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NEWS TAGGED STMICROELECTRONICS
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Wednesday 25 August 2021
Leadframe demand for car power modules promising in next 2-3 years
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
Tuesday 13 July 2021
Malaysia lockdown could worsen global IC shortage
A nationwide lockdown in Malaysia has made disruptions to the output from local chip plants, which fulfill mainly orders for entry-level and mid-range logic ICs, and power diodes...
Wednesday 7 July 2021
China foundry completes fundraising for capacity expansion
China-based CanSemi Technology has raised funds to carry out its upcoming capacity expansion project, in which the specialty IC foundry will add an additional 20,000 12-inch wafers...
Thursday 1 July 2021
Automotive IC shortage starts easing
The shortage of automotive chips has begun to ease recently, buoyed by additional capacity support from foundries, according to industry sources.
Monday 31 May 2021
NXP is yet another vendor striking long-term deal with UMC
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
Wednesday 19 May 2021
MCU prices set to rise again
Taiwan-based MCU suppliers are likely to raise their quotes shortly as STMicroelectronics reportedly has notified clients that it will hike the prices for its MCU lineup again starting...
Monday 29 March 2021
VisEra may offer wafer-level optical films for new iPhones
TSMC subsidiary VisEra Technology, which offers image sensor foundry, wafer-level testing and wafer-level optical film services, is expected to land orders for customized wafer-level...
Thursday 11 March 2021
IC distributors to enjoy strong 1Q21
Taiwan-based IC distributors WPG, WT Microelectronics, Edom Technology and Supreme Electronics are poised to enjoy a particularly strong first quarter of 2021, after reporting brisk...
Wednesday 3 March 2021
Macronix provides ultra-high-performance OctaBus flash memory to STMicro's latest microcontrollers
Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced that STMicroelectronics (ST) is using Macronix OctaBus flash memory...
Friday 26 February 2021
TSMC ranks in top-10 for capacity in main wafer sizes
As of December 2020, only TSMC was among the wafer capacity leaders in each of the main wafer size categories ranked by IC Insights. The Taiwan-based foundry had the most 200mm wafer...
Tuesday 5 January 2021
ToF 3D sensors to accelerate AR application ecosystem formation, says Digitimes Research
Time of flight (ToF) 3D sensors are emerging rapidly for massive consumer applications, prompting major semiconductor and optoelectronics players to join the supply chain and accelerating...
Tuesday 15 September 2020
SEMICON Taiwan 2020 to feature virtual platform
Advanced, smart and green manufacturing will take center stage on-site and online during SEMICON Taiwan 2020 that takes place during September 23-25.
Tuesday 5 December 2017
ST PWD13F60
STMicroelectronics' PWD13F60 system-in-package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters, according to the company. With a footprint 60% smaller than a comparable circuit built from discrete components, the PWD13F60 can also boost end-application power density, according to STMicro. By integrating four power MOSFETs, it presents an alternative to other modules on the market that are typically dual-FET half-bridge or six-FET three-phase devices. Unlike either of these choices, only one PWD13F60 is needed to implement a single-phase full bridge, leaving no internal MOSFETs unused. There is also flexibility to configure the module as one full bridge or two half bridges. Leveraging ST's high-voltage BCD6s-offline fabrication process, the PWD13F60 integrates gate drivers for the power MOSFETs and the bootstrap diodes needed for high-side driving, which simplifies board design and streamlines assembly by eliminating external components. The gate drivers are optimized for reliable switching and low EMI (electromagnetic interference). The SiP also features cross-conduction protection and under-voltage lockout, which helps further minimize footprint while ensuring system safety. The PWD13F60 supports a supply-voltage range extending down to 6.5V for maximum flexibility. In addition, the SiP inputs can accept logic signals from 3.3V to 15V to ensure interfacing with microcontrollers (MCUs), digital signal processors (DSPs), or Hall sensors.