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Wednesday 2 September 2009
Chipbond raises capex
Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...
Monday 6 July 2009
IC tester Ardentec increases 2009 capex
Wafer testing house Ardentec recently adjusted upward its capex budget for 2009.
Tuesday 16 September 2008
Multitest ships first handler to Russia
Germany-based Multitest recently shipped its first handler to a Russian customer. The MT9510 will be employed for use in cold test applications.