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Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026
Cadence deepens Intel Foundry partnership on next-generation chip design
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The...
Friday 12 June 2026
HPSP reportedly receives test equipment order for Musk's Terafab

Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly...

Tuesday 9 June 2026
Nvidia unveils AI PC vision as Intel offers reflection instead of product news
Computex, Asia's largest technology trade show, opened this year with many of the industry's most prominent executives gathering in Taiwan. Yet while Nvidia used the event to unveil...
Tuesday 9 June 2026
Commentary: COMPUTEX 2026 shows AI race moving from GPUs to ecosystems
One of the clearest shifts at COMPUTEX 2026 was that suppliers across the AI supply chain were no longer talking only about GPUs. The conversation has moved toward how CPUs, GPUs,...
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Monday 8 June 2026
Hitachi and Intel strike collaboration on physical AI and industrial infrastructure
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used...
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Friday 5 June 2026
Sambanova challenges GPU dominance in AI inference at Computex
SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall — and to demonstrate,...
Friday 5 June 2026
Foxconn deepens AI push with Intel on inference racks
Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal...
Friday 5 June 2026
Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market
Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly...
Friday 5 June 2026
Foxconn, Intel link chips, racks and systems in AI infrastructure push
Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack...
Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

Thursday 4 June 2026
TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and...
Wednesday 3 June 2026
Tight laptop chip supply tests Intel's 18A comeback
Intel's effort to rebuild confidence in its manufacturing technology is facing an early test, as PC makers struggle to secure laptop processors built on the company's 18A process.