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Friday 19 December 2025
Exclusive: Former TSMC COO talks discipline and unity behind success
Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES'...
Friday 19 December 2025
Commentary: Why China's GPU start-ups command billion-dollar valuations despite losses
China's GPU start-ups are back at the center of a capital-market frenzy. Following Moore Threads, five-year-old MetaX has listed on Shanghai's STAR Market, with its shares surging...
Friday 19 December 2025
Analysis: US leads AI in humanoid robots while China excels in cost and hardware
As humanoid robots emerge as a key technology riding the wave of AI, the US and China are rapidly forming two competing camps. Industry insiders analyzing their strengths say the...
Wednesday 17 December 2025
Commentary: Intel's SambaNova move signals AI chip consolidation era
Intel is reportedly seeking to acquire SambaNova, a prominent AI inference chip specialist. The deal has a high probability of closing, primarily due to a significant governance alignment:...
Wednesday 17 December 2025
Energy efficiency: The new battleground for AI servers
AI is inevitably driving innovation in global server architecture. AI servers differ significantly from traditional servers in design philosophy and operational mode. This reflects...
Tuesday 16 December 2025
Commentary: Broadcom and MediaTek face profit challenges amid growing ASIC orders
Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry...
Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang...
Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
Thursday 11 December 2025
Commentary: China's PCB edge survives G2 decoupling
As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling...
Thursday 11 December 2025
Commentary: China's tech M&A unravels from EDA to compute
China's tech capital markets have slipped into a drawn-out, messy stretch, with multiple high-profile mergers either collapsing or failing to advance beyond early talks.
Wednesday 10 December 2025
Micro LED's moment: Asia races to dominate the next display revolution
As display technology continues to advance, Micro LED has emerged as the next star after LCD and OLED—drawing intense interest and investment from panel makers worldwide.
Tuesday 9 December 2025
Commentary: Are East Asia tensions a threat to supply chains?
The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia,...
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Monday 8 December 2025
Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...