand for AI infrastructure hardware is prompting buyers to secure capacity through advance payments and long-term contracts, driving Taiwan's semiconductor, packaging...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production...
