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NEWS TAGGED MOBILE DRAM
Thursday 24 March 2011
Samsung starts mass producing 4Gb mobile DRAM
Samsung Electronics has begun mass producing 4Gb, low-power DDR2 (LPDDR2) DRAM using 30nm-class technology, according to the company. The mobile DRAM chip will help the market to deliver...
Tuesday 15 March 2011
Elpida likely to seek support from PTI for packaging and testing
With plant operations disrupted due to power shortages, Japan-based Elpida Memory may ask for assistance from its packaging and testing partner Powertech Technology (PTI), industry...
Wednesday 9 March 2011
PTI sales up 14% on year in February
Memory packaging and testing firm Powertech Technology (PTI) has announced that consolidated revenues for February 2011 grew 14.3% from a year earlier to NT$3.2 billion (US$109 mil...
Tuesday 8 March 2011
Winbond posts drop in February 2011 revenues
Memory chipmaker Winbond Electronics saw revenues drop in February 2011 compared to the prior month and the same period last year.
Tuesday 1 March 2011
PTI and Walton to see strong orders in 2Q11, says paper
Memory-IC packaging and testing houses Powertech Technology (PTI) and Walton Advanced Engineering are expected to see substantial gains in orders in the second quarter of 2011, thanks...
Friday 25 February 2011
Rexchip to volume produce mobile DRAM for Elpida in 3Q11
Rexchip Electronics will start trial production of mobile DRAM products employing Elpida Memory's designs in May 2011, with sample shipments to follow shortly afterward, Elpida president...
Thursday 24 February 2011
ChipMOS to sell idle, non-core assets for US$11.6 million
Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...
Tuesday 22 February 2011
Samsung develops wide I/O mobile DRAM for smartphones, tablets
Samsung Electronics has announced the development of 1Gb mobile DRAM with a wide I/O interface, using 50nm-class process technology. The new wide I/O mobile DRAM will be used in mobile...
Monday 14 February 2011
NAND flash prices unpredictable for 2H11, says Transcend chairman
NAND flash prices will be stable in the first half of 2011, but could fluctuate in the second half due to a combination of supply and demand factors, according to Transcend Information...
Monday 14 February 2011
Mobile DRAM market to grow through 2015, says iSuppli
Mobile DRAM shipments are projected to reach 2.9 billion gigabits (Gb) in 2011, up 71% from 1.7 billion Gb in 2010, according to IHS iSuppli. Growth will continue during the following...
Monday 14 February 2011
Winbond sees firmer NOR pricing in 1Q11
The NOR flash market is moving toward a more balanced supply/demand situation, Taiwan's Winbond Electronics has commented. Chip prices have slipped at a much slower pace after larger...
Thursday 10 February 2011
Elpida, Rexchip develop prototype 1Gb DDR3 with 4F2 technology
Elpida Memory and Rexchip Electronics have jointly announced the successful joint pilot production of 1Gb DDR3 SDRAM featuring 4F2 memory cell architecture. The pilot run was handled...
Friday 28 January 2011
Winbond 4Q10 profits shrink sequentially on lower revenues
Winbond Electronics earned net profits of NT$30 million (US$1.03 million) in the fourth quarter of 2010, down significantly from NT$1.9 billion in the prior quarter. Revenues slid...
Friday 28 January 2011
Tablet DRAM demand to surge in 2011, says iSuppli
Bucking weak conditions for the overall DRAM market in 2011, DRAM shipments for tablets are expected to explode by a factor of more than nine this year, according to IHS iSuppli.
Thursday 27 January 2011
Limited available capacity to halt DRAM price falls
In the face of growing demand for mobile RAM, specialty DRAM and NAND flash memory, key memory chipmakers are more prone to allocate their 12-inch capacity to the faster-growing segments...