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Friday 5 May 2023
WinWay to open new probe card plant in May
WinWay Technology is scheduled to hold an inauguration ceremony for its new probe card plant in southern Taiwan at the end of May, according to the IC test interface solutions prov...
Thursday 4 May 2023
Nanya revenue increases for 2nd consecutive month
DRAM maker Nanya Technology's revenue increased for the second consecutive month in April.
Tuesday 25 April 2023
Connector maker SpeedTech unveils new factories overseas
Speedtech, a Taiwan-based connector manufacturer, has announced new factory projects in Mexico and Malaysia to meet the needs of customers in the decentralized supply chain.
Tuesday 18 April 2023
Leatec steps up deployment in EV sector
Leatec Fine Ceramics, a Taiwan-based dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, has stepped up its deployment in the EV sector.
Thursday 13 April 2023
Winbond obtains NT$20 billion syndicated loan
Winbond Electronics has signed a seven-year syndicated loan agreement for NT$20 billion (US$656.3 million) with 11 local banks in Taiwan, according to the specialty DRAM and flash...
Wednesday 12 April 2023
China's focus on mature node IC technology may provide it a bargaining advantage
China's focus on the development of mature-node process technology for ICs may provide it with a bargaining advantage, according to industry observers.
Thursday 6 April 2023
Gudeng expects over 40% revenue surge in 2023
Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer, expects its revenue to exceed NT$6.5 billion (US$211.1 million) in 2023 and rise further to top the...
Thursday 6 April 2023
Samsung leads while BOE increases small medium AMOLED shipment market share in 2022
New research from Omdia indicates that in 2022, Samsung maintained its top position with 56% of the total market in terms of small medium size AMOLED market share, with BOE gradually...
Thursday 30 March 2023
TSEC to add new solar cell and module lines in 2Q23
Solar cell and PV module maker TSEC expects the arrival of new production capacity to boost its total output by over 30%.
Thursday 30 March 2023
Structural advantages key to Taiwan IC industry development in next decade, says DIGITIMES president
Taiwan's semiconductor manufacturing sector boasts structural advantages in its next decade of development, but the advantages for its IC design sector are likely to change, according...
Thursday 30 March 2023
IC backend firms urged to expand production capacity in Southeast Asia
IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources.
Monday 20 March 2023
Taiwan IC design houses turn cautious in dealing with Chinese customers
The structural conflict between the US and China seems to be increasingly free of gray areas, and Taiwan's IC design sector, which has been least affected by the semiconductor trade...
Monday 20 March 2023
Resonac enters mass production of new-gen SiC epi-wafers for EVs
Japan-based Resonac, formerly Showa Denko, kicked off volume production of its new-generation 6-inch SiC epi-wafers on March 1, aiming to serve the needs of EVs and other high-end...
Wednesday 15 March 2023
GlobalWafers sees customers' advance payments top US$1 billion
GlobalWafers received an all-time high of NT$39.73 billion (US$1.3 billion) in advance payments made by its customers as of the end of 2022, according to the silicon wafer company,...
Wednesday 15 March 2023
Passive component industry may rebound substantially in 2Q-3Q, says Yageo
The passive component industry may see a significant rebound in the second and third quarters of this year, according to Yageo, which believes that the worst is over.