CONNECT WITH US
NEWS TAGGED RESEARCH INSIGHTS
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...
Monday 23 March 2026
Research insight: F1's 2026 regulations reshape powertrain competition and accelerate low-carbon transition
With the 2026 Formula One (F1) season opener in Australia, the first competitive validation of the sport's new regulatory framework has already highlighted the impact of a fundamental...
Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...
Monday 9 March 2026
Research Insight: Global EV charging stations to surpass 9 million by 2026 as China, Europe expand

Global public electric vehicle (EV) charging infrastructure is projected to reach 9.01 million stations worldwide by 2026, according to...

Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

Monday 2 March 2026
Insight: Memory shortage tightens grip on smartphone market as prices near tipping point
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud...
Thursday 26 February 2026
Insight: Qualcomm ships rack-scale AI systems built on 2019 AI 100 chip; analyst sees structural barriers
Qualcomm has begun delivering rack-scale AI hardware and software systems for data centers, built around its AI 100 inference chip. The move signals a renewed push into a market where...
Thursday 19 February 2026
DIGITIMES Insight: TSMC's swelling facilities budget signals a global capacity race
When chipmakers spend big, it is usually the machines that cost the most. Process equipment — the lithography tools, deposition systems, and etch chambers that define the bleeding...
Thursday 19 February 2026
DIGITIMES Insight: US tariff-credit design could pressure Korean memory makers to localize production
A proposed US tariff and duty-exemption framework could force Korean memory suppliers to accelerate US fab investments or risk losing AI server market share, according to DIGITIMES...
Wednesday 18 February 2026
DIGITIMES Insight: TSMC's Kumamoto 3nm upgrade targets automotive, AI demand rather than Rapidus
TSMC's decision to upgrade its second Kumamoto fab to 3nm reflects long-term customer demand and supply chain strategy rather than competitive pressure from Rapidus, according to Luke...
Wednesday 11 February 2026
DIGITIMES Insight: Intel 14A delays expose cracks in AI infrastructure expectations
Intel's 14A process node has become a focal point for the semiconductor industry, with market observers viewing it as a critical test of the company's manufacturing resurgence strategy...
Monday 9 February 2026
Insight: ASIC servers accelerate liquid cooling adoption, share set to surge in 2026
Liquid cooling adoption has been led by Nvidia servers, with ASIC servers now accelerating the shift. DIGITIMES Research estimates liquid cooling will account for 50% of AI server...
Tuesday 3 February 2026
Research insight: Blue Origin's TeraWave bets on space-based optical backhaul
Blue Origin recently unveiled plans to deploy its TeraWave satellite constellation starting in the fourth quarter of 2027, signaling a strategic push into space communications beyond...
Wednesday 21 January 2026
Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...