CONNECT WITH US
NEWS TAGGED NAND
Friday 7 November 2025
SanDisk reportedly hikes NAND prices 50% as memory module makers post strong results
Memory prices have sharply rebounded in the third quarter of 2025, supported by increases in both volume and unit prices, boosting financial results for leading memory module manufacturers...
Friday 7 November 2025
Memory price surge amid supply tightness pressures Chinese smartphone makers
The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure...
Friday 7 November 2025
HDD delivery delays extend to 2 years as QLC NAND capacity sells out early
The surge in storage demand driven by AI servers has caused a severe shortage of traditional hard disk drives (HDDs), with delivery times reportedly extending beyond two years. Major...
Thursday 6 November 2025
Samsung's HBM4 yields surge toward Nvidia certification, SK Hynix keeps edge
Nvidia's evaluation of sixth-generation high-bandwidth memory (HBM4) has sparked a fierce contest among suppliers. ETNews reports that the company plans to finish testing...
Wednesday 5 November 2025
SK Hynix redefines AI memory architecture with 2031 'full stack' vision
At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker...
Monday 3 November 2025
Panic-fueled shortage in memory chips worsens as AI demand overwhelms supply
Silicon Motion Technology's president and CEO, Wallace Kou, has highlighted a severe and ongoing memory shortage, driven by structural changes in the memory industry caused by artificial...
Monday 3 November 2025
Silicon Motion beats guidance with strong revenue on growing NAND demand
Silicon Motion Technology reported strong financial results for the third quarter of 2025, driven by robust demand in the NAND flash memory market. The company posted revenue of US$242...
Friday 31 October 2025
Lam Research ramps up ultra-low temperature etching for next-generation 1,000-layer NAND
As demand for cloud and edge AI accelerates, high-capacity storage is becoming increasingly critical. Lam Research has announced stable mass production of its next-generation ultra-low...
Thursday 30 October 2025
MXIC chair vows comeback after ninth straight quarterly loss
Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly...
Wednesday 29 October 2025
SK Hynix unveils new NAND line featuring HBF for AI
SK Hynix has launched a new NAND flash product family called "AIN Family," targeting the artificial intelligence (AI) market with a focus on overcoming storage bottlenecks in AI inference...
Wednesday 29 October 2025
SK Hynix's AI hot streak: record earnings, HBM4 next
SK Hynix achieved its strongest quarterly results on record in the third quarter of 2025, driven by surging demand for AI-related memory and higher DRAM and NAND prices. The company...
Wednesday 29 October 2025
SK hynix Announces 3Q25 Financial Results

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recorded 24.4489 trillion won in revenues, 11.3834 trillion won in operating profit (with...

Tuesday 28 October 2025
China's CXMT, YMTC power into AI memory super cycle
The global memory market is entering a "super cycle" driven by the booming adoption of AI, data center upgrades, and growing demand for high-performance computing (HPC). With inventories...
Monday 27 October 2025
SK hynix Presents Next Generation NAND Storage Product Strategy at OCP 2025
SK hynix Inc. announced today that it presented its next-generation NAND storage product strategy at the '2025 OCP (Open Compute Project) Global Summit', held in San Jose, California,...
Friday 24 October 2025
Samsung CTO: Cross-disciplinary collaboration key to semiconductor innovation
Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies...