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NEWS TAGGED MOBILE DRAM
Monday 12 July 2021
Adata expects double-digit rise in DRAM contract prices
Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Monday 8 March 2021
SK Hynix announces mass production of 18GB LPDDR5 mobile DRAM
SK Hynix has kicked off mass production of 18GB LPDDR5 mobile DRAM, which offers the largest capacity in the industry, according to the company.
Friday 29 January 2021
Micron delivers 1α DRAM technology
Micron Technology has announced volume shipments of 1α (1-alpha) node DRAM products.
Friday 4 September 2020
Memory chipmakers hold nearly 4 months of inventories
Samsung Electronics and some others have held nearly four months of DRAM and NAND flash inventories on average, due to a slowdown in orders for datacenter applications and overall...
Tuesday 1 September 2020
Samsung begins mass production of 16Gb LPDDR5 DRAM
Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.
Thursday 23 July 2020
SK Hynix posts profit hike in 2Q20
SK Hynix has reported operating profits of KRW1.95 trillion (US$1.62 billion) on consolidated revenue of KRW8.61 trillion for the second quarter of 2020.
Thursday 12 March 2020
DRAM vendors enhance LPDDR5 offerings
Memory vendors have enhanced their LPDDR5 mobile DRAM offerings to include those for midrange 5G-capable smartphones.
Monday 10 February 2020
Winbond swings to loss in 4Q19
Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in 27 quarters.
Wednesday 5 February 2020
Mobile DRAM demand uncertainty emerges
Mobile DRAM demand for smartphones is likely to disappoint in the first half of 2020, as the coronavirus outbreak may hit sales of new 5G-compatible phones, according to market sou...
Wednesday 15 January 2020
PTI expects sales growth in 1Q20
Backend house Powertech Technology (PTI) expects its revenues to be higher than year-ago levels in the first quarter of 2020, and is positive about its performance in all of the ye...
Thursday 2 January 2020
NAND flash prices to rise by up to 40% in 2020
NAND flash contract prices are forecast to rise by up to 40% in 2020, according to sources at memory chipmakers.
Monday 30 December 2019
LPDDR5 to become new DRAM standard for 5G smartphones in 2020
LPDDR5 mobile DRAM is expected to be widely adopted in 5G smartphones in 2020 with Samsung Electronics set to feature its in-house made LPDDR5 memory in its flagship 5G smartphones...
Monday 16 December 2019
DRAM contract prices to stop falling in 1Q20, says DRAMeXchange
DRAM spot market prices have begun to rebound, according to DRAMeXchange. Market sentiment has been strengthened while buyers are more willing to raise their inventory levels.
Tuesday 3 December 2019
Memory ASP to rebound sharply in 2020
Average selling prices (ASP) for memory could rise as much as 30% in 2020, driven mainly by strong demand for server and mobile applications, according to industry sources.
Thursday 2 June 2016
Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe solid state drive (SSD) in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebook PCs. The new BGA NVMe SSD, named PM971-NVMe, features a compact package that contains all essential SSD components including NAND flash memory, DRAM and controller. Configuring the PM971-NVMe SSD in a single BGA package was enabled by combining 16 of Samsung's 48-layer 256Gb V-NAND flash chips, one 20nm 4Gb LPDDR4 mobile DRAM chip and a high-performance Samsung controller. The new SSD is 20x16x1.5mm and weighs only about one gram. The single-package SSD's volume is approximately a 100th of a 2.5-inch SSD or HDD, and its surface area is about a fifth of an M.2 SSD. The PM971-NVMe SSD enables sequential read and write speeds of up to 1,500MB/s and 900MB/s respectively, when TurboWrite technology is used. The performance figures can be directly compared to transferring a 5GB-equivalent, Full-HD movie in about three seconds or downloading it in about six seconds. It also boasts random read and write IOPS of up to 190K and 150K respectively. The PM971-NVMe SSD line-up will be available in 512GB, 256GB and 128GB storage options. Samsung will start providing the new SSDs to its customers in June worldwide.
Friday 18 September 2015
Samsung 12Gb LPDDR4 DRAM
Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is expected to significantly accelerate the adoption of high-capacity mobile DRAM worldwide, Samsung indicated. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, the company said. Compared to the preceding 20nm-based 8Gb LPDDR4, the 12Gb version is more than 30% faster at 4,266Mbps, and is twice as fast as DDR4 DRAM for PCs, while consuming 20% less energy, Samsung claimed. Manufacturing productivity of the 12Gb LPDDR4 has been raised more than 50% over that of 20nm-class 8Gb LPDDR4, the company said. The 12Gb LPDDR4 enables 3GB or 6GB of mobile DRAM in a single package using two chips and four chips respectively, while being the only solution that can provide a 6GB LPDDR4 package, Samsung said. Based on the new 12Gb LPDDR4, the 6GB package can fit into the same space used for 3GB LPDDR4 packages currently available, the company indicated.
Tuesday 10 February 2015
Samsung ePoP memory for smartphones
Samsung Electronics is mass producing ePoP (embedded package on package) memory, a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC and a controller. For use in high-end smartphones, the thin ePoP can be stacked directly on top of the mobile processor. The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth. Because of its thinness and heat-resistant properties, Samsung's smartphone ePoP does not need any space beyond the 225mm2 (15 by 15mm) taken up by the mobile application processor. A conventional PoP (also 15 by 15mm), consisting of the mobile processor and DRAM, along with a separate eMMC (11.5mm by 13mm) package, takes up 374.5mm2. The single-package configuration also meets the semiconductor package height ceiling of 1.4mm, Samsung said.
Jul 23, 10:33
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
Tuesday 13 July 2021
MOBI standards guide innovation in blockchain services for growth in smart mobility industry
Wednesday 7 July 2021
ADLINK helping manufacturers upgrade businesses with private 5G network-enabled smart manufacturing solutions
Wednesday 7 July 2021
Coretronic leverages strengths to enable smart manufacturing
TSMC dossier (8): Can China establish leadership in semiconductor sector?
ASC 100: Motherson Sumi rides EV wave
Mitac sees 52-week lead time for server component deliveries
PCB firms shipping in small volumes for upcoming AirPods
Chip probing houses to gain from new iPhone SE series, say sources
O-RAN in uncertain future
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
Google, VW, Toyota keen to develop car operating systems
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