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    Memory shortage reshapes smartphone SoC market as MediaTek and Qualcomm lose share
    Apr 29, 18:00
    Lightelligence's HK listing signals China’s CPO push gaining momentum
    Apr 29, 18:00
    Samsung highlights 4nm FinFET as AI chip demand rises
    Apr 29, 18:00
    South Korea's OLED share rebounds to 68.7% in 2025
    Apr 29, 18:00
    Taiwan and Europe push localised drone countermeasure tech
    Apr 29, 18:00
    Low-Earth-orbit satellite market takes shape as Taiwan suppliers secure positions
    Apr 29, 18:00
    NEWS TAGGED OSAT
    Thursday 30 April 2026
    Amkor advances data center CPU mass production amid manageable supply and cost risks
    Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...
    Wednesday 29 April 2026
    China OSAT leader JCET expands in advanced packaging, profit climbs
    China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
    Wednesday 29 April 2026
    Memory test capacity stays high as substrate prices may rise in 2Q26
    The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly...
    Tuesday 28 April 2026
    US chip packaging capacity to hit 10% by 2032
    The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
    Monday 27 April 2026
    HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
    The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
    Monday 27 April 2026
    ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
    Friday 24 April 2026
    Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
    In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Tuesday 14 April 2026
    JCET CEO sees robotics extending automotive semiconductor growth

    China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Monday 13 April 2026
    India roundup: Domestic chip firms anchor India's semiconductor ambitions

    India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating...

    Saturday 11 April 2026
    ASE leads US$3.4B advanced testing push in Renwu
    Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Tuesday 7 April 2026
    IndieSemiC eyes India's general-purpose chip gap with Kaynes OSAT deal
    India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However,...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook