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    China's national holiday fails to boost consumer electronics demand
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    NEWS TAGGED SILICON
    Wednesday 8 October 2025
    China and Taiwan chart diverging paths in the 12-Inch SiC market
    In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...
    Tuesday 7 October 2025
    China's SiC industry finds high-value exit in Meta's AR supply chain

    As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

    Monday 6 October 2025
    Mitsubishi Electric opens SiC plant amid cooling EV market
    Mitsubishi Electric held a completion ceremony on October 1, 2025, for its new power semiconductor factory in Kumamoto Prefecture, Japan. The facility will produce silicon carbide...
    Thursday 2 October 2025
    CoWoS creates turning point for 12-inch SiC
    Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
    Thursday 2 October 2025
    InPsytech hires Arm veteran David Hsu as COO
    Egis Technology Group's silicon intellectual property (IP) vendor InPsytech announced on October 1 that it has appointed industry veteran David Hsu—Arm's former FAE director—as...
    Wednesday 1 October 2025
    China's 12-inch SiC leap: SICC, Jingsheng in spotlight
    The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
    Saturday 27 September 2025
    Infineon, Rohm sign MOU to support flexible SiC power device shipments
    Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
    Friday 26 September 2025
    Microsoft microfluidics cooling claims meet cold shower from industry veterans
    Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company...
    Wednesday 24 September 2025
    Onsemi to acquire Aura Semiconductor's Vcore power technologies
    Onsemi has announced an agreement to acquire rights to Aura Semiconductor's Vcore power technologies, including related intellectual property licenses. The acquisition, expected to...
    Tuesday 23 September 2025
    12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
    After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
    Tuesday 23 September 2025
    Episil bets on SiC and GaN for Q4 rebound as compound semiconductor market bottoms out

    Episil and its epitaxy-focused subsidiary Episil Precision, spanning both silicon (Si) and wide-bandgap semiconductors such as silicon...

    Sunday 21 September 2025
    Huawei patents SiC cooling tech to power next-gen AI chips
    Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
    Sunday 21 September 2025
    Non-China market opportunities remain despite no involvement in advanced packaging, say Episil and EPI
    The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
    Saturday 20 September 2025
    xMEMS technology aims to cut heat and weight in AI wearables
    As tech companies push the boundaries of next-generation edge AI devices like smart glasses, two major hurdles remain: weight and heat. These issues, often overlooked in a device's...
    Friday 19 September 2025
    Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs
    Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
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    SpecialReports
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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