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Friday 26 September 2025
Microsoft microfluidics cooling claims meet cold shower from industry veterans
Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company...
Wednesday 24 September 2025
Onsemi to acquire Aura Semiconductor's Vcore power technologies
Onsemi has announced an agreement to acquire rights to Aura Semiconductor's Vcore power technologies, including related intellectual property licenses. The acquisition, expected to...
Tuesday 23 September 2025
12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...