News tagged TSV at DIGITIMES

NEWS TAGGED TSV

Thursday 10 September 2026

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...

Thursday 10 September 2026

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Friday 21 August 2026

JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...

Friday 24 July 2026

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

Introduction

Thursday 18 June 2026

Imec, Sony unveil backside interconnect method for 3D chip stacking

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Wednesday 6 May 2026

SoftBank, Intel target HBM limits with 9-layer memory

SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...

Thursday 1 January 2026

Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks

Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical...

Friday 13 June 2025

Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report

As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...

Wednesday 4 June 2025

ASE bets on new chip tech to handle AI’s rising power and speed needs

ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...

Thursday 8 August 2024

China rushing into chiplet and HBM fab tool development

China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...

Thursday 25 July 2024

Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used...

Friday 19 July 2024

Micron sampling MRDIMMs for AI and HPC

Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...

Thursday 13 June 2024

HBM competition (2): The choice of HBM's next steps?

It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions.

Wednesday 1 November 2023

UMC launches 3D IC project in collaboration with partners

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...

Thursday 26 October 2023

SK Hynix DRAM biz returns to profitability in 3Q23

The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division returned...

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Sep 14, 08:00

Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

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