Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant,...
SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically...
Memory maker Macronix International set a new quarterly record in the third quarter of 2026, with gross margin reaching 70.5% and net profit after tax totaling NT$109.5 billion (approx...
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development,...
Samsung Electronics and SK Hynix are upgrading their NAND flash factories in China to make chips with more than 200 layers, Reuters reported on October 21, citing four people...
Kioxia is prioritising proprietary NAND flash technology and customer-specific development over aggressive capacity expansion, seeking to capitalise on rising AI storage demand while...
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
AI data center investment continues to expand, keeping the global memory market undersupplied in the fourth quarter of 2026. Rising DRAM and NAND Flash contract prices are boosting...
AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012, as persistent DRAM and NAND shortages inflated production costs, constrained...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
