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    NEWS TAGGED NAND
    Friday 7 August 2026
    SK Hynix's Solidigm weighs up to US $7.2B pre-IPO funding round

    Solidigm, SK Hynix's US NAND and enterprise storage unit, is weighing a pre-IPO funding round of KRW5 trillion to KRW10 trillion (US$3.6...

    Friday 7 August 2026
    Huawei's Richard Yu warns of smartphone price hikes as memory costs soar
    Huawei executive director and Consumer Business Group chairman Richard Yu warned on August 5 that sharply rising memory costs could trigger widespread smartphone price increases, saying...
    Thursday 6 August 2026
    Sandisk leans on multi-year supply deals as it bets on AI-driven NAND supercycle
    Sandisk closed its fiscal 2026 with record revenue, gross margin, and earnings per share. Still, the bigger story for investors is how much of the company's future business is now...
    Thursday 6 August 2026
    Sandisk's data center pivot drives record quarter as AI-fueled NAND shortage reshapes storage market
    Sandisk reported fiscal fourth-quarter and full-year 2026 results on August 5 that underscore how thoroughly artificial intelligence (AI) demand has reshaped the NAND flash memory...
    Thursday 6 August 2026
    DRAM price surge lifts Samsung and Micron as SK Hynix loses share
    Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
    Wednesday 5 August 2026
    Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
    Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
    Tuesday 4 August 2026
    SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
    SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
    Tuesday 4 August 2026
    2027 memory capacity reportedly sold out as buyers quietly lock in supply

    Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

    Tuesday 4 August 2026
    SK hynix Unveils First HBF Standard Specifications with Sandisk

    SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

    Tuesday 4 August 2026
    YMTC rejects patent-loss claims in global 3D NAND clash with Micron
    Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports...
    Monday 3 August 2026
    Memory makers lift capex as Kioxia holds spending to defend NAND lead
    Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According...
    Saturday 1 August 2026
    Silicon Motion posts record Q2 revenue and 2026 sales growth over 100%
    NAND controller maker Silicon Motion Technology reported record second-quarter 2026 revenue of US$451 million, up 32% quarter-on-quarter and 127% from a year earlier, as profit and...
    Friday 31 July 2026
    Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
    Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
    Thursday 30 July 2026
    Samsung signs five-year memory deals as chip shortage stretches to 2028
    Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
    Thursday 30 July 2026
    Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
    Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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