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Monday 6 July 2026
FCC rule change drives Sporton to a three-year revenue high
Sporton, a high-end testing services provider, reported June 2026 revenue of NT$417 million (US$13.05 million), up 0.5% from the previous month and 12.7% from a year earlier. The increase...
Monday 6 July 2026
LG Chem begins first mass supply of semiconductor strippers to Amkor

LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...

Monday 6 July 2026
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...

Monday 6 July 2026
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging...
Monday 6 July 2026
Transcom lifts 2Q26 revenue 29% on defense and satellite demand
Transcom Technology reported June 2026 revenue of NT$78.05 million (US$2.44 million), up 30.78% from the prior month, and second-quarter revenue of NT$228 million, up 28.63% from the...
Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...
Saturday 4 July 2026
China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes

China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and...

Friday 3 July 2026
Ubtech's U1 companion robots test whether China is ready for AI intimacy

Ubtech has launched the U1 series, its first mass-produced full-size bionic humanoid robot line, under the U World sub-brand, testing China's...

Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...
Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
Tuesday 30 June 2026
Forget prompts: Nvidia's Huang sees 'loop engineering' as AI's next frontier

Nvidia chief executive Jensen Huang is drawing attention to a new AI concept called loop engineering, which shifts emphasis from writing...

Monday 29 June 2026
Taiwan's first homegrown submarine enters dive trials ahead of handover; shipbuilder eyes unmanned boat contracts

Taiwan's first domestically built submarine, Haikun, has entered submergence testing and is on track to be handed over to the navy...

Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Monday 29 June 2026
Taiwan electronics sector stays upbeat as AI demand lifts exports
Taiwan's electronics-machinery sector is heading into the second half of 2026 with cautious optimism, as global demand for AI infrastructure, high-end semiconductors, and cloud services...
Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...