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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED REFERENCE DESIGN
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Wednesday 10 November 2021
Compal Broadband expects Wi-Fi 6 to fuel replacement demand in Europe in 2022
Networking device provider Compal Broadband Networks (CBN) expects Wi-Fi 6 to trigger replacement demand in Europe starting 2022, and is therefore optimistic about its operations...
Thursday 20 August 2020
Renesas collaborates with Novatek on surveillance camera reference design
Renesas Electronics has introduced an ultra-high-definition (UHD) surveillance camera reference design developed in collaboration with Novatek Microelectronics and designed by Systemtec...
Monday 2 September 2019
Wintel developing standards for dual-screen notebooks, paving way for foldable-screen models
Intel and Microsoft have recently started establishing standards for dual-screen notebooks and are looking to extend the concept to cover foldable-screen notebooks, according to sources...
Friday 14 June 2019
X-Fab and Efabless announce Raven open-source RISC-V microcontroller
X-Fab Silicon Foundries, an analog/mixed-signal and specialty foundry, and crowd-sourcing IC platform partner Efabless, has announced the silicon availability of the Efabless RISC-V...
Friday 14 December 2018
Micron delivers monolithic 12Gb LPDDR4X DRAM for new MediaTek mobile SoC
Micron Technology has announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference...
Monday 29 October 2018
Altek offers Qualcomm Vision Intelligence-based surveillance camera reference design
Altek has introduced IPC603, an industrial surveillance camera reference design equipped with Qualcomm QCS603 SoC based on Qualcomm Vision Intelligence 300 Platform, for clients to...
Thursday 6 September 2018
Himax teams up with MediaTek, Megvii for 3D sensing solutions
Himax Technologies has announced it is teaming up with fellow IC design company MediaTek and Megvii, a China-based facial recognition start-up, to offer active stereo camera (ASC)...
Friday 13 April 2018
Altek offers reference design for Qualcomm
Digital camera ODM and imaging solution developer Altek has disclosed it has become a design partner for Qualcomm by offering reference designs for two latest Qualcomm SoCs.
Friday 12 January 2018
Spreadtrum and OmniVision introduce turnkey active stereo 3D camera reference design for smartphones
OmniVision Technologies and Spreadtrum Communications have jointly announced what they call the industry's first turnkey active stereo 3D camera reference design for smartphones....
Monday 24 April 2017
Specialty DRAM prices to rise, says AP Memory
AP Memory Technology has disclosed plans to raise its specialty DRAM (SRAM) prices. The memory design house also expressed optimism about demand for IoT applications that will offset...
Thursday 12 January 2017
Macronix memory incorporated in new Qualcomm LTE IoT chipset reference design
Macronix International's NAND MCP memory solution has been adopted and incorporated by Qualcomm as a part of the reference design for a LTE Cat. M1/NB-1 chipset, the MDM9206 modem,...
Wednesday 14 January 2015
Intel expands 2-in-1 reference design coverage to 12.5-inch display
In addition to improving its 14nm Core M processors' specifications, Intel has recently expanded its US$349-399 2-in-1 devices' reference design to cover 12.5-inch display products,...
Tuesday 9 September 2014
Genesys Logic announces a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics
Genesys Logic, Inc., a leading IC design company in mixed-signal, high-speed I/O technologies, today announced a reference design pairing its USB 3.0 card reader controller GL3221...
Wednesday 23 October 2013
Inductor makers seeking to provide solutions for MediaTek 8-core chip reference design
MediaTek is set to mass produce its 8-core handset solutions in November, and will disclose component partners for the chip reference design. Inductor makers including Chilisin Electronics,...
Thursday 10 July 2014
Panasonic 3E 2-in-1
The Panasonic 3E is a tablet that comes with a detachable keyboard to deliver notebook capabilities. It is built on Intel's 2-in-1 reference design as a device for K-12 students. The Panasonic 3E ships with a comprehensive software bundle of essential K-12 applications. It also features a thermometer probe, on-board cameras and an add-on lens that enhance science and mathematics learning.
Friday 6 June 2014
Intel 14nm fanless mobile PC reference design
Intel has revealed its 14nm fanless mobile PC reference design. The 2-in-1 is a 12.5-inch screen that is 7.2mm thin with keyboard detached and weighs 670g. It includes a media dock that provides additional cooling. The design is based on the first of Intel's next-generation 14nm Broadwell processors that are purpose-built for 2-in-1s and will be in the market later this year. The reference design is powered by Intel's Core M processor for energy efficiency.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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