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Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing

Tactile sensing is rapidly emerging as a critical foundation for next-generation applications across consumer electronics, robotics, automation, healthcare, manufacturing,...

Tuesday 3 February 2026
Asia FinTech Alliance (AFA) Announces Leadership Election Results

The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted...

Monday 2 February 2026
Smiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026

DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26,...

Friday 30 January 2026
BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...

Wednesday 28 January 2026
SK hynix Announces FY25 Financial Results

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has achieved record financial results in 2025 – 97.1467 trillion won in revenue, 47.2063...

Wednesday 28 January 2026
Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

Wednesday 28 January 2026
Ministry of Economic Affairs Launches 2026 Best AI Awards

The Ministry of Economic Affairs (MOEA) officially announced the launch of the 2026 Best AI Awards during a press conference held on January 20, 2026. This prestigious...

Wednesday 21 January 2026
iCatch and Jet Opto Announce 4K Automotive AI Imaging Solution

iCatch Technology

Monday 19 January 2026
KLA Strengthens Taiwan Presence, Investing NT$465M in Talent and Technology
The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip manufacturing grows exponentially - die sizes are scaling,...
Wednesday 14 January 2026
Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

Tuesday 13 January 2026
HQ Pack - global full-service provider of high-tech packaging from design to reuse

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

Tuesday 13 January 2026
AGI Advances AI-Ready Next-Gen Storage Layout at CES 2026

AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas,...

Friday 9 January 2026
Taiwan III launches national team to deliver DCBBS computer cabinet

Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle...

Thursday 8 January 2026
EDOM Unveils NVIDIA Jetson T4000, Powering Lightweight and Stable Edge AI

EDOM Technology (TWSE: 3048), Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the growing demand...

Tuesday 6 January 2026
SK hynix Showcases Next Generation AI Memory Innovation at CES 2026

Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase...