To meet the surging demand driven by AI, TSMC is upgrading its second wafer fab under construction in Kumamoto, Japan, to use more advanced 3nm process technology. This development...
TSMC is doubling down on Japan. By upgrading its second Kumamoto facility to 3-nanometer production, the chipmaking giant has turned what was once a secondary supply-chain hedge into...
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
Powerchip Semiconductor Manufacturing Corporation, one of Taiwan's smaller but strategically positioned chipmakers, reported a sharp narrowing of losses in the fourth quarter of 2025,...
Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...
Infineon's decision to accelerate investment to expand AI power capacity is set to lift fiscal 2026 capital spending and intensify fab loading management, even as the company maintains...
Amid an acute global memory chip shortage, China's leading manufacturers ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are rolling out their most aggressive...
Memory shortages are worsening across the market as international suppliers shift capacity aggressively toward servers, tightening supply for consumer electronics and automotive sectors...
China's YMTC is fast-tracking construction of its Wuhan Phase III NAND flash fab, bringing its mass production target forward to the second half of 2026, roughly a year ahead of the...
Following Intel's major global wafer fab plan cuts, including halting projects in Germany and Poland, GlobalFoundries (GF) and STMicroelectronics (ST) have faced fresh scrutiny over...
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
SK hynix Inc. announced record-breaking financial results for fiscal year 2025 on Thursday, driven by its dominant competitiveness in the AI memory sector and high-value products like...
Texas Instruments (TI) signaled urgency around capacity planning, stressing that today's capital spending choices will determine its ability to serve demand years ahead, while downplaying...
