CONNECT WITH US
NEWS TAGGED OPINION
Tuesday 5 May 2026
Analysis: Big Tech's AI tab tops US$700 billion with Google Cloud pulling ahead — but investors are picking sides
The AI spending arms race just got more expensive — and more consequential.
Tuesday 5 May 2026
Commentary: US auto market faces a three-way vacuum as tariffs deepen imbalances
US President Donald Trump's decision to raise tariffs on European automobiles and parts to 25% is compounding the US car market in the first quarter of 2026, where the absence of subsidies...
Tuesday 5 May 2026
SignalPro positions itself as 'translator' to enter AI sensing sector, builds own AI data center as model refinery
Amid the rapid advancement of generative AI and the simultaneous rise of autonomous vehicles and robotics, industry competition is shifting away from pure computing power and hardware...
Tuesday 5 May 2026
Analysis: How China’s HJT curb accelerates domestic consolidation and redefines solar competition
China is reportedly planning targeted export rules for heterojunction (HJT) solar equipment. The move has sparked broad industry debate in 2026, as energy transition and aerospace...
Tuesday 5 May 2026
Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
Monday 4 May 2026
Commentary: Intel names TSMC as key partner; insider drives its comeback

One year into his tenure, Intel CEO Lip-Bu Tan struck a markedly different tone on the company's outlook. At the first-quarter 2026 earnings...

Monday 4 May 2026
Research Insight: Beijing auto show signals shift from vehicle launches to AI-driven supply chains
The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and...
Friday 1 May 2026
TeraFab is already changing the semiconductor landscape — before a single chip is made
Elon Musk has a habit of building what he cannot buy.
Friday 1 May 2026
Commentary: Honor's robot win highlights thermal edge in robotics
The Beijing Humanoid Robot Half Marathon has concluded, but its outcome has ignited a wider industry debate. Rather than a leading robotics specialist, smartphone maker Honor emerged...
Thursday 30 April 2026
Analysis: Chinese smart home brands outpace Western rivals with relentless innovation
Chinese smart home appliance brands have swept across global consumer markets on the strength of youthful, innovative brand images. Analysts point to one defining trait: product iteration...
Wednesday 29 April 2026
Commentary: How TSMC anchors Taiwan's semiconductor supply chain from within
As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost...
Wednesday 29 April 2026
Commentary: China's chip-model strategy pressures Nvidia's AI economics
The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend...
Wednesday 29 April 2026
Commentary: At Beijing Auto Show, hardware takes the wheel
For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded...
Wednesday 29 April 2026
Texas Instruments executive discusses high-voltage power architecture for AI data centers
Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...