LCD driver IC design specialist Novatek Microelectronics expects to post revenues of between NT$15.8 billion (US$519.3 million) and NT$16.3 billion for the fourth quarter of 2019,...
Novatek Microelectronics has seen orders increase for OLED driver ICs from China-based handset vendors, with the orders set to result in a particularly strong fourth quarter for the...
Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...
LCD driver IC design specialist Novatek Microelectronics is expected to enjoy a strong fourth-quarter 2019, thanks to continued ramp-up in TDDI chip shipments, coupled with revenues...
Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display...
Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...
COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...
As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...
Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
Taiwan-based IC designer Elan Microelectronics expects its third-quarter 2019 revenues to hit a new quarterly high on a notable sequential increase to be driven by demand for stylus...
Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...
Prices of TDDI (touch with display driver integration) chips are under continued downward pressure, as competition in the sector is heating up due to capacity ramps by related IC...
Huawei's IC orders for its new smartphone models to be released in the second half of 2019 are to pick up again soon thanks to an easing of the US trade ban against the top Chinese...
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
