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    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    4h 22min ago
    Xpeng expands Turing chip from EVs into humanoid robots
    4h 22min ago
    Corning sees CPO and glass core as new semiconductor battlegrounds
    4h 22min ago
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
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    NEWS TAGGED NAND
    Monday 14 September 2026
    Sandisk recruits engineers in Korea as memory talent race heats up

    Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

    Friday 11 September 2026
    Kioxia eyes US listing amid NAND profit rebound
    Kioxia's planned US listing could broaden the Japanese memory maker's access to global institutional investors as a sharp recovery in NAND profitability coincides with stronger data-center...
    Friday 11 September 2026
    Memory makers gain the upper hand as Apple's iPhones pay the price
    Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
    Wednesday 9 September 2026
    Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes

    Kioxia has ruled out deeper manufacturing ties with SK Hynix while resisting another round of aggressive NAND price increases, leaning...

    Wednesday 9 September 2026
    Apple yields to memory suppliers in historic strategy shift, with Kioxia tipped as NAND long-term agreement recipient
    Apple, historically known for wielding unmatched leverage in component price negotiations, has reportedly been trading pricing leverage for long-term supply guarantees from memory...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%
    Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply...
    Monday 7 September 2026
    Micron scores seventh PTAB win in YMTC patent fight
    Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while...
    Sunday 6 September 2026
    TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
    Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
    Saturday 5 September 2026
    Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
    China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
    Friday 4 September 2026
    Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in
    Kioxia's plan to push NAND flash into work that DRAM currently does is less a product launch than an answer to a structural problem. Alone among the leading memory makers, it does...
    Thursday 3 September 2026
    SK Hynix weighs Kioxia production tie-up in Japan
    SK Group chairman Chey Tae-won has raised the possibility of jointly producing semiconductors with Japan's Kioxia, taking SK Hynix's exploration of a Japanese manufacturing base a...
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Tuesday 1 September 2026
    China's memory chipmakers post a record 1H — but not all of it came from chips
    Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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