中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
AI Expo
Memory chips
Nvidia
AI Search
NTN Convergence
Robotics Report
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China's NAURA Technology and AMEC accelerate hybrid bonding equipment development
Tomorrow's Headlines
7h 3min ago
China's CSPs shift server supply chains to SEA amid rising AI demand
Tomorrow's Headlines
7h 3min ago
Commentary: What does Tesla's Terafab's approximity to Samsung Texas plant tell us?
Tomorrow's Headlines
7h 3min ago
Chinese automakers surpass Tesla in Europe's accelerating EV market
Tomorrow's Headlines
7h 3min ago
Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
Tomorrow's Headlines
7h 3min ago
Why is SiCarrier absent from SEMICON China 2026?
Tomorrow's Headlines
7h 3min ago
NEWS TAGGED KAEDAR
Wednesday 18 August 2010
Pegatron makes further comments on Apple-kickback scandal subsidiary
Pegatron Technology has made further comments regarding its subsidiary Kaedar Electronics, which is involved in a kickback scandal involving an Apple employee, saying that Kaedar was...
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
7 DAYS NEWS
TSMC leads foundry price hikes as second-tier firms see profit rebound
Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
DRAM prices to surge up to 70% in 2Q26; Nvidia GTC 2026 ignites AI memory rally
HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Analysis: Qualcomm restructures Asia operations, giving Taiwan greater strategic weight
Broadcom expects optical communication supply chain capacity issues to ease by 2027
Arm unveils AGI CPU aimed at scaling agentic AI, promising higher rack performance and lower data center costs
Commentary: How Taiwan's chip talent flow is shifting—lessons from SMIC and Terafab
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first