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Monday 14 August 2017
ChipMOS to enter production for 3D sensing components in 3Q17, says report
Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Monday 14 August 2017
GCS optimistic about VCSEL demand for data centers
Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has expressed optimism about gallium arsenide (GaAs) demand for vertical cavity surface-emitting...
Thursday 10 August 2017
ChipMOS obtains backend orders from Novatek
ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...
Friday 28 July 2017
ChipMOS Shanghai obtains backend orders for NOR flash from XMC
ChipMOS Technologies (Shanghai), a joint venture between Taiwan-based ChipMOS and Tsinghua Unigroup, has obtained backend orders for NOR flash memory from Wuhan Xinxin Semiconductor...
Wednesday 26 July 2017
Inventec reports losses for subsidiary TPV-Inventa
Inventec has announced it has stopped collecting accounts receivable from its subsidiary TPV-Inventa in order to write off TPV-Inventa's bad debts of around CNY11 million (US$1.66...
Tuesday 25 July 2017
Kinsus net profits fall 82% in 1H17
IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...
Friday 21 July 2017
Chip demand for data centers to boom in China
With China's local governments looking to set up data centers, chip demand for data centers locally is set to surge, according to industry sources.
Thursday 29 June 2017
Taiwan solar cell makers plan to set up joint venture PV module factory
Taiwan-based crystalline silicon solar cell makers plan to set up a joint venture PV module factories via strategic alliances to target domestic demand, according to industry sourc...
Thursday 29 June 2017
TSEC scraps JV plan for new PV module plant
Solar cell maker TSEC has decided to cancel a plan to establish a joint venture to manage a new PV module factory in Pingtung County, southern Taiwan, and instead will set up a PV...
Thursday 29 June 2017
UltraChip, INT Tech form joint venture to develop AMOLED driver ICs
Taiwan's knowledge-based startup INT Tech and LCD driver IC maker UltraChip have set up a joint venture, Ultra Display, which will focus on development of driver ICs for AMOLED pan...
Wednesday 28 June 2017
Powerchip opens JV fab in China
Powerchip Technology has completed the construction of its 12-inch fab in Hefei, China and started to run the fab, according to the Taiwan-based foundry chipmaker. The fab...
Thursday 22 June 2017
Compal evaluating partnership with LeEco
Commenting on its relationship with China-based LeEco, Compal Electronics president Ray Chen has said the company will complete an evaluation of LeEco at the end of June and will...
Wednesday 21 June 2017
WD comments on Toshiba bid on flash JV
Western Digital has issued a statement regarding Toshiba's selection of a consortium led by Korea-based SK Hynix and Bain Capital Japan, with funding provided by the government in...
Tuesday 13 June 2017
Toppan welcomes partnership with China firms
Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...
Thursday 1 June 2017
Tsinghua Unigroup chair criticizes Qualcomm for forming JV with local chipmaker
Tsinghua Unigroup chairman Zhao Weiguo has criticized Qualcomm's intention of forming a joint venture with fabless chip firm Leadcore Technology and two local investment firms in...