Xilinx has announced that it began to ship its first 20nm silicon in early November 2013, continuing to execute on an aggressive UltraScale device rollout.

IC distributor Answer Technology (ANStek) saw its net profits and gross margin both improve in the third quarter of 2013, thanks to a favorable product mix.

Xilinx and TSMC have jointly announced production release of the Virtex-7 HT family, what the pair claims is the industry's first heterogeneous 3D ICs in production.

Spansion Inc. (NYSE: CODE), a global leader in Flash memory-based embedded systems solutions, today announced that the Spansion FL-S family of Serial Peripheral Interface (SPI) Flash...

FPGA chip provider Xilinx has begun producing 20nm programmable logic devices (PLDs) and all programmable devices at Taiwan Semiconductor Manufacturing Company (TSMC), according to...

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

IC distributor Answer Technology (Anstek) saw its net profits edge up 6.3% on year to NT$27 million (US$904,613) in the first quarter of 2013, buoyed by agent sales of Xilinx produ...

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Taiwan Semiconductor Manufacturing Company (TSMC) will be the only supplier of the 20nm process to Xilinx' just-announced 8-series FPGAs, and second-generation 3D ICs and SoCs, the...

The successful roll-out of Xilinx devices on 28nm at TSMC has encouraged the FPGA design firm to utilize TSMC's 20nm technology for its next-generation products, with the tape-out...

Xilinx and Micron Technology have jointly announced the first public hardware demonstration of an FPGA interfacing with RLDRAM 3 memory, a new and emerging memory standard for high-end...

Xilinx has followed fellow company Altera in revising downward its sales outlook for the last quarter of 2011.

Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...

Taiwan Semiconductor Manufacturing Company (TSMC) announced that its 28nm process is in volume production, and production wafers have been shipped to customers including Altera, AMD...

More than fifteen leading technology companies have joined forces to speed the adoption of computer vision capabilities in electronic products. The ability of machines to see and...