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Wednesday 27 August 2025
Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks
Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...
Tuesday 26 August 2025
TSMC reportedly drops Chinese equipment from 2nm fabs amid US pressure
Taiwan Semiconductor Manufacturing Co. (TSMC) has decided to operate its upcoming 2nm wafer fabs entirely without Chinese-made equipment. The new lines are scheduled to begin operations...