Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...

China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...

SK Hynix has developed HBM2E DRAM product with what it calls the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity...

At the ongoing SEMICON China, Advanced Micro-Fabrication Equipment (AMEC) has unveiled its Primo nanova system - the company's first inductively coupled plasma (ICP) etcher for high-volume...

Memory-IC backend specialist Powertech Technology (PTI) saw its net profits climb to a seven-year high of NT$5.85 billion (US$200.4 million) in 2017.

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

TSMC would not comment on Advanced Semiconductor Engineering's (ASE) recently-announced bid to take up a major stake in Siliconware Precision (SPIL), according to the contract chip...

United Microelectronics (UMC) has entered volume production for AMD's graphics chips using through-silicon-via (TSV) technology, according to the Taiwan-based pure-play foundry.

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...

Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production...

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conferen...

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Japan-based DRAM maker Elpida Memory has approved plans to raise up to JPY79.67 billion (US$994 million), including a rights issue and convertible bonds (CBs). The funds raised will...

Elpida Memory on June 27 announced that it has begun sample shipments of its DDR3 SDRAM (x32-bit I/O configuration) made using TSV stacking technology. The sample is a low-power 8Gb...