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Thursday 17 September 2026
Charts: Taiwan's chip packaging growth runs deeper than ASE

Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Samsung reportedly weighs Micron's newest memory for Galaxy S27
Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, as rising costs around next-generation mobile DRAM...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous...
Tuesday 15 September 2026
XPeng's Turing chip expands beyond cars
XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
Monday 14 September 2026
AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
Monday 14 September 2026
Aurotek posts record August revenue on semiconductor, robot shipments

Taiwanese robotics component maker Aurotek attributed its strong revenue growth in August 2026 to continued robust customer pull-ins...

Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement...

Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment...
Sunday 13 September 2026
Taiwan's BTL builds new plant for high-power AI server testing, eyeing 4Q27 launch
Electronic testing and certification provider BTL Inc. has kicked off construction plans for Guishan Plant 3. The expansion targets high-power testing capacity for AI server systems,...
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026

Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY,...

Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
Friday 11 September 2026
Academia Sinica to open 8-inch quantum chip platform in September 2026

Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking...