Taiwan's PCB equipment makers including C Sun and Symtek Automation Asia are poised to embrace strong growth momentum as many PCB and IC substrate makers are keenly expanding capacities...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are being discouraged from making further investments in China by the...
Both Intel and AMD reportedly have resumed shipments to Huawei after obtaining export permits from US authorities, but Taiwan's IC substrates do not expect their revenues to receive...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
Non-Huawei Chinese handset vendors are significantly scaling up orders with Taiwanese makers of HDI boards for midrange and high-tier handsets, seeking to snatch more market shares...
SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Unimicron Technology, after seeing its August revenues decrease 2.1% sequentially and 6.13% on year to NT$7.48 billion (US$255.29 million), has resumed peak-season shipment momentum...
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
A fire broke out at Unimicron Technology's factory in Kunshan, China on September 7, with details of the losses still being evaluated and cause of the fire under police investigation,...
Suppliers of SLP (substrate-like PCB) boards for the next-generation iPhone devices (tentatively named iPhone 12) have been ramping up shipments of related products since July-August,...
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
China-based PCB makers have been expanding production capacities for HDI boards for lower-end handset and consumer electronics applications, but they can hardly develop significant...
SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...
