Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Taiwan-based Symtek Automation Asia, which provides automation equipment to support capacity expansions at PCB and IC substrate makers, expects to post a double-digit revenue surge...
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
