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Monday 24 May 2021
Inspection equipment vendor TRI upbeat about 2021 sales
Taiwan's testing and inspection equipment vendor Test Research (TRI) is optimistic its 2021 business results will be better than 2020, driven by strong equipment demand for 5G, notebook...
Friday 7 May 2021
BT substrate supply increasingly tight on strong cryptomining demand
The supply of BT substrates has been increasingly tight, as more vendors of chips, particularly cryptomining ASICs, have turned to adopt BT substrates amid worsening shortages of ABF...
Wednesday 28 April 2021
PTI sees clear order visibility through 3Q21
Backend house Powertech Technology (PTI) and along with its logic IC packaging subsidiary Greatek Electronics have seen clear order visibility through the third quarter of 2021, with...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Friday 26 March 2021
FPCB, SiP substrate makers readying mass production for new AirPods
Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
Friday 26 March 2021
ASE starts optical sensors production for next-generation AirPods
Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...
Tuesday 23 March 2021
ASE, ShunSin gearing up for optical module shipment boom
Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second quarter,...
Friday 19 March 2021
LG Innotek reportedly bracing for ABF substrate production
IC substrate maker LG Innotek is bracing for production of ABF-based FCBGA substrates, according to Korean media reports, but industry sources believe it would be a hard job to venture...
Friday 5 March 2021
Nan Ya to spend NT$8 billion on IC substrate capacity expansion
Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
Friday 5 February 2021
Wire-bonding capacity to stay short of demand throughout 2021
ASE Technology Holding will see its wire-bonding capacity run at full utilization and remain short of demand through the end of 2021, and up to 90% of clients have signed two-year...
Wednesday 20 January 2021
Taiwan IC substrate makers see promising demand for SiP, AiP designs
Taiwan-based IC substrate makers are generally cautious about expanding BT-based substrate capacity. Nevertheless, with demand for SiP (system-in-package) and AiP (antenna-in-package)...
Friday 8 January 2021
Nan Ya, Kinsus see 4Q20 revenues peak on strong IC substrate demand
IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Thursday 31 December 2020
Customized IC sockets in hot demand for SiP, SLT applications
Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration,...
Tuesday 29 December 2020
Merry Electronics deepening presence in TWS earbuds market
Taiwan-based acoustic solutions specialist Merry Electronics, now in the supply chain for Apple's AirPods, is gearing up to deepen its deployments also in the non-Apple TWS (true wireless...