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Monday 17 October 2011
ASE seeking US$200 million syndicated loan, says paper
Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...
Thursday 6 October 2011
PCB drilling service provider Evatech signs syndicated loan agreement with DBS Bank
Eva Technologies (Evatech), which provides OEM PCB drilling services for HDI boards and IC substrates, has signed a syndicated loan agreement with a banking consortium led by DBS...
Monday 26 September 2011
Hanwha SolarOne obtains US$100 million loan
Hanwha SolarOne, a vertically integrated manufacturer of silicon ingots, wafers and photovoltaic cells and modules in China, announced it has obtained a five-year loan for US$100...
Monday 19 September 2011
Winbond secures NT$7 billion syndicated loan
Taiwan-based Winbond Electronics, a supplier of niche-market DRAM and NOR flash, on September 19 announced that it has secured a syndicated bank loan of NT$7 billion (US$236 million)...
Wednesday 14 September 2011
CMI to sign over US$1 billion loan, says paper
Chimei Innolux (CMI) is planning to sign a syndicated loan of US$1-1.5 billion with a banking consortium led by China Trust Commercial Bank (CTCB), the Chinese-language Commercial...
Tuesday 30 August 2011
Nanya, Inotera receive loans from affiliate
Nan Ya Plastics has issued filings with the Taiwan Stock Exchange (TSE) disclosing two separate one-year loans it has provided to DRAM manufacturers Nanya Technology and Inotera Me...
Friday 26 August 2011
Wintek signs US$200 million syndicated loan
Taiwan's touch panel maker Wintek signed a syndicated loan agreement of US$200 million with a consortium of 18 banks, including state-owned Taiwan Bank, on August 25, 2011, to strengthen...
Thursday 18 August 2011
Vibo signs NT$5.1 billion syndicated loan
Vibo Telecom, a 3G mobile telecom carrier in Taiwan, has signed a NT$5.1 billion (US$176 million) five-year syndicated loan agreement with a consortium of 16 banks, with one-third...
Wednesday 27 July 2011
ProMOS creditors agree debt-for-equity swap
ProMOS Technologies had been in talks with its creditor banks, and finally worked out plans to ease its financial burden. The company announced it has struck a deal with more than...
Thursday 14 July 2011
ChipMOS secures NT$8.4 billion syndicated loan
IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...
Friday 20 May 2011
GET to apply for joint lending of up to US$84 million
Green Energy Technology (GET), a Taiwan-based producer of solar-grade polycrystalline silicon wafers, will apply for a 5-year syndicated loan of up to US$84 million from local banks,...
Thursday 28 April 2011
Wafer firms receive loans for capacity expansions
Eversol recently received a syndicated loan from 21 financial institutions totaling NT$5 billion for its new wafer facility and equipment in Taoyuan, Taiwan.
Thursday 24 March 2011
Walton to loan Powerchip NT$300 million
Walton Advanced Engineering's board of directors has approved a proposal to lend Powerchip Technology NT$300 million (US$10 million), according to a company filing with the Taiwan...
Wednesday 2 March 2011
Powerchip approved to extend maturity of loans for six months
Taiwan's Powerchip Technology has received approval to extend the maturity of its mid- and long-term loans for six months, according to a company filing with the Taiwan Stock Exchange...
Tuesday 25 January 2011
Cando signs NT$4.8 billion syndicated loan
Cando has signed a syndicated loan with banks for NT$4.8 billion (US$164.98 million) to complete its capex goal of NT$8.5 billion for 2011 for capacity expansion.