中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China's EV price war defies govt control, complicating EU tariff strategy
Electric Vehicles
10min ago
Broadcom hits record quarter, secures reportedly US$10B AI chip deal for 2026
Semiconductors
13min ago
Can CPU iterations still drive PC upgrade waves? Acer CEO says no
ICT
22min ago
G2 AI race: US bets on AGI while China eyes applications
ICT
22min ago
O-RAN falters in Taiwan: factory outages, funding strains shift focus to AI-RAN
Communications
33min ago
California dealers file lawsuit to block Sony's Afeela 1 direct sales
Electric Vehicles
42min ago
China's BAT boosts AI infrastructure spending by 168% in 2Q25
Tomorrow's Headlines
Sep 4, 18:05
China's auto dealers hang by a thread amid 1H25 price war
Tomorrow's Headlines
Sep 4, 18:05
NEWS TAGGED LOOP TELECOM
Friday 16 February 2024
Loop Telecom sees success in transition to MCC market
Since its transition toward offering solutions for mission-critical communications (MCC), Loop Telecommunication International has set its eyes on infrastructure projects in North...
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
MOST-READ
7 DAYS NEWS
TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
Intel CEO rebuffs Trump resignation call in staff letter
South Korea's Nextin expands China operations as G2 strains deepen
Huawei remains China’s sole heavyweight in AI chips
Hyundai hydrogen vision challenged by South Korea's shrinking budget
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'
Samsung enters HBM4 race with aggressive pricing to win Nvidia supply deal
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first