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Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
Microsoft Windows price hikes add to PC cost pressure in 2026
PC makers are facing higher costs in 2026 as memory and processor prices rise and Microsoft lifts Windows operating system prices. Vendors said the latest Windows increase averaged...
Friday 31 July 2026
Intel's rare Atom IP deal gives RosaicLabs a shortcut to custom x86 chips

Intel has granted stealth chip startup RosaicLabs access to parts of its Atom processor technology, potentially including register-transfer...

Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Thursday 30 July 2026
Ennoconn deepens Singapore push with SMF pact and AI forum

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

Thursday 30 July 2026
Intel's reported DDR4 CPU revival expected to boost PC demand in second half
With AI server demand continuing to absorb DRAM production capacity, DDR5 memory prices remain elevated and are expected to rise further.
Thursday 30 July 2026
UMC, Intel advance 12nm process collab with no next-gen plans at this time
United Microelectronics (UMC) stated that its collaboration with Intel to develop a 12nm process is progressing smoothly. The process design kit (PDK) is expected to be completed by...
Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
Intel Foundry completes US microelectronics prototype program

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience,...

Wednesday 29 July 2026
AI shift to inference boosts CPU server demand across the supply chain
The move from AI model training to inference is widening server demand beyond accelerators and easing margin pressure on hardware assemblers. For global readers, the shift signals...
Tuesday 28 July 2026
Cadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver

Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook...

Tuesday 28 July 2026
Nvidia's Vera targets AI server growth, with CSP adoption the key test
Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing...
Monday 27 July 2026
Nvidia's Vera CPU targets go beyond Intel and AMD
After Nvidia has grown into a global giant on GPUs, why is it suddenly delving into CPUs? At first glance, its Vera is entering the server CPU market, where its rivals are naturally...
Monday 27 July 2026
Hitachi selected for Japan quantum computing project with Intel collaboration
Hitachi has been selected as the prospective implementation organization for a Japanese government-backed project to advance next-generation quantum computers, with Intel contributing...