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Global EV sales and battery capacity
11h 16min ago
NEWS TAGGED KINGPAK
Monday 25 January 2021
Automotive CIS backend business set to boom throughout 2021
Taiwan's CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries are poised to embrace major growth momentum throughout 2021 as they have landed one-year...
Monday 16 November 2020
ASE reportedly joins Sony supply chain for automotive CIS
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Friday 17 July 2020
CIS packager Tong Hsing breaks ground for new plant in Taiwan
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has broken ground for a new plant complex...
Tuesday 2 June 2020
Passive component makers see demand rise on China car sales pickup
As China's car market has started picking up gradually since the second half of April, demand for auto-use passive components, diodes and MOSFET devices is expected to grow significantly...
Tuesday 14 April 2020
Taiwan CIS, 3D sensor packagers see revenues rally on strong demand
CMOS image sensor (CIS) devices have seen a rapid surge in demand for security surveillance and video conferencing applications due to lockdowns amid the coronavirus pandemic. This,...
Friday 10 April 2020
Tong Hsing CIS, RF modules packaging business thriving on strong demand
Tong Hsing Electronic Industries, a specialist in wafer reconstruction, micro module assembly and backend services for CMOS image sensors and other niche ICs, continues to enjoy strong...
Thursday 27 February 2020
CIS backend firm Tong Hsing to double capacity by end-2020
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), has disclosed plans to double monthly production capacity to 150,000-160,000...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Friday 8 November 2019
CIS packager Kingpak sees impressive revenue rise in October
CMOS image sensor (CIS) packaging specialist Kingpak Technology has reported consolidated revenues of NT$205 million (US$6.8 million) for October 2019, surging 30% sequentially and...
Tuesday 9 July 2019
Taiwan chipmakers gearing up for 3D sensor market boom
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Monday 20 May 2019
CIS packager Kingpak revenues for 2Q19 to see slight sequential fall
Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...
Wednesday 10 April 2019
Niche-IC backend specialists enjoy strong 1Q19
GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...
Tuesday 12 March 2019
Backend firms KYEC, Kingpak and GEM to see sales buck seasonal trends in 1H19
King Yuan Electronics (KYEC), Kingpak Technology and GEM Services are expected to see their sales growth exceed the seasonal average in the first half of 2019, outperforming their...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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