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Thursday 12 June 2025
China's MLCC makers carve out 10% share — How does Semco adjust course?
Chinese multilayer ceramic capacitor (MLCC) manufacturers—including Guangdong Fenghua Advanced Technology, Chaozhou Three-Circle Group, and Eyang Technology—have rapidly...
Thursday 12 June 2025
SK Hynix warns of rockier 2H25, leans on multi-sourcing strategy
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Wednesday 11 June 2025
DDR4 crunch sends prices soaring 50%
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
Wednesday 11 June 2025
Taiwan-Korea alliance targets semiconductor materials dominance
PCB wet process equipment and semiconductor materials agent Ampoc recently announced a strategic technical partnership with South Korean semiconductor materials leader DCT Material...
Wednesday 11 June 2025
CXMT accelerates DDR5 memory production, phases out DDR4
In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development...
Wednesday 11 June 2025
SK Hynix weighs TCB suppliers: Hanmi, Hanwha face off for 2H25 HBM3E equipment orders
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
Wednesday 11 June 2025
Samsung and Groq to produce world's fastest AI chip using 4nm process, mass production slated for 2H25
Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip...
Wednesday 11 June 2025
South Korean President unveils US$73.6 billion investment to build homegrown AI
To strengthen South Korea's development of artificial intelligence (AI) technology, President Jae-Myung Lee has pledged to invest KRW100 trillion in AI as part of his campaign promise...
Tuesday 10 June 2025
Qualcomm seals Autotalks deal, expands V2X chip output with Samsung Foundry
Qualcomm CDMA Technologies (QCT), a unit of Qualcomm Inc., has finalized its acquisition of Israeli vehicle-to-everything (V2X) chipmaker Autotalks, reinforcing its push into connected...
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
Tuesday 10 June 2025
Ampoc partners with South Korea's DCT Material to expand advanced process materials market
Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor...
Tuesday 10 June 2025
South Korean industry optimistic about Samsung's potential Middle East expansion; AI chip orders seen as key
Following reports that TSMC is considering establishing a semiconductor wafer fab in the Middle East, some observers suggest that Samsung Electronics may also seek opportunities to...
Tuesday 10 June 2025
Naver and Netflix to deepen global collab following South Korea success
South Korean internet giant Naver and US streaming powerhouse Netflix are exploring deeper ties, following the success of their joint initiatives in South Korea. In a recent high-level...
Monday 9 June 2025
Samsung reportedly races to LPDDR6 with 1c DRAM by late 2025 to fend off Chinese rival
Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the...