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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    Aug 10, 17:26
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    Aug 10, 17:26
    Google readies Pixel 11 lineup, market breakthrough still under question
    Aug 10, 17:26
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    Aug 10, 17:25
    China auto brand slump pushes parts makers toward North America, Japan
    Aug 10, 17:25
    Taiwan producer prices surge as non-China supply chains face rising pressure
    Aug 10, 17:25
    NEWS TAGGED NAND
    Monday 10 August 2026
    SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

    SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

    Monday 10 August 2026
    SK Hynix faces US patent fight over HBM, 3D NAND

    SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

    Monday 10 August 2026
    Adata sees memory uptrend extend into 1H27
    Adata posted record-high revenue and profit in the second quarter of 2026 and said memory supply remains tight. The company expects third-quarter operating performance to outperform...
    Monday 10 August 2026
    Winbond sees tighter memory supply and bigger expansion payoff ahead
    Winbond Electronics said rising prices and stronger shipments lifted its operating margin to 48.4% in the second quarter of 2026, and it expects the third-quarter margin to top 50%,...
    Sunday 9 August 2026
    Macronix, Winbond post record July revenue as memory prices rise
    Taiwan memory chipmakers Macronix International and Winbond Electronics both posted record monthly revenue in July, extending strong second-quarter momentum as tight supply and rising...
    Friday 7 August 2026
    SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
    SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1...
    Friday 7 August 2026
    SK Hynix's Solidigm weighs up to US$7 billion in pre-IPO funding

    Solidigm, SK Hynix's US NAND and enterprise storage unit, is weighing a pre-IPO funding round of KRW5 trillion to KRW10 trillion, roughly US$3.5 billion to US$7 billion,...

    Friday 7 August 2026
    Huawei's Richard Yu warns of smartphone price hikes as memory costs soar
    Huawei executive director and Consumer Business Group chairman Richard Yu warned on August 5 that sharply rising memory costs could trigger widespread smartphone price increases, saying...
    Thursday 6 August 2026
    Sandisk leans on multi-year supply deals as it bets on AI-driven NAND supercycle
    Sandisk closed its fiscal 2026 with record revenue, gross margin, and earnings per share. Still, the bigger story for investors is how much of the company's future business is now...
    Thursday 6 August 2026
    Sandisk's data center pivot drives record quarter as AI-fueled NAND shortage reshapes storage market
    Sandisk reported fiscal fourth-quarter and full-year 2026 results on August 5 that underscore how thoroughly artificial intelligence (AI) demand has reshaped the NAND flash memory...
    Thursday 6 August 2026
    DRAM price surge lifts Samsung and Micron as SK Hynix loses share
    Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
    Wednesday 5 August 2026
    Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
    Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
    Tuesday 4 August 2026
    SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
    SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
    Tuesday 4 August 2026
    2027 memory capacity reportedly sold out as buyers quietly lock in supply

    Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

    Tuesday 4 August 2026
    SK hynix Unveils First HBF Standard Specifications with Sandisk

    SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

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    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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