Taiwan-based memory packaging and testing houses Powertech Technology (PTI) and Walton Advanced Engineering have landed growing orders for DDR3 memory, according to market watchers...

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

Wafer testing house Ardentec recently adjusted upward its capex budget for 2009.

Germany-based Multitest recently shipped its first handler to a Russian customer. The MT9510 will be employed for use in cold test applications.