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    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    Sep 14, 18:47
    Xpeng expands Turing chip from EVs into humanoid robots
    Sep 14, 18:47
    Corning sees CPO and glass core as new semiconductor battlegrounds
    Sep 14, 18:47
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
    Sep 14, 18:46
    China's AIDC token costs hinge on access to advanced GPUs
    Sep 14, 18:46
    NEWS TAGGED OPINION
    Tuesday 15 September 2026
    Robot supply strategies split between US in-house tech and Chinese local ecosystem
    As humanoid robots gradually move from laboratory proofs-of-concept and enter industrial manufacturing and commercial service, their underlying motion control and environmental perception...
    Tuesday 15 September 2026
    Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

    The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

    Tuesday 15 September 2026
    The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
    "He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
    Monday 14 September 2026
    DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
    ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Monday 14 September 2026
    DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
    Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
    Sunday 13 September 2026
    Column: What is SLAM? The first step in Physical AI
    We previously discussed how automation removes environmental uncertainty, while autonomy requires systems to operate in complex settings. The biggest difference is that autonomous...
    Saturday 12 September 2026
    Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead
    Apple has finally unveiled the long-anticipated foldable iPhone Duo, with former CEO Tim Cook making a brief appearance at the start of the launch video. The moment suggested the device...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Saturday 12 September 2026
    Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware
    King Slide Works posted the fastest revenue growth in August among the 50 Taiwan-listed AI supply chain companies tracked by DIGITIMES, with sales up 318% from a year earlier...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Wednesday 9 September 2026
    Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
    In September 2020, Huawei's smartphone business suffered a severe blow.
    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
    A battery quality controversy involving GAC Aion has put supplier CALB, the world's fourth-largest EV battery maker, under scrutiny and highlighted a less comfortable side of China's...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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