China is sharpening its focus on the memory chip industry, with DRAM leader Changxin Memory Technologies (CXMT) driving major production expansions and next-generation product development,...
Memory prices are declining across all segments and are expected to continue their downward trajectory in the first quarter of 2025, according to industry sources.
SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).
As global memory manufacturers race to advance DDR5 technology, a dispute has emerged over China's semiconductor capabilities. Zol.com.cn reports that Changxin Memory Technologies...
Memory IC design house Etron Technology expects to return to profitability in the first half of 2025, as it actively pursues edge AI potential for gross margin enhancement.
The World Semiconductor Trade Statistics (WSTS) has issued an optimistic outlook for the semiconductor industry, revising its 2024 predictions upward. The forecast anticipates a robust...
The latest wave of export restrictions from the US on High Bandwidth Memory (HBM), particularly targeting advanced technologies such as HBM2 and above, is set to compel China's memory...
Memory module maker TeamGroup anticipates heightened demand for high-end memory products in the first quarter of 2025, with low-end memory demand expected to follow suit in the second...
Memory module manufacturer Adata Technology anticipates memory contract prices will stay stable or see slight declines in the fourth quarter of 2024, with the company continuing to...
The memory module industry faces significant challenges in the fourth quarter of 2024, with Transcend Information experiencing substantial inventory depreciation losses amid plummeting...
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
With the demand for memory driven by AI servers, the industry initially expected contract prices to ease and decline in the fourth quarter. However, sources within the supply chain...
The AI surge is fueling unprecedented demand for High Bandwidth Memory (HBM), prompting Winbond Electronics to focus on tailored AI memory solutions for end applications. The company...
