IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...
The outlook for mobile RAM remains optimistic despite weaker-than-expected demand thus far in 2011, according to sources at major Taiwan-based memory packaging and testing houses...
Memory packaging and testing firm Powertech Technology (PTI) has revised downward its capex budget for 2011 to less than NT$10 billion (US$345 million) from the previously-planned...
The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...
Memory packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering both expect their fourth-quarter revenues to be lower than the levels recorded in the...
With 2Gb DDR3 prices having tumbled to near cost, Elpida Memory reportedly has decided to scale back its output to allow prices to bounce back. The Japan-based DRAM chipmaker plans...
Powertech Technology (PTI) has guided that its third-quarter consolidated revenues will see a sequential decline with a lower gross margin, citing a fall in demand for DRAM packaging...
Powertech Technology (PTI), Walton Advanced Engineering and Formosa Advanced Technologies (FATC) have reported sequential growth in revenues for June 2011 of 2.9%, 0.8% and 1.7%,...
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Memory IC packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering have revised downward their targeted sales contributions from mobile DRAM products...
Contract quotes for DRAM packaging and testing services have been facing downward pressure, and are likely to decline over 10% in the third quarter of 2011, according to a Chinese-language...
Walton Advanced Engineering, which mainly provides backend services for DRAM companies, has forecast revenues for the third quarter of 2011 will stay flat or grow slightly by up to...
Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...
Packaging and testing firm Powertech Technology expects its revenues to stay flat sequentially in the third quarter of 2011, with a possibility of low-single digit growth, according...
Power ASE Technology, a subsidiary of Advanced Semiconductor Engineering (ASE) specializing in DRAM packaging and testing, has announced that the company has sold some of its high-speed...
