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Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Friday 6 May 2022
MaxLinear to acquire Silicon Motion
MaxLinear and Silicon Motion Technology have entered into a definitive agreement under which MaxLinear will acquire Silicon Motion in a cash and stock transaction that values the...
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Chenbro, a pioneer in the design and manufacturing of rackmount systems, announced that its innovative RM25324 2U 24 Bay high-density storage server chassis has won the iF Design...
Monday 18 April 2022
Kioxia, Western Digital to jointly invest in new flash memory fab
Kioxia and Western Digital have finalized a formal agreement to jointly invest in the first phase of the Fab7 (Y7) manufacturing facility at Kioxia's Yokkaichi plant in Japan's Mie...
Thursday 14 April 2022
NetApp upbeat about growth in Taiwan data storage industry
US-based data storage and management solution provider NetApp has shown optimism about growth in Taiwan's data storage industry, as the company registered a 90.3% on-year increase...
Thursday 31 March 2022
Memory and storage demand for datacenters promising, says Micron
Memory and storage demand for datacenters will be rising over the next decade, with the segment's growth poised to outperform the broader memory and storage market's increase, according...
Tuesday 29 March 2022
Taiwan's traditional industries look to energy storage market
Taiwan's energy storage market scale is expected to exceed NT$200 billion (US$6.9 billion) by 2030, attracting new entrants from traditional manufacturing sectors, according to industry...
Thursday 17 March 2022
Silicon Motion obtains PCIe Gen4 SSD controller orders from major chip vendors
Silicon Motion Technology with its PCIe Gen4 SSD controllers is eyeing its entry into the supply chain of the world's top-5 PC brand vendors, as the company has obtained orders for...
Tuesday 15 March 2022
Flash memory capex to set new high in 2022
IC Insights has forecast that NAND flash memory capital spending will rise 8% to US$29.9 billion in 2022, surpassing the previous all-time high of US$27.8 billion spent in 2018.
Friday 11 March 2022
Faster, larger storage devices needed for digital solutions
The COVID-19 pandemic has expedited industrial needs for digital transformation, and data storage devices must grow faster with larger capacity, according to Synology president Derren...
Wednesday 9 March 2022
Phison looking to expand automotive storage market presence
NAND flash device controller specialist Phison Electronics has had its solutions pass ISO 26262 automotive functional safety and development process certification, and is looking...
Monday 7 March 2022
Micron remains confident in FY22 revenue prospects
Despite the ongoing shortage of non-memory chips and components, which is unlikely to improve as a whole until 2023, memory chip vendor Micron Technology remains optimistic about...
Friday 4 March 2022
Micron sampling 176-layer NAND SSD for data centers
Micron Technology has announced it is sampling what the company claims is the world's first vertically-integrated 176-layer NAND solid-state drive (SSD) for data center application...
Wednesday 2 March 2022
DRAM contract prices to stop falling in 2Q22
DRAM contract prices are expected to stop falling and begin to rise in the second quarter of 2022, and NAND flash prices will be rising too, according to sources at memory module...
Friday 25 February 2022
Micron, WD raise NAND flash prices by 10%
Micron Technology and Western Digital have raised their NAND flash prices by about 10%, which is about to trigger increases in both spot and contract market prices, according to industry...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.