Taiwan-based backend houses including ASE, KYEC and SPIL have instructed their employees not to make non-essential business travels to China, as part of their precautions to mitigate...
Backend house Powertech Technology (PTI) expects its revenues to be higher than year-ago levels in the first quarter of 2020, and is positive about its performance in all of the ye...
Memory backend specialists have expressed optimism about demand for SSDs and other flash-based devices in 2020, while being upbeat about NAND flash chip prices this year.
FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...
Memory module manufacturers and backend service providers have seen end-market demand pick up recently, and are gearing up to meet 5G-driven demand with their sufficient supplies...
Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Backend house Powertech Technology (PTI) has disclosed it is building new production capacity to meet strong customer demand coming in the first quarter of 2020.
TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...
Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip...
Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market...
Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...
Memory and logic IC backend house Powertech Technology (PTI) expects to post sequential growth in revenues for both the third quarter and the second half of 2019, judging from recovery...
Taiwan-based memory backend specialists have seen clear order visibility through the fourth quarter of 2019, as they have directly or indirectly tapped into the supply chains of major...
IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the...
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
