Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
Taiwan's semiconductor test supply chain is experiencing strong growth driven by increased demand for AI and HPC chips, industry sources report. Close collaborations with foundries...
Apple has long built its brand around a tightly integrated hardware and services ecosystem. In AI and high-performance computing (HPC), however, the platform has been limited by the...
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates...
Taiwan's Ministry of Economic Affairs (MOEA) reported on January 20, 2026, that strong demand for IC manufacturing and AI servers propelled export orders to new heights in December...
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
TSMC held its earnings conference call on January 15, 2026, and guided for the first quarter. The company expects revenue to range between US$34.6–35.8 billion. Gross margin...
Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
Taiwan's outsourced semiconductor assembly and test (OSAT) industry closed December 2025 with a pattern that investors have increasingly come to expect: revenue growth was widespread...
Chunghwa Precision Test Tech (CHPT) said that although revenue in December 2025 and the fourth quarter both declined compared with the same period in 2024, overall full-year performance...
