Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
Apple's MacBook Neo is intensifying competition in the global low-cost notebook market as rising supply-chain costs push Microsoft and other notebook makers to reassess their product...
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...
The economics of the foundry business have always carried a particular contradiction: semiconductor manufacturing demands enormous upfront capital and years of sustained investment,...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades...
This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...
As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind...
The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13–15 in San Francisco...
Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether...
An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities...
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
