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    Why Shanghai is becoming China’s center for lithography
    Jul 30, 18:05
    Beijing’s AI hub takes shape as Moonshot and Z.ai vie for talent and capital
    Jul 30, 18:05
    Beyond compute: how memory and storage became the next contested field of automotive semiconductors
    Jul 30, 18:05
    German joint ventures in China fell below 50% utilization as car market restructuring intensified
    Jul 30, 18:04
    Research Insight: What CXMT IPO signals amid DRAM industry shift
    Jul 30, 18:04
    NEWS TAGGED INTEL
    Friday 31 July 2026
    Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
    TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
    Thursday 30 July 2026
    Ennoconn deepens Singapore push with SMF pact and AI forum

    Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

    Thursday 30 July 2026
    Intel's reported DDR4 CPU revival expected to boost PC demand in second half
    With AI server demand continuing to absorb DRAM production capacity, DDR5 memory prices remain elevated and are expected to rise further.
    Thursday 30 July 2026
    UMC, Intel advance 12nm process collab with no next-gen plans at this time
    United Microelectronics (UMC) stated that its collaboration with Intel to develop a 12nm process is progressing smoothly. The process design kit (PDK) is expected to be completed by...
    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
    Wednesday 29 July 2026
    Intel Foundry completes US microelectronics prototype program

    Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience,...

    Wednesday 29 July 2026
    AI shift to inference boosts CPU server demand across the supply chain
    The move from AI model training to inference is widening server demand beyond accelerators and easing margin pressure on hardware assemblers. For global readers, the shift signals...
    Tuesday 28 July 2026
    Cadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver

    Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook...

    Tuesday 28 July 2026
    Nvidia's Vera targets AI server growth, with CSP adoption the key test
    Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing...
    Monday 27 July 2026
    Nvidia's Vera CPU targets go beyond Intel and AMD
    After Nvidia has grown into a global giant on GPUs, why is it suddenly delving into CPUs? At first glance, its Vera is entering the server CPU market, where its rivals are naturally...
    Monday 27 July 2026
    Hitachi selected for Japan quantum computing project with Intel collaboration
    Hitachi has been selected as the prospective implementation organization for a Japanese government-backed project to advance next-generation quantum computers, with Intel contributing...
    Monday 27 July 2026
    Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
    AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below...
    Sunday 26 July 2026
    Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
    This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
    Friday 24 July 2026
    Intel reportedly considers SK Hynix for Ohio fab partnership

    Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the...

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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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