CONNECT WITH US
NEWS TAGGED NAND
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

Tuesday 4 August 2026
SK hynix Unveils First HBF Standard Specifications with Sandisk

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

Tuesday 4 August 2026
YMTC rejects patent-loss claims in global 3D NAND clash with Micron
Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports...
Monday 3 August 2026
Memory makers lift capex as Kioxia holds spending to defend NAND lead
Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According...
Saturday 1 August 2026
Silicon Motion posts record Q2 revenue and 2026 sales growth over 100%
NAND controller maker Silicon Motion Technology reported record second-quarter 2026 revenue of US$451 million, up 32% quarter-on-quarter and 127% from a year earlier, as profit and...
Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

Thursday 30 July 2026
Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating...

Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the...
Wednesday 29 July 2026
Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion...
Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints...

Wednesday 29 July 2026
Powertech posts record second-quarter revenue and targets a 2026 sales high
Powertech Technology reported second-quarter 2026 revenue of NT$23.116 billion, up 8.5% from the previous quarter and 28% from a year earlier. The Taiwan-based memory and testing provider...