The strength of Chinese domestic brands in the electronics sector is exceptional, with brands such as Hisense, TCL, Xiaomi, Skyworth, Changhong, Konka, Haier, and Huawei collectively...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Samsung Electronics Chairman Lee Jae-yong recently met with Vietnamese Prime Minister Pham Minh Chinh, discussing plans to expand investments in Vietnam.
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including...
