The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been...

Intel and AMD have jointly introduced AI Compute Extensions (ACE), a new x86 instruction set specification designed to accelerate AI...

Cornelis Networks has announced the successful deployment of the Lynx supercomputing cluster at the US Department of Energy's Lawrence...

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain...

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly...