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NEWS TAGGED TAIWAN OSAT
Wednesday 17 July 2024
OSATs stepping up capex
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
Thursday 18 January 2024
IC backend houses expect demand to revive in 2H24
IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.
Tuesday 17 October 2023
Suppliers plan ahead amid potential US ban on more AI chips
The US reportedly may impose stricter restrictions on Chinese chipmakers and Nvidia's downgraded AI H800 processors. In light of this, Taiwanese testing companies and probe card providers...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 12 September 2023
DDI backend firms see lackluster demand in 2H23
The sluggish sales of TVs and notebooks have prompted display driver IC (DDI) backend houses and related backend materials suppliers to be cautious about demand in the second half...
Tuesday 4 July 2023
Robust advanced chip demand to boost Taiwan supply chain, says ASEH
Taiwan's industry supply chain remains competitive in the advanced chip market, which is expected to be undersupplied over the next three to five years, according to Tien Wu, COO...
Friday 30 June 2023
Taiwan companies seek opportunities in US network broadband infrastructure
Taiwan-based optical communications device makers and IC backend houses are looking to capitalize on opportunities presented by the expansion of network broadband infrastructure in...
Thursday 29 June 2023
IC backend industry supply chains in Eastern Europe, Southeast Asia expanding
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
Wednesday 3 May 2023
OSATs remain cautious about handset IC demand
OSATs remain cautious about handset IC demand despite the emergence of short lead-time orders, according to industry sources.
Wednesday 26 April 2023
OSATs continue to cut prices to maintain utilization rates
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Wednesday 12 April 2023
Mobile phone AP supply chain expects recovery in 3Q23
Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter...
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Thursday 30 March 2023
ASE steps up deployment in automotive electronics sector
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...