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Monday 22 September 2025
Research insight: BYD reinvents itself as a global EV powerhouse

At the recently concluded IAA Mobility auto show in Munich, BYD, China's electric vehicle giant, outlined its roadmap for solidifying...

Saturday 20 September 2025
Intel-Nvidia's twin strategy faces speed test, but PC path leads, says DIGITIMES analyst
Nvidia and Intel on Thursday detailed a sweeping product roadmap that links their CPU and GPU platforms, while underscoring continued collaboration with Taiwan Semiconductor Manufacturing...
Friday 19 September 2025
Intel–Nvidia pact fuses x86 and RTX, bolstering Tan’s turnaround strategy
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
Friday 19 September 2025
Huawei's Ascend chips to surpass Nvidia's China-only GPUs with up to 8 PFLOPS, 14.4TB/s bandwidth
US export controls have capped the performance of Nvidia's "China-only" GPUs, opening the door for domestic chipmakers to compete. Huawei's Ascend roadmap, announced at its 2025 Connect...
Friday 19 September 2025
Huawei Ascend 950 to feature in-house HBM in 2026, advancing China's AI memory independence
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend...
Thursday 18 September 2025
Huawei charts 6-year Ascend AI chip roadmap, showcasing HBM advances and SuperNode scale
Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating...
Sunday 14 September 2025
Intel outlines 2026 PC roadmap: Arrow Lake refresh to hold the line before Nova Lake overhaul

Intel is tightening its PC processor roadmap, confirming it will roll out an Arrow Lake Refresh in 2026 and follow with the next-generation...

Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
Intel to continue semiconductor glass substrate commercialization despite market rumors
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Zeiss hits milestone of 10 High NA optic systems shipped as TSMC probes future of Hyper NA EUV
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
Friday 5 September 2025
Made in China: 5nm GPU clears tape-out, 6nm now sampling
On September 3, 2025, Anhui Anfu Battery Technology announced its portfolio company Xiangdi Xian Computing Technology (XDXCT) had completed tape-out validation of its next-generation...
Monday 1 September 2025
China's ICT push: embedding AI across smartphones, PCs, and wearables by 2026

The US has tightened controls on China's semiconductor and artificial intelligence (AI) sectors under the banner of national security...

Friday 15 August 2025
Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
Tuesday 12 August 2025
China eyes 2027 BCI breakthrough as it races to build its own chips
China's brain-computer interface (BCI) sector is accelerating, driven by strong state policy support and private-sector advances. The Ministry of Industry and Information Technology...