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NEWS TAGGED ON-DEVICE AI
Tuesday 16 June 2026
Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that...
Monday 15 June 2026
Samsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results...
Friday 5 June 2026
South Korea finalizes US$520 million on-device AI chip budget amid industry doubts
South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal,...
Thursday 28 May 2026
Lenovo bets on on-device AI to lift business PC upgrades
Lenovo is betting that rising cloud AI costs and privacy risks will drive enterprises toward on-device AI, reshaping corporate PC buying and upkeep globally. The vendor's 2026 AI agent...
Thursday 7 May 2026
Snapdragon tops India's chipset trust rankings: Counterpoint Research
A Counterpoint Research survey finds Snapdragon is India's most trusted chipset brand across smartphones, audio, XR devices, and passenger vehicles, signaling that chipset performance...
Saturday 11 April 2026
Samsung Exynos 2700 benchmark leak offers early look at 2nm SF2P performance
Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process...
Thursday 19 March 2026
Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.
Tuesday 10 March 2026
SK Hynix develops 1c LPDDR6 DRAM for AI devices

SK Hynix on March 10 announced it has developed a 16Gb LPDDR6 DRAM using its sixth-generation 10nm-class (1c) process technology, marking...

Wednesday 4 March 2026
AGI and Snapdragon showcase private, app-agnostic AI for devices at MWC 2026
AGI has announced a collaboration to optimize its agent technology for Snapdragon-powered devices, aiming to expand private, on-device AI capabilities across smartphones, PCs, and...
Friday 16 January 2026
MediaTek scales flagship performance with Dimensity 9500s and 8500
MediaTek has launched the Dimensity 9500s and Dimensity 8500 mobile processors, both carrying over key technologies from the company's flagship Dimensity platform. The new chips deliver...
Tuesday 13 January 2026
CES 2026 highlights on-device AI as standard, reshaping AI PC architecture
At CES 2026, AI PCs are accelerating toward widespread adoption with a fundamental shift: AI has evolved from a single feature to the core architecture of entire products. This transformation...
Thursday 16 October 2025
Apple introduces M5 chip with major AI and performance upgrades
Apple has announced its latest system-on-chip (SoC), the M5, marking a major step forward in the company's in-house silicon roadmap. Built on third-generation 3nm process technology,...
Wednesday 17 September 2025
Qualcomm dominates physical AI with robot and automotive chips
Robots and self-driving cars are driving the emergence of "physical AI," a new era of on-device processing that's shifting focus away from cloud-based large language models. According...
Thursday 11 September 2025
SK hynix begins supplying mobile NAND solution ZUFS 4.1
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...
Thursday 28 August 2025
SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
SK hynix Inc. announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound material for the...