BIOSTAR, a leading manufacturer of edge computing solutions, motherboards, graphics cards, and storage devices, proudly concludes a highly successful COMPUTEX TAIPEI 2025 showcase...
Kevin Zhang, Deputy Co-Chief Operating Officer at TSMC, recently reiterated the company's cautious approach toward adopting High NA EUV lithography tools, emphasizing that TSMC is...
Samsung Electronics and Intel are taking their semiconductor foundry competition directly to each other's home turf in June, as both companies seek to narrow the gap with market leader...
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei firmly denied speculation that the company is considering setting up a fab in the Middle East.
A wave of senior executives from global semiconductor giants such as Intel, AMD, and Texas Instruments (TI) are striking out on their own to launch AI chip startups in India, seeking...
UMC, a leading foundry, held its shareholders' meeting on May 28, 2025. Chief financial officer Chi-Tung Liu pointed out that due to significant impacts from tariffs and exchange...
Pegatron Corporation made its first-ever independent appearance at COMPUTEX 2025, held in Taipei, Taiwan. The opening ceremony was hosted by Chairman T.H. Tung and was attended by...
Samsung Electronics' foundry division is making strides following its successful acquisition of Nintendo's 8nm process orders. The division, led by Jinman Han, is now actively pursuing...
At a dinner with supply chain partners on May 19, Intel's new CEO, Lip-Bu Tan, highlighted Taiwan's critical role in the global semiconductor sector, praising it as a key technology...
The semiconductor industry's decades-long strategy of shrinking transistors faces diminishing returns, forcing companies to explore alternative technologies for competitive advantage...
CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips annually by 2027. As the country's first fully locally...
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional...