News tagged Research insights at DIGITIMES

NEWS TAGGED RESEARCH INSIGHTS

Wednesday 7 October 2026

DIGITIMES Insight: HBM expansion raises the bar for memory offload

The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...

Wednesday 7 October 2026

DIGITIMES Insight: AI servers will carry nearly twice as many CPUs per accelerator by 2027

Demand for agentic AI in commercial and consumer markets was rising rapidly, and the market appeal of consumer services such as Meta Muse was expanding. In agentic AI tasks, large...

Monday 5 October 2026

DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks

As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...

Friday 2 October 2026

DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide

Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...

Thursday 1 October 2026

DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration

TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...

Thursday 1 October 2026

DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality

DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...

Wednesday 30 September 2026

DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry

South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...

Saturday 26 September 2026

DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape...

Tuesday 22 September 2026

DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027

The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like...

Monday 21 September 2026

DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment

DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...

Thursday 17 September 2026

DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027

DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...

Wednesday 16 September 2026

DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026

DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy

DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...

Wednesday 16 September 2026

DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend...

Wednesday 16 September 2026

DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

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