Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

Wafer testing house Ardentec recently adjusted upward its capex budget for 2009.

Germany-based Multitest recently shipped its first handler to a Russian customer. The MT9510 will be employed for use in cold test applications.