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    NEWS TAGGED NAND
    Friday 12 June 2026
    SK Hynix readies 375-layer NAND as US listing plan advances

    SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead...

    Friday 12 June 2026
    China's memory firms chase capital as AI storage demand lifts Biwin, Longsys
    As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans...
    Friday 12 June 2026
    CXMT and YMTC chase IPOs as AI memory demand tests capacity, yield, and tool localisation
    China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
    Friday 12 June 2026
    Lenovo reportedly plans second PC price hike as memory costs squeeze supply chain
    Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March...
    Tuesday 9 June 2026
    AI demand is turning memory chips into rationed assets, Morgan Stanley says
    AI is reshaping the global memory-chip market, according to Morgan Stanley, by pulling in more DRAM, HBM, and NAND, and turning once-cheap components into scarce resources. The shift...
    Thursday 4 June 2026
    Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
    Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company...
    Wednesday 3 June 2026
    NAND market hits record as YMTC closes in on global rivals
    The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and...
    Tuesday 2 June 2026
    SK Hynix reportedly preparing Dalian fab for 200-layer FG NAND to capture AI storage demand
    SK Hynix is reportedly preparing to mass-produce a new generation of 200-layer-class NAND flash memory based on floating-gate (FG) architecture at its Dalian Phase 2 facility in China,...
    Tuesday 2 June 2026
    AI Inference Revolution: Wallace Kou on Memory Shifts

    The global semiconductor landscape is undergoing a fundamental shift, moving from a focus on raw training power to the practical complexities of large-scale deployment...

    Wednesday 27 May 2026
    Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

    Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam,...

    Wednesday 27 May 2026
    Transcend to spotlight AI-ready enterprise SSDs and DDR5 memory at COMPUTEX 2026
    Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying...
    Tuesday 26 May 2026
    Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
    The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
    Tuesday 26 May 2026
    Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
    Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Monday 25 May 2026
    Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

    Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook