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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED MODEM
Wednesday 13 April 2022
Strong shipments for AIoT devices boost MediaTek 1Q22 revenue
MediaTek enjoyed strong shipments for AIoT device applications, as well as shipments of its power management ICs and ASIC solutions, which helped offset weakness in its mobile SoC...
Tuesday 15 March 2022
MediaTek eyeing Wi-Fi SoCs as new growth driver
MediaTek will see Wi-Fi core chip business rising substantially to become its largest growth driver in 2022, helping offset weakness in handset chip demand so far this year, according...
Wednesday 23 February 2022
ASE eyeing backend orders for Apple-designed 5G modem chips
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Friday 17 December 2021
Taiwan OSATs gearing up for MediaTek 5G mmWave chips
ASE Technology and other Taiwan-based OSATs are gearing up for MediaTek's 5G mmWave chips solutions slated for launch in 2022, according to industry sources.
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Tuesday 23 November 2021
TSMC to ramp up 4nm chip output for new MediaTek flagship SoC
MediaTek with its recently-introduced flagship SoC is eyeing a presence in the non-iPhone flagship 5G smartphone chip market.
Thursday 18 November 2021
Qualcomm to scale down modem chip supply for iPhones
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Thursday 21 October 2021
New MediaTek 5G modem chip built using TSMC 4nm process
MediaTek will enter volume shipments of its new-generation 5G modem based on the latest 3GPP 5G R16 standard in 2022, gearing up for a boom in demand for flagship 5G smartphones,...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Friday 21 May 2021
New Qualcomm 5G SoC built using TSMC 6nm process
Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...
Thursday 29 April 2021
CHPT expects probe card demand to ramp up starting 2Q21
IC testing interface solution provider Chunghwa Precision Test Tech (CHPT) expects probe card demand for all its targeted market segments to ramp up starting the second quarter of...
Thursday 4 March 2021
CHPT rolls out new solutions for handset APs, HPC chips
IC testing interface solution provider Chunghwa Precision Test Tech (CHPT) has rolled out new solutions designed for handset application processors and HPC chips, according to industry...
Tuesday 2 February 2021
MediaTek unveils 5G modem with mmWave support
MediaTek has announced its new M80 5G modem which combines mmWave and sub-6GHz technologies onto a single chip.
Thursday 3 December 2020
ASE obtains FC packaging orders for new Qualcomm 5G SoC
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Tuesday 18 October 2016
Samsung 14nm chips for wearables
Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.
Wednesday 31 August 2016
Samsung 14nm Exynos chips
Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.
Thursday 5 March 2015
Intel XMM 7360 LTE Advanced solution
Intel announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450Mbps. It expands Intel's portfolio of LTE solutions, giving device manufacturers an option to design and launch LTE devices in various market segments and geographies. At Mobile World Congress (MWC) 2015, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1Gbps using Intel technology end-to-end.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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