Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.

Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.

Intel announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450Mbps. It expands Intel's portfolio of LTE solutions, giving device manufacturers an option to design and launch LTE devices in various market segments and geographies. At Mobile World Congress (MWC) 2015, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1Gbps using Intel technology end-to-end.