中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Smartphone lens maker Largan spends US$179m on four Taichung plants in two months
    39min ago
    Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
    41min ago
    Nexperia China rebuilds 12-inch local supply chain after 330 days
    42min ago
    NEWS TAGGED INTEL
    Tuesday 25 August 2026
    Intel pitches Diamond Rapids at Hot Chips as server CPU competition heats up
    Intel pitched its next-generation Diamond Rapids Xeon at Hot Chips 2026 as the company bets that agentic AI will increase the role of general-purpose processors in AI infrastructure,...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
    Thursday 20 August 2026
    Robotics leaders present future of physical AI, but also deployment challenges
    Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's...
    Thursday 20 August 2026
    Intel Malaysia packaging expansion draws HBM flows from Taiwan

    South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

    Wednesday 19 August 2026
    Socionext taps Intel 18A-P process for high-performance compute chiplet development
    Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data...
    Saturday 15 August 2026
    Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

    High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

    Friday 14 August 2026
    Podcast highlights: Intel raises US$20B, but its 14A ambitions may need twice as much

    DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting...

    Friday 14 August 2026
    Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

    Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly...

    Friday 14 August 2026
    Intel tests system memory to ease AI KV-cache pressure
    Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput...
    Thursday 13 August 2026
    Intel signals memory push after hiring former SK Hynix CEO

    Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

    Thursday 13 August 2026
    OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
    Intel sees agentic AI changing the balance of AI servers, as CPU orchestration, memory capacity and data movement emerge as performance constraints even when more GPU capacity is a...
    Wednesday 12 August 2026
    Intel's Israel fab stirs back to life, but case for 14A remains unconfirmed
    Intel appears to be restarting work on Fab 38, its long-idle facility in Kiryat Gat, Israel, though how far the project will go — and whether it will ultimately run the company's...
    1/31 pages
    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    reportAIglasses