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NEWS TAGGED TSV
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Friday 26 March 2021
Samsung develops HKMG-based DDR5 memory
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Monday 12 August 2019
SK Hynix develops HBM2E DRAM
SK Hynix has developed HBM2E DRAM product with what it calls the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity...
Wednesday 14 March 2018
AMEC intros ICP etcher for advanced memory and logic IC designs
At the ongoing SEMICON China, Advanced Micro-Fabrication Equipment (AMEC) has unveiled its Primo nanova system - the company's first inductively coupled plasma (ICP) etcher for high-volume...
Wednesday 31 January 2018
PTI profits climb to 7-year high in 2017
Memory-IC backend specialist Powertech Technology (PTI) saw its net profits climb to a seven-year high of NT$5.85 billion (US$200.4 million) in 2017.
Friday 14 July 2017
Toshiba develops 3D flash memory with TSV technology
Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...
Friday 2 June 2017
PTI optimistic about memory-dominated packaging
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Monday 24 August 2015
TSMC stays neutral on ASE's bid for SPIL shares
TSMC would not comment on Advanced Semiconductor Engineering's (ASE) recently-announced bid to take up a major stake in Siliconware Precision (SPIL), according to the contract chip...