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Wednesday 22 September 2021
Chenbro launches high-density 2U side-load storage server chassis optimized for tiering hot and cold data
Chenbro, a pioneer in the design and manufacturing of own-brand rackmount system, is excited to announce the latest ultra-dense 2U storage server chassis, the RM25324, which accommodates...
Thursday 16 September 2021
Memory firms positive about demand for smartphones with higher internal storage
With Apple's new iPhones featuring one terabyte of storage, other brands are expected to follow suit by launching more flagship smartphones featuring at least 1TB of internal storage,...
Wednesday 15 September 2021
Kioxia debuts PCIe 4.0 storage class memory SSDs
Kioxia has announced it is sampling its FL6 Series enterprise NVMe SCM SSDs. Featuring Kioxia's SCM solution, XL-FLASH, the dual-port and PCIe 4.0-compliant FL6 Series SSDs bridge...
Monday 13 September 2021
Energy storage systems ensure stable delivery of renewable energy into the grid, says Delta Electronics executive
Energy storage systems make renewable energy controllable, manageable, adjustable, and reduce the problems that may be caused during power delivery, according to senior director Paul...
Monday 13 September 2021
Chipmakers gearing up for QLC NAND chip output ramp-up
Major NAND flash chip suppliers are poised to ramp up their output for QLC (quad-level cell) NAND chips between the end of this year and 2022, eyeing robust demand for not only PCs...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Friday 10 September 2021
Worldwide enterprise external OEM storage systems market revenues increase 9.7% during 2Q21, says IDC
According to the IDC Worldwide Quarterly Enterprise Storage Systems Tracker, global market revenues for enterprise external OEM storage systems grew 9.7% on year to US$6.9 billion...
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Monday 23 August 2021
NAND flash market to regain balance in 2022, says Silicon Motion president
The global NAND flash memory market is expected to reach the balance of supply and demand in 2022, when the overall bit supply growth is expected to stay at about 30%, according to...
Friday 20 August 2021
MediaTek intros 6nm chips for 5G smartphones
MediaTek has rolled out two new 5G smartphone chips built using TSMC's 6nm process technology.
Wednesday 18 August 2021
Phison striving to secure supply commitments from NAND chip vendors
Phison Electronics is striving to strike deals with NAND flash chip providers for 2022 and finds it difficult to secure supply commitments from the memory chip vendors, according...
Monday 2 August 2021
YMTC starts shipping 128-layer 3D NAND flash for China homegrown SSD
Yangtze Memory Technologies (YMTC) has kicked off mass production of 128-layer 3D NAND flash memory for a home-grown SSD series, according to industry sources.
Tuesday 27 July 2021
SK Hynix posts profit surge in 2Q21
SK Hynix has reported net profits surged 100% sequentially and 57% on year to KRW1.99 trillion (US$1.73 billion) in the second quarter of 2021.
Thursday 15 July 2021
HDD makers to see supply constrained in 2H21
A resurgence of the COVID-19 in Thailand, coupled with shortages of certain chips and components, may disrupt shipments of hard disc drives (HDD) in the second half of 2021 despite...
Friday 2 July 2021
China temporarily bans using retired EV batteries in energy storage systems
China's National Energy Administration has announced regulations to prevent using retired EV battery packs in newly established energy storage systems until there are technological...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.