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Tuesday 26 November 2019
SiP, AiP processes to gain momentum for 5G applications in 2020
System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...
Monday 25 November 2019
Intel CPU shortages may affect SSD adoption in PCs in 2020
Intel's CPU shortages are expected to continue haunting the PC industry in the first quarter of 2020, and may even last into the second quarter, undermining demand for SSDs from the...
Tuesday 19 November 2019
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected...
Tuesday 12 November 2019
TWS earbud chip prices fall below US$1.50
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...
Wednesday 6 November 2019
Taiwan backend firms expanding testing capacities for 5G chipsets
Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Tuesday 5 November 2019
GaAs foundries, backend firms see capacity utilization rates climb
GaAs IC foundries including Advanced Wireless Semiconductor (AWSC) and Win Semiconductors have both seen their 6-inch fab capacity utilization rates ramp up, driven by robust demand...
Tuesday 29 October 2019
Apple unveils AirPods Pro earbuds
Apple has announced the AirPods Pro, an addition to the AirPods family that features Active Noise Cancellation and immersive sound in an new lightweight, in-ear design.
Tuesday 15 October 2019
Taiwan chipmaking industry gearing up for next stage growth
Taiwan's chipmaking industry, led by TSMC, is gearing up to enter its next stage of growth as chip demand for 5G applications is set to start ramping up substantially next year, according...
Thursday 3 October 2019
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Monday 23 September 2019
New generation sub-GHz wireless transceiver chip achieves small size and ultra-low RX current
Amiccom Electronics Corporation (Amiccom) announced a new generation of ultra-low-receiving current sub-GHz RF transceiver, named A7169. Inherited the low-current RF architecture...
Tuesday 17 September 2019
Unitech enjoys brisk rigid-flex PCB shipments for TWS earphones
PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...
Tuesday 17 September 2019
New 5.8GHz wireless RF transceiver chip achieves longer transmission distance
Amiccom Electronics Corporation (Amiccom) announced a new 5.8GHz wireless RF transceiver chip named A5133. The A5133 supports data rate 500kbps ~ 4Mbps with FSK modulation. The A5133...
Wednesday 28 August 2019
TWS earbud chip prices falling
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have been falling, due mainly to stiff competition among chip suppliers, according to industry sources.
Tuesday 30 July 2019
Huawei slashes short-term IC orders for TWS devices
Huawei reportedly has reduced its short-term component orders for true wireless stereo (TWS) headsets amid the protracted US-China trade disputes, affecting sales of some Taiwan-based...
Thursday 25 July 2019
UMC expects 2-4% shipment increase in 3Q19
Pure-play foundry United Microelectronics (UMC) expects to post a 2-4% shipment increase sequentially in the third quarter of 2019, with a 1% rise in wafer ASPs.