Unisoc's Ivy 510 5G modem chip has been validated for 5G NR sub-6 GHz signaling, and will be fabricated by TSMC on the 7nm node for official application in the starting year of 5G...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly grabbed orders for all the 5G modem chips that have been introduced by fabless chipmakers, such as Qualcomm's Snapdragon...

Huawei's chipmaking arm HiSilicon is aggressively planning the development of its 5G mobile SoC integrating a modem chip, as well as 5G mmWave solutions for smartphones after releasing...

MediaTek is expected to kick off shipments of its Helio M70 5G modem chips to China smartphone vendors in the second quarter of 2019 to cash in on the first wave of 5G business opportunities,...

Mobile modem chips are likely to become scarce strategic resources in the 5G era, now that Intel has decided to exit the 5G smartphone modem market to focus on 4G and 5G modems for...

TSMC and Samsung Foundry have both disclosed more updates on their EUV process technologies, and are gearing up for a pick-up in replacement demand for smartphones driven by 5G con...

Intel has announced its intention to exit the 5G smartphone modem business and complete an assessment of the opportunities for 4G and 5G modems in PCs, internet of things devices...

MediaTek has reported consolidated revenues increased 57.6% sequentially and nearly 11% on year to a six-month high of NT$22.32 billion (US$723.5 million)...

Intel is reportedly to begin working on engineering projects that will enable mass-production of 5G modem chips with its collaborative partners in the second quarter of 2019, according...

Intel has quietly ceased its 5G partnership with China's state-owned Unisoc, previously know as Unigroup Spreadtrum & RDA, amid ongoing trade tensions between the US and China.

Leading FPGA chip maker Xilinx is aggressively moving to tap into the market for chip solutions for 5G base stations, and the move is expected to increase orders by 15% for Taiwan-based...

While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...

Taiwan-based backend firms have seen orders from MediaTek fall around 10% sequentially in the fourth quarter of 2018, but expect them to start rebounding in January with substantial...

MediaTek has reported November consolidated revenues fell 10.4% sequentially to a nine-month low of NT$18.67 billion (US$604.2 million). Consolidated sales for the first 11 months...

Qualcomm has unveiled its Snapdragon 855 mobile platform to enable commercial 5G networks and mobile devices in early 2019.

The global semiconductor industry revenue grew 7.4% sequentially in the third quarter of 2018, reaching a record US$129.8 billion, according to IHS Markit. Semiconductor growth occurred...

Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...

Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...

Qualcomm has unveiled what the company claims is the world's first fully-integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and other mobile devices...

It remains to be seen whether Apple will commit to buying modem chips from MediaTek for its next-generation iPhone devices despite mounting speculations that the US vendor is considering...

Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract...

MediaTek has newly released its 5G modem chipset solution, the Helio M70, to be fabricated using TSMC's 7nm process incorporating EUV technology, and will kick off official shipments...

The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...

Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.

With the global IoT (Internet of Things) chipset markets, particularly in China, expected to grow sharply in 2018 along with the rapid development of diverse terminal devices and...