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Tuesday 15 March 2022
Wi-Fi 6/6E on track to go mainstream in 2022
Wi-Fi 6/6E will officially go mainstream in 2022 and is set to penetrate across all application segments, which will benefit all the related IC supply chain players including core...
Friday 21 January 2022
Wi-Fi 7 will spark demand for QFN packaging, burn-in testing
With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping...
Tuesday 28 December 2021
WinWay eyes business opportunity from new smartphone APs in 2022
WinWay Technology, a Taiwan-based high-end test socket service provider, is expected to enjoy robust orders from the top-2 smartphone AP suppliers in 2022 thanks to upgrades in their...
Tuesday 7 December 2021
MediaTek gearing up for robust demand from China handset vendors in 2022
Mobile SoC specialist MediaTek is gearing up for robust demand from its China-based smartphone clients in 2022, as vendors such as Oppo, Transsion and Vivo set aggressive shipment...
Tuesday 30 November 2021
Taiwan firms gearing up for upcoming Nvidia 5nm gaming GPUs
TSMC, ASE Technology and other Taiwan-based backend firms are all gearing up for the launch of Nvidia's Ada Lovelace-architecture RTX 40 series GPUs next year, according to industry...
Friday 26 November 2021
IC test interface vendors poised to embrace booming demand for HPC chips
Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Wednesday 29 September 2021
Testing houses expect promising demand for MediaTek Wi-Fi chips
MediaTek has been improving its product mix by putting increased focus on Wi-Fi chip solutions to meet robust demand for networking devices, which will effectively bolster testing...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Thursday 2 September 2021
IC testing interface vendors to enjoy strong demand for new-gen processors
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Thursday 27 May 2021
IC test interface vendors keenly developing high-specs solutions for EV chips
IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other...
Wednesday 19 May 2021
Greatek building new backend processing plants
Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...