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NEWS TAGGED NEWS COVERAGE
Wednesday 1 October 2025
Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
Wise Integration, a pioneer in digital control for gallium nitride (GaN) and GaN IC-based power supplies, today announced the release to production of its first fully digital controller,...
Wednesday 1 October 2025
AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., the Fourth...
Wednesday 1 October 2025
Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
In recent years, the automotive industry has shifted from traditional mechanical manufacturing to a new era of intelligence and connectivity. The introduction of technologies such...
Tuesday 30 September 2025
AT&S Highlights AI-Driven Sustainable Manufacturing at CMIA 2025
AT&S, a global leader in high-end IC substrates and printed circuit boards, took part in the 2025 Chongqing Mayor's International Economic Advisory Council (CMIA) conference,...
Wednesday 24 September 2025
GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate...
Wednesday 24 September 2025
Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth
Wise Integration, a pioneer in digital control for gallium nitride(GaN)and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer...
Tuesday 23 September 2025
Henkel Adhesives highlights portfolio of Semiconductor Packaging Materials to foster collaboration with Taiwan
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled...
Tuesday 23 September 2025
Smiths Interconnect secures significant strategic win with leading high-performance AI semiconductor chip provider
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented,...
Monday 22 September 2025
Latest Keynote Agenda Unveiled for the Fourth GMIF2025 Innovation Summit
The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is...
Friday 19 September 2025
Corporate training for hybrid workforces
Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access...
Friday 12 September 2025
OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console...
Friday 12 September 2025
WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International,...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
Thursday 11 September 2025
SK hynix begins supplying mobile NAND solution ZUFS 4.1
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...