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    China shifts AI investment focus from chips to infrastructure sectors
    2h 24min ago
    South Korean President and Softbank's Son to discuss AI investment and Stargate
    2h 24min ago
    Taiwan's trio of laws cripple solar industry, triggering multi-level fallout
    2h 24min ago
    Memory supercycle boosts Samsung and SK Hynix inventory reduction in 3Q25
    2h 25min ago
    Samsung Electronics restarts P5 plant construction in Pyeongtaek for HBM production
    2h 25min ago
    Huawei unveiled AI unified computing breakthrough to catch up with Nvidia
    2h 25min ago
    NEWS TAGGED WIRE BONDING
    Thursday 13 November 2025
    Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

    Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

    Wednesday 30 April 2025
    K&S partners with Taiwanese semiconductor leaders in advanced packaging push

    Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's...

    Tuesday 19 September 2023
    Packaging material distributors see stable demand for automotive, advanced packaging
    Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
    Wednesday 2 August 2023
    Wirebonding packaging demand stays weak
    Conventional wirebonding packaging demand remains sluggish, and OSATs are extremely cautious regarding the demand outlook for this year, according to industry sources.
    Thursday 30 March 2023
    ASE steps up deployment in automotive electronics sector
    Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...
    Tuesday 27 December 2022
    Delivery lead times for IC packaging and testing machines shorten notably
    Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...
    Friday 21 October 2022
    China OSATs see capacity utilization rates plummet
    China-based OSATs including JCET, Tianshui Huatian Technology and Tongfu Microelectronics have seen their capacity utilization rates plummet since the fourth quarter of 2022, due...
    Wednesday 5 October 2022
    Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
    Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
    Tuesday 27 September 2022
    ASEH to see production utilization drop in 4Q22
    ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
    Friday 16 September 2022
    Equipment demand for advanced packaging stays robust
    Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...
    Wednesday 27 July 2022
    OSATs slowing down mature packaging capacity expansion
    OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
    Monday 27 June 2022
    Chipmakers focus on heat dissipation in manufacturing process upgrades
    High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
    Wednesday 22 June 2022
    Second-tier OSATs see uncertainty in order visibility for 2H22
    Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
    Wednesday 25 May 2022
    Manpower crunch becoming new normal for semiconductor sector, says ASE chair
    Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
    Thursday 21 April 2022
    Packaging material vendors 'rationing' supplies to IDMs, OSATs
    Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
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    Veeam Q4 VDC Content Syn
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    Femtometrix Honored by the World's Leading Memory Manufacturer, for Pioneering Optical Process Control Technologies
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