中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Kakao to integrate ChatGPT into KakaoTalk in strategic partnership with OpenAI
ICT
22min ago
Dell reportedly initiates third round of China layoffs, impacting Shanghai and Xiamen
ICT
29min ago
RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion
Semiconductors
38min ago
Lianyou Metals lists on Taiwan exchange, expands cobalt output amid tungsten supply squeeze
ICT
46min ago
NEWS TAGGED TAIWAN LLAMA
Monday 13 November 2023
Cloud gaming firm joins forces with Taiwan Llama Team to explore large language models (LLM)
Ubitus, a cloud gaming company, has joined forces with the Department of Computer Science and Information Engineering(CSIE) of the National Taiwan University (NTU) to incorporate...
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
MOST-READ
7 DAYS NEWS
TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's first open AI computing architecture: Sugon, Lenovo, Moore Threads comes together to challenge Nvidia CUDA
CATL procurement staff visits South Korea, reportedly seeking key equipment and manufacturing technologies
Samsung's Exynos comeback aims for Qualcomm's mobile chip dominance
China's JFSemi cracks 12-inch SiC wafer barrier with homegrown laser technology
SpaceX to buy EchoStar spectrum licenses in US$17 billion deal
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first