Taiwan's equipment supplier AMPOC holds a bright outlook for the coming months as ABF and BT substrate manufacturers ramp up capital spending.

3M has introduced a new member of its high-strength hollow glass bubbles product line to provide a low-loss high-speed high frequency (HSHF) resin additive for composite materials...

In line with the country's bid to improve semiconductor self-sufficiency, China-based PCB maker Shennan Circuits has...

China-based PCB maker Shennan Circuits has disclosed plans to invest a total of CNY6 billion (US$925.3 million) in building production lines for ABF substrates, making it the first...

Production technology for ABF substrates will be evolving rapidly to satisfy demand for HPC and other high-end chips, according to Tzyy-Jang Tseng, chairman for Unimicron technology...

A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.

Unimicron Technology, Kinsus Interconnect Technology and Nan Ya PCB are all poised to generate substantial revenue increases in the second half of 2021, as strong order momentum for...

A major glass substrate maker began annual maintenance in August 2021 and thus its production capacity has decreased by 15-20%, resulting in a short global supply of glass substrates...

ABF substrate suppliers have secured orders set to be fulfilled through 2023 and beyond, as major HPC chips vendors Intel, AMD, Nvidia and 5G networking chips supplier Xilinx have...

Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...

China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...

Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...

Unimicron Technology expects to sustain full capacity utilization for ABF substrates through 2025 as its capacity has been almost fully booked till then, according to the Taiwan-based...

Nan Ya Plastics expects to enjoy more robust growth in sales of its copper foil and other electronic materials in the second half of 2021, while seeking more vertical integration...

IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...