Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Wednesday 2 August 2023
Wirebonding packaging demand stays weak
Conventional wirebonding packaging demand remains sluggish, and OSATs are extremely cautious regarding the demand outlook for this year, according to industry sources.
Thursday 30 March 2023
ASE steps up deployment in automotive electronics sector
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...
Tuesday 27 December 2022
Delivery lead times for IC packaging and testing machines shorten notably
Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...
Friday 21 October 2022
China OSATs see capacity utilization rates plummet
China-based OSATs including JCET, Tianshui Huatian Technology and Tongfu Microelectronics have seen their capacity utilization rates plummet since the fourth quarter of 2022, due...
Wednesday 5 October 2022
Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Tuesday 27 September 2022
ASEH to see production utilization drop in 4Q22
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Friday 16 September 2022
Equipment demand for advanced packaging stays robust
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...
Wednesday 27 July 2022
OSATs slowing down mature packaging capacity expansion
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 25 May 2022
Manpower crunch becoming new normal for semiconductor sector, says ASE chair
Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...